Abstract: A leadframe for a semiconductor package and a semiconductor package manufactured from such a leadframe including a plurality of connection leads supported in a frame. A die mounting plate is centrally located in the leadframe and is supported by a plurality of support leads with each support lead electrically connected to the die mounting pad and extending in a direction outwardly therefrom towards the frame. Each support lead is formed with a connection pad portion and a down set link portion. Each connection pad portion is spaced from the die mounting plate and is designed for connection to a conductive bonding ground wire from a semiconductor device mounted on the die mounting plate. Each down set link portion is electrically connected to the die mounting pad and is arranged to support the die mounting pad in a spaced arrangement from the connection leads. The connection pad portion and the down set link portion overlap, in the direction of extension of the support lead.