Abstract: An information handling system may include at least one processor and a memory. The information handling system may be configured to: receive a request to perform a management operation on a target information handling system, wherein the request is received from a mobile device via a mobile network, and wherein the request includes data retrieved from a visual identifier associated with the target information handling system; and perform the management operation by communicating with the target information handling system via a management network other than the mobile network.

Abstract: A wear monitoring method of a polymer thrust bearing based on an ultrasonic reflection coefficient amplitude spectrum (URCAS), includes: selecting a corresponding delay block probe based on a material of a to-be-tested bearing, and setting corresponding parameters of a pulse generator; after collecting a primary echo from a surface of the delay block probe as a reference signal, placing the delay block probe in a designated region on a back of the to-be-tested bearing, and collecting time-domain echo signals from upper and lower surfaces of the bearing; establishing a propagation model of an ultrasonic signal in a polymer bearing, and calculating a theoretical URCAS based on the propagation model; calculating a measured URCAS; and constructing an objective function, and solving the objective function by using a differential evolution algorithm. A plurality of parameters of the polymer bearing is solved to meet a requirement for wear monitoring by adopting the method.

Abstract: Apparatus and methods for deployment of fixtures. The apparatus may include a system for controlling deployed fixtures. The system may receive user commands different devices in different formats. The fixtures may be independently addressable. The fixtures may be magnetically supported by a fixture support. A brace may join two or more fixture supports without reducing space available to support fixtures. The brace may join a fixture support to a fixture support accessory. An accessory may include a variable-angle junction. The fixture may include articulating joints for controlling the direction of a beam. The fixture may include a lens having an electrically controllable beam spread angle. The fixture may be stowable in the fixture support. The fixture may be slidable along a cord to adjust a height of the fixture. The fixture may include an extendable ring. The system may coordinate motions of the fixtures to follow a target. The fixture may include an elongated board.

Abstract: A system, method, and computer program product for determining the cause of a battery condition, such as a thermal runaway event, are provided. An example battery safety evaluation system may include a battery having a housing and an interior battery compartment. The battery safety evaluation system may include internal sensing elements attached to the interior battery compartment and configured to capture data representative of an internal battery condition event. The battery safety evaluation system may further include an external sensing element attached to the battery housing and configured to capture data representative of an external battery condition event. In addition, the battery safety evaluation system may include a controller for determining a cause of the battery condition based at least in part on a time sequence of events generated from the internal data captured by the internal sensing element and the external data captured by the external sensing element.

Abstract: Apparatus and methods for deployment of fixtures. The apparatus may include a system for controlling deployed fixtures. The system may receive user commands different devices in different formats. The fixtures may be independently addressable. The fixtures may be magnetically supported by a fixture support. A brace may join two or more fixture supports without reducing space available to support fixtures. The brace may join a fixture support to a fixture support accessory. An accessory may include a variable-angle junction. The fixture may include articulating joints for controlling the direction of a beam. The fixture may include a lens having an electrically controllable beam spread angle. The fixture may be stowable in the fixture support. The fixture may be slidable along a cord to adjust a height of the fixture. The fixture may include an extendable ring. The system may coordinate motions of the fixtures to follow a target. The fixture may include an elongated board.

Abstract: A method for user matching is provided. A matching request is received from a client. The matching request includes an application identifier and a user identifier. When the application identifier indicates that a matching mode for the matching request is an asynchronous mode, a matching queue identifier is obtained based on the matching request, the user identifier is added to a matching queue corresponding to the matching queue identifier, a predetermined number of user identifiers is selected from the matching queue, a matching result is generated that includes an identifier of a matching group of the selected predetermined number of user identifiers, and the matching result is sent to the client. The predetermined number of user identifiers includes the user identifier in the matching request.

Abstract: A power semiconductor module includes a substrate of planar sheet metal including a plurality of islands that are each defined by channels that extend between upper and lower surfaces of the substrate, a first semiconductor die mounted on a first one of the islands, a molded body of encapsulant that covers the metal substrate, fills the channels, and encapsulates the first semiconductor die, a hole in the molded body that extends to a recess in the upper surface of the substrate, and a press-fit connector arranged in the hole such an interior end of the press-fit connector is mechanically and electrically connected to the substrate.

Abstract: A method of making a semiconductor including soldering a conductor to an aluminum metallization is disclosed. In one example, the method includes substituting an aluminum oxide layer on the aluminum metallization by a substitute metal oxide layer or a substitute metal alloy oxide layer. Then, substitute metal oxides in the substitute metal oxide layer or the substitute metal alloy oxide layer are at least partly reduced. The conductor is soldered to the aluminum metallization using a solder material.

Abstract: A method of forming a power semiconductor module includes providing a substrate of planar sheet metal, forming channels in an upper surface of the substrate that partially extend through a thickness of the substrate and define a plurality of islands in the substrate, mounting a first semiconductor die on a first one of the islands, forming a molded body of encapsulant that covers the substrate, fills the channels, and encapsulates the semiconductor die, forming a hole in the molded body and a recess in the upper surface of the substrate beneath the hole, and arranging a press-fit connector in the hole and forming a mechanical and electrical connection between an interior end of the press-fit connector and the substrate.

Abstract: Methods and apparatus for processing timedly-published data are provided. After receiving an operation request for the timedly-published data, at least one of an append-file and a delete-file can be written according to the operation request. The append-file corresponds to to-be-appended timedly-published data or post-updated timedly-published data. The delete-file corresponds to to-be-deleted timedly-published data or pre-updated timedly-published data. Each of the append-file and the delete-file uses a publishing time of the timedly-published data as an index.

Abstract: A method of forming a power semiconductor module includes providing a substrate of planar sheet metal, forming channels in an upper surface of the substrate that partially extend through a thickness of the substrate and define a plurality of islands in the substrate, mounting a first semiconductor die on a first one of the islands, forming a molded body of encapsulant that covers the substrate, fills the channels, and encapsulates the semiconductor die, forming a hole in the molded body and a recess in the upper surface of the substrate beneath the hole, and arranging a press-fit connector in the hole and forming a mechanical and electrical connection between an interior end of the press-fit connector and the substrate.

Abstract: A method for user matching is provided. A matching request is received from a client. The matching request includes an application identifier and a user identifier. When the application identifier indicates that a matching mode for the matching request is an asynchronous mode, a matching queue identifier is obtained based on the matching request, the user identifier is added to a matching queue corresponding to the matching queue identifier, a predetermined number of user identifiers is selected from the matching queue, a matching result is generated that includes an identifier of a matching group of the selected predetermined number of user identifiers, and the matching result is sent to the client. The predetermined number of user identifiers includes the user identifier in the matching request.

Abstract: A method for user matching is provided. A matching request is received from a client. The matching request includes an application identifier and a user identifier. When the application identifier indicates that a matching mode for the matching request is an asynchronous mode, a matching queue identifier is obtained based on the matching request, the user identifier is added to a matching queue corresponding to the matching queue identifier, a predetermined number of user identifiers is selected from the matching queue, a matching result is generated that includes an identifier of a matching group of the selected predetermined number of user identifiers, and the matching result is sent to the client. The predetermined number of user identifiers includes the user identifier in the matching request.

Abstract: A method of making a semiconductor including soldering a conductor to an aluminum metallization is disclosed. In one example, the method includes substituting an aluminum oxide layer on the aluminum metallization by a substitute metal oxide layer or a substitute metal alloy oxide layer. Then, substitute metal oxides in the substitute metal oxide layer or the substitute metal alloy oxide layer are at least partly reduced. The conductor is soldered to the aluminum metallization using a solder material.

Abstract: A method of making a semiconductor including soldering a conductor to an aluminum metallization is disclosed. In one example, the method includes substituting an aluminum oxide layer on the aluminum metallization by a substitute metal oxide layer or a substitute metal alloy oxide layer. Then, substitute metal oxides in the substitute metal oxide layer or the substitute metal alloy oxide layer are at least partly reduced. The conductor is soldered to the aluminum metallization using a solder material.

Abstract: A method of making a semiconductor including soldering a conductor to an aluminum metallization is disclosed. In one example, the method includes substituting an aluminum oxide layer on the aluminum metallization by a substitute metal oxide layer or a substitute metal alloy oxide layer. Then, substitute metal oxides in the substitute metal oxide layer or the substitute metal alloy oxide layer are at least partly reduced. The conductor is soldered to the aluminum metallization using a solder material.

Abstract: A method for providing coated leadframes in a process line includes: feeding a plurality of leadframes successively into a process line; depositing a layer onto a main face of the leadframes; measuring physical properties of the layer by one of ellipsometry or reflectometry; assigning measured physical data to any one of a plurality of categories; and depending on a resulting category of the measured physical data, altering process parameters of the depositing, not altering the process parameters of the depositing, or shutting down the process line.

Abstract: A method of making a semiconductor including soldering a conductor to an aluminum metallization is disclosed. In one example, the method includes substituting an aluminum oxide layer on the aluminum metallization by a substitute metal oxide layer or a substitute metal alloy oxide layer. Then, substitute metal oxides in the substitute metal oxide layer or the substitute metal alloy oxide layer are at least partly reduced. The conductor is soldered to the aluminum metallization using a solder material.

Abstract: A method of making a semiconductor including soldering a conductor to an aluminum metallization is disclosed. In one example, the method includes substituting an aluminum oxide layer on the aluminum metallization by a substitute metal oxide layer or a substitute metal alloy oxide layer. Then, substitute metal oxides in the substitute metal oxide layer or the substitute metal alloy oxide layer are at least partly reduced. The conductor is soldered to the aluminum metallization using a solder material.

Abstract: A method of making a semiconductor including soldering a conductor to an aluminum metallization is disclosed. In one example, the method includes substituting an aluminum oxide layer on the aluminum metallization by a substitute metal oxide layer or a substitute metal alloy oxide layer. Then, substitute metal oxides in the substitute metal oxide layer or the substitute metal alloy oxide layer are at least partly reduced. The conductor is soldered to the aluminum metallization using a solder material.