Abstract: A power semiconductor module includes a substrate of planar sheet metal including a plurality of islands that are each defined by channels that extend between upper and lower surfaces of the substrate, a first semiconductor die mounted on a first one of the islands, a molded body of encapsulant that covers the metal substrate, fills the channels, and encapsulates the first semiconductor die, a hole in the molded body that extends to a recess in the upper surface of the substrate, and a press-fit connector arranged in the hole such an interior end of the press-fit connector is mechanically and electrically connected to the substrate.

Abstract: A method for user matching is provided. A matching request is received from a client. The matching request includes an application identifier and a user identifier. When the application identifier indicates that a matching mode for the matching request is an asynchronous mode, a matching queue identifier is obtained based on the matching request, the user identifier is added to a matching queue corresponding to the matching queue identifier, a predetermined number of user identifiers is selected from the matching queue, a matching result is generated that includes an identifier of a matching group of the selected predetermined number of user identifiers, and the matching result is sent to the client. The predetermined number of user identifiers includes the user identifier in the matching request.

Abstract: A power semiconductor module includes a substrate of planar sheet metal including a plurality of islands that are each defined by channels that extend between upper and lower surfaces of the substrate, a first semiconductor die mounted on a first one of the islands, a molded body of encapsulant that covers the metal substrate, fills the channels, and encapsulates the first semiconductor die, a hole in the molded body that extends to a recess in the upper surface of the substrate, and a press-fit connector arranged in the hole such an interior end of the press-fit connector is mechanically and electrically connected to the substrate.

Abstract: A method of making a semiconductor including soldering a conductor to an aluminum metallization is disclosed. In one example, the method includes substituting an aluminum oxide layer on the aluminum metallization by a substitute metal oxide layer or a substitute metal alloy oxide layer. Then, substitute metal oxides in the substitute metal oxide layer or the substitute metal alloy oxide layer are at least partly reduced. The conductor is soldered to the aluminum metallization using a solder material.

Abstract: A method of forming a power semiconductor module includes providing a substrate of planar sheet metal, forming channels in an upper surface of the substrate that partially extend through a thickness of the substrate and define a plurality of islands in the substrate, mounting a first semiconductor die on a first one of the islands, forming a molded body of encapsulant that covers the substrate, fills the channels, and encapsulates the semiconductor die, forming a hole in the molded body and a recess in the upper surface of the substrate beneath the hole, and arranging a press-fit connector in the hole and forming a mechanical and electrical connection between an interior end of the press-fit connector and the substrate.

Abstract: Methods and apparatus for processing timedly-published data are provided. After receiving an operation request for the timedly-published data, at least one of an append-file and a delete-file can be written according to the operation request. The append-file corresponds to to-be-appended timedly-published data or post-updated timedly-published data. The delete-file corresponds to to-be-deleted timedly-published data or pre-updated timedly-published data. Each of the append-file and the delete-file uses a publishing time of the timedly-published data as an index.

Abstract: A method of forming a power semiconductor module includes providing a substrate of planar sheet metal, forming channels in an upper surface of the substrate that partially extend through a thickness of the substrate and define a plurality of islands in the substrate, mounting a first semiconductor die on a first one of the islands, forming a molded body of encapsulant that covers the substrate, fills the channels, and encapsulates the semiconductor die, forming a hole in the molded body and a recess in the upper surface of the substrate beneath the hole, and arranging a press-fit connector in the hole and forming a mechanical and electrical connection between an interior end of the press-fit connector and the substrate.

Abstract: A method for user matching is provided. A matching request is received from a client. The matching request includes an application identifier and a user identifier. When the application identifier indicates that a matching mode for the matching request is an asynchronous mode, a matching queue identifier is obtained based on the matching request, the user identifier is added to a matching queue corresponding to the matching queue identifier, a predetermined number of user identifiers is selected from the matching queue, a matching result is generated that includes an identifier of a matching group of the selected predetermined number of user identifiers, and the matching result is sent to the client. The predetermined number of user identifiers includes the user identifier in the matching request.

Abstract: A method for user matching is provided. A matching request is received from a client. The matching request includes an application identifier and a user identifier. When the application identifier indicates that a matching mode for the matching request is an asynchronous mode, a matching queue identifier is obtained based on the matching request, the user identifier is added to a matching queue corresponding to the matching queue identifier, a predetermined number of user identifiers is selected from the matching queue, a matching result is generated that includes an identifier of a matching group of the selected predetermined number of user identifiers, and the matching result is sent to the client. The predetermined number of user identifiers includes the user identifier in the matching request.

Abstract: A method of making a semiconductor including soldering a conductor to an aluminum metallization is disclosed. In one example, the method includes substituting an aluminum oxide layer on the aluminum metallization by a substitute metal oxide layer or a substitute metal alloy oxide layer. Then, substitute metal oxides in the substitute metal oxide layer or the substitute metal alloy oxide layer are at least partly reduced. The conductor is soldered to the aluminum metallization using a solder material.

Abstract: A method of making a semiconductor including soldering a conductor to an aluminum metallization is disclosed. In one example, the method includes substituting an aluminum oxide layer on the aluminum metallization by a substitute metal oxide layer or a substitute metal alloy oxide layer. Then, substitute metal oxides in the substitute metal oxide layer or the substitute metal alloy oxide layer are at least partly reduced. The conductor is soldered to the aluminum metallization using a solder material.

Abstract: A method of making a semiconductor including soldering a conductor to an aluminum metallization is disclosed. In one example, the method includes substituting an aluminum oxide layer on the aluminum metallization by a substitute metal oxide layer or a substitute metal alloy oxide layer. Then, substitute metal oxides in the substitute metal oxide layer or the substitute metal alloy oxide layer are at least partly reduced. The conductor is soldered to the aluminum metallization using a solder material.

Abstract: A method for providing coated leadframes in a process line includes: feeding a plurality of leadframes successively into a process line; depositing a layer onto a main face of the leadframes; measuring physical properties of the layer by one of ellipsometry or reflectometry; assigning measured physical data to any one of a plurality of categories; and depending on a resulting category of the measured physical data, altering process parameters of the depositing, not altering the process parameters of the depositing, or shutting down the process line.

Abstract: A method of making a semiconductor including soldering a conductor to an aluminum metallization is disclosed. In one example, the method includes substituting an aluminum oxide layer on the aluminum metallization by a substitute metal oxide layer or a substitute metal alloy oxide layer. Then, substitute metal oxides in the substitute metal oxide layer or the substitute metal alloy oxide layer are at least partly reduced. The conductor is soldered to the aluminum metallization using a solder material.

Abstract: A method of making a semiconductor including soldering a conductor to an aluminum metallization is disclosed. In one example, the method includes substituting an aluminum oxide layer on the aluminum metallization by a substitute metal oxide layer or a substitute metal alloy oxide layer. Then, substitute metal oxides in the substitute metal oxide layer or the substitute metal alloy oxide layer are at least partly reduced. The conductor is soldered to the aluminum metallization using a solder material.

Abstract: A method of making a semiconductor including soldering a conductor to an aluminum metallization is disclosed. In one example, the method includes substituting an aluminum oxide layer on the aluminum metallization by a substitute metal oxide layer or a substitute metal alloy oxide layer. Then, substitute metal oxides in the substitute metal oxide layer or the substitute metal alloy oxide layer are at least partly reduced. The conductor is soldered to the aluminum metallization using a solder material.

Abstract: A method for user matching is provided. A matching request is received from a client. The matching request includes an application identifier and a user identifier. When the application identifier indicates that a matching mode for the matching request is an asynchronous mode, a matching queue identifier is obtained based on the matching request, the user identifier is added to a matching queue corresponding to the matching queue identifier, a predetermined number of user identifiers is selected from the matching queue, a matching result is generated that includes an identifier of a matching group of the selected predetermined number of user identifiers, and the matching result is sent to the client. The predetermined number of user identifiers includes the user identifier in the matching request.

Abstract: A connection member for connecting an electronic chip, wherein the connection member comprises a bulk body, and a coating at least partially coating the bulk body and comprising a material having higher electric and higher thermal conductivity than the bulk body, wherein a ratio between a thickness of the coating and a thickness of the bulk body is at least 0.0016 at at least a part of the connection member.

Abstract: A switch drive circuit for a fan processor is applied to a fan processor. The switch drive circuit includes multiple upper arm switch components, multiple lower arm switch components correspondingly electrically connected with the upper arm switch components, a first drive switch unit and a second drive switch unit. The upper arm switch components are driven by a first pulse width modulation signal and a second pulse width modulation signal. The first and second drive switch units serve to receive a third pulse width modulation signal and a high-frequency puke width modulation signal. The third pulse width modulation signal is switched between a voltage high-level state and a voltage low-level state to trigger and turn on the lower arm switch components.

Abstract: A connection member for connecting an electronic chip, wherein the connection member comprises a bulk body, and a coating at least partially coating the bulk body and comprising a material having higher electric and higher thermal conductivity than the bulk body, wherein a ratio between a thickness of the coating and a thickness of the bulk body is at least 0.0016 at at least a part of the connection member.