Patents by Inventor WU SHEN
WU SHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10009167Abstract: A device, a circuit and a method are disclosed herein. The device includes a data receiving circuit and an oscillating signal generator. The data receiving circuit is configured to output a first output signal, a second output signal, and a phase error signal according to an oscillating signal and a modulated signal, in which the phase error signal indicates a phase difference between the oscillating signal and the modulated signal. The oscillating signal generator is configured to delay a phase of a first reference signal according to the phase error signal, to generate the oscillating signal.Type: GrantFiled: November 11, 2015Date of Patent: June 26, 2018Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Huan-Neng Chen, William Wu Shen, Lan-Chou Cho, Feng-Wei Kuo, Chewn-Pu Jou
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Patent number: 10003455Abstract: A carrier generator includes a phase accumulator configured to generate a phase reference signal based on a frequency command word (FCW) signal, a time to digital converter (TDC) configured to generate a feedback signal based on a divided signal, a loop filter configured to generate a filtered command signal based on the phase reference signal and the feedback signal, and a plurality of tuning arrangements. Each tuning arrangement includes an oscillator configured to receive the filtered command signal and output an adjustment signal, and is configured to output a carrier signal of a corresponding plurality of carrier signals based on the adjustment signal. The divided signal is based on the adjustment signal of a first tuning arrangement.Type: GrantFiled: April 13, 2017Date of Patent: June 19, 2018Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Feng Wei Kuo, Chewn-Pu Jou, Huan-Neng Chen, Lan-Chou Cho, William Wu Shen
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Patent number: 9991917Abstract: A demodulator is configured to demodulate a modulated signal responsive to a first carrier signal. The demodulator includes a filter and a bandwidth adjusting circuit. The filter is configured to filter a first signal. The first signal is a product of the first carrier signal and the modulated signal. The filter has a bandwidth adjusted based on a set of control signals. The bandwidth adjusting circuit is coupled to the filter, and configured to generate the set of control signals based on at least a frequency of the filtered first signal and a frequency of the first signal. The bandwidth adjusting circuit includes a frequency detector configured to generate a second signal based on a frequency relationship between the frequency of the filtered first signal and the frequency of the first signal.Type: GrantFiled: January 27, 2017Date of Patent: June 5, 2018Assignee: TAIWANT SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Feng Wei Kuo, William Wu Shen, Chewn-Pu Jou, Huan-Neng Chen, Lan-Chou Cho
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Patent number: 9985687Abstract: A communication system includes a carrier generator, a first modulation circuit, a pulse generator, a first transmission line, and a second transmission line. The carrier generator is configured to generate a first carrier signal and a reference clock signal. The first modulation circuit is coupled to the carrier generator, and configured to generate a first modulated signal based on a first data signal and the first carrier signal. The pulse generator is coupled to the carrier generator, and configured to generate a pulse train signal based on the reference clock signal. The first transmission line is configured to carry the modulated signal, and configured to cause a delay to the first modulated signal. The second transmission line is coupled to the pulse generator, configured to carry the pulse train signal, and configured to cause a delay to the pulse train signal.Type: GrantFiled: March 22, 2017Date of Patent: May 29, 2018Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Huan-Neng Chen, Chewn-Pu Jou, Feng Wei Kuo, Lan-Chou Cho, William Wu Shen
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Patent number: 9887863Abstract: A transceiver group includes a plurality of transceivers; wherein the transceiver group performs transmission and receiving through a wire, and each of the transceivers includes a transmitter and a receiver, and the transmitter includes: a carrier generator arranged to generate a plurality of carriers having different frequencies for a plurality of data streams to be transmitted; a modulator, coupled to the data streams to be transmitted and the carrier generator, to generate a plurality of modulated data streams carried on the plurality of carriers; and a summer arranged to merge the plurality of modulated data streams to an output signal to the wire; and the receiver includes: a carrier generator arranged to generate a plurality of carriers having different frequencies for an input signal received from the wire; and a demodulator, coupled to the input signal and the carrier generator, to generate a plurality of demodulated data streams.Type: GrantFiled: October 16, 2015Date of Patent: February 6, 2018Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Huan-Neng Chen, William Wu Shen, Lan-Chou Cho, Feng Wei Kuo, Chewn-Pu Jou, Tze-Chiang Huang, Jack Liu, Yun-Han Lee
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Publication number: 20180012799Abstract: Some embodiments relate to a semiconductor module having an integrated antenna structure. The semiconductor module has an excitable element and a first ground plane disposed between a substrate and the excitable element. A second ground plane is separated from the first ground plane by the substrate. The second ground plane is coupled to the first ground plane by one or more through-substrate vias (TSVs) that extend through the substrate.Type: ApplicationFiled: September 20, 2017Publication date: January 11, 2018Inventors: Bo-Jr Huang, William Wu Shen, Chin-Her Chien, Chin-Chou Liu, Yun-Han Lee
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Publication number: 20180006682Abstract: A communication system includes a demodulator configured to demodulate a modulated signal responsive to a first carrier signal. The demodulator includes a filter and a gain adjusting circuit. The filter is configured to generate a filtered first signal based on a first signal. The first signal is a product of the first carrier signal and the modulated signal. The filter has a gain adjusted based on a set of control signals. The gain adjusting circuit is coupled to the filter, and is configured to generate the set of control signals based on at least a voltage of the filtered first signal. The gain adjusting circuit includes a first peak detector coupled to the filter. The first peak detector is configured to output a peak value of the voltage of the filtered first signal.Type: ApplicationFiled: September 14, 2017Publication date: January 4, 2018Inventors: Feng Wei KUO, William Wu SHEN, Chewn-Pu JOU, Huan-Neng CHEN, Lan-Chou CHO
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Publication number: 20170373714Abstract: Systems and methods for die-to-die communication are provided. A first transceiver disposed on a first die includes a transmission section configured to modulate first data onto a carrier signal having a first frequency. The first transceiver includes a reception section configured to receive signals from a transmission line. The reception section includes a filter configured to pass frequencies within a first passband that includes a second frequency. The first frequency is outside of the first passband. A second transceiver is disposed on a second die and is configured to communicate with the first transceiver via the transmission line. The second transceiver includes a transmission section configured to modulate second data onto a carrier signal having the second frequency. The second transceiver includes a reception section including a filter configured to pass frequencies within a second passband that includes the first frequency. The second frequency is outside of the second passband.Type: ApplicationFiled: June 28, 2016Publication date: December 28, 2017Inventors: Huan-Neng Chen, Chewn-Pu Jou, Feng-Wei Kuo, Lan-Chou Cho, William Wu Shen
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Publication number: 20170360209Abstract: A foldable electric bed comprises a front frame, a rear frame and several pieces of bed boards. The front frame is provided with a front base which is fixedly provided with a front supporting part used for supporting the bed boards arranged at the front frame. The rear frame is provided with a rear base which is fixedly provided with a rear supporting part used for supporting the bed boards arranged at the rear frame. The front base and the rear base are articulated at an articulating shaft through a connector and an axle pin, such that the front frame and the rear frame are able to fold between an unfolded position and a folded position in relation to each other. At the unfolded position, the front frame and the rear frame are adjacent to each other along the horizontal direction.Type: ApplicationFiled: June 20, 2017Publication date: December 21, 2017Applicant: CHANGZHOU YUFENG FURNITURE COMPANY LIMITEDInventors: JIE ZHOU, WU SHEN, CHULAI MAO
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Patent number: 9847320Abstract: A semiconductor device is disclosed. The semiconductor device includes: a first die including a signal pad region and a power pad region; a redistribution layer (RDL) over the first die; a plurality of first connectors over the RDL and at a side of the RDL opposite to the first die; a plurality of second connectors over the RDL and at the side opposite to the first die; a second die including a signal pad region and a power pad region, wherein the second die is face-to-face and electrically connected to the first die through the first connectors and the RDL, wherein a center of the second die is laterally shifted with respect to a center of the first die so as to correspond the signal pad region of the first die to the signal pad region of the second die. An associated method for fabricating the same is also disclosed.Type: GrantFiled: June 3, 2016Date of Patent: December 19, 2017Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Chien Hsun Chen, William Wu Shen, Jiun Yi Wu, Chien Hsun Lee
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Publication number: 20170317774Abstract: A phase locked loop (PLL) for a carrier generator includes a front-end circuit that receives a frequency reference signal and generates a control signal based on the frequency reference signal and a feedback signal. A demultiplexer selectively outputs the control signal to a plurality of tuning arrangements. The plurality of tuning arrangements includes a first tuning arrangement that generates a first carrier signal based on the control signal and a second tuning arrangement that generates a second carrier signal based on the control signal. A multiplexer outputs the feedback signal based on the first carrier signal and the second carrier signal.Type: ApplicationFiled: July 20, 2017Publication date: November 2, 2017Inventors: Feng Wei KUO, Chewn-Pu JOU, Huan-Neng CHEN, Lan-Chou CHO, William Wu SHEN
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Patent number: 9779990Abstract: Some embodiments relate to a semiconductor module comprising a low-cost integrated antenna that uses a conductive backside structure in conjunction with a ground metal layer to form a large ground plane with a small silicon area. In some embodiments, the integrated antenna structure has an excitable element that radiates electromagnetic radiation. An on-chip ground plane, located on a first side of an interposer substrate, is positioned below the excitable element. A compensation ground plane, located on an opposing side of the interposer substrate, is connected to the ground plane by one or more through-silicon vias (TSVs) that extend through the interposer substrate. The on-chip ground plane and the compensation ground collectively act to reflect the electromagnetic radiation generated by the excitable element, so that the compensation ground improves the performance of the on-chip ground plane.Type: GrantFiled: February 27, 2013Date of Patent: October 3, 2017Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Bo-Jr Huang, William Wu Shen, Chin-Her Chien, Chin-Chou Liu, Yun-Han Lee
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Publication number: 20170278806Abstract: A semiconductor package includes a first semiconductor device, a second semiconductor device vertically positioned above the first semiconductor device, and a ground shielded transmission path. The ground shielded transmission path couples the first semiconductor device to the second semiconductor device. The ground shielded transmission path includes a first signal path extending longitudinally between a first end and a second end. The first signal path includes a conductive material. A first insulating layer is disposed over the signal path longitudinally between the first end and the second end. The first insulating layer includes an electrically insulating material. A ground shielding layer is disposed over the insulating material longitudinally between the first end and the second end of the signal path. The ground shielding layer includes a conductive material coupled to ground.Type: ApplicationFiled: March 22, 2016Publication date: September 28, 2017Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Feng Wei KUO, Wen-Shiang LIAO, Chewn-Pu JOU, Huan-Neng CHEN, Lan-Chou CHO, William Wu SHEN
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Patent number: 9768828Abstract: A communication system includes a carrier generator configured to generate a first carrier signal and a demodulator configured to demodulate a modulated signal responsive to the first carrier signal. The demodulator includes a filter and a gain adjusting circuit. The filter is configured to filter a first signal. The first signal is a product of the first carrier signal and the modulated signal. The filter has a first cutoff frequency and a gain. The gain of the filter is controlled by a set of control signals. The gain adjusting circuit is configured to adjust the gain of the filter based on a voltage of the filtered first signal or a voltage of a second signal. The adjustable gain circuit is configured to generate the set of control signals.Type: GrantFiled: December 15, 2015Date of Patent: September 19, 2017Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Feng Wei Kuo, William Wu Shen, Chewn-Pu Jou, Huan-Neng Chen, Lan-Chou Cho
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Publication number: 20170263588Abstract: A semiconductor device is disclosed. The semiconductor device includes: a first die including a signal pad region and a power pad region; a redistribution layer (RDL) over the first die; a plurality of first connectors over the RDL and at a side of the RDL opposite to the first die; a plurality of second connectors over the RDL and at the side opposite to the first die; a second die including a signal pad region and a power pad region, wherein the second die is face-to-face and electrically connected to the first die through the first connectors and the RDL, wherein a center of the second die is laterally shifted with respect to a center of the first die so as to correspond the signal pad region of the first die to the signal pad region of the second die. An associated method for fabricating the same is also disclosed.Type: ApplicationFiled: June 3, 2016Publication date: September 14, 2017Inventors: CHIEN HSUN CHEN, WILLIAM WU SHEN, JIUN YI WU, CHIEN HSUN LEE
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Patent number: 9735904Abstract: A transmitter for a radio frequency interconnect (RFI) includes a carrier generator configured to generate a clock recovery signal, and to transmit the clock recovery signal to a receiver. The carrier generator includes a first tuning arrangement configured to receive a first signal and to generate a first carrier signal based on the first signal. The carrier generator includes a second tuning arrangement configured to receive a second signal different from the first signal, and to generate a second carrier signal based on the second signal. The transmitter includes a first modulator configured to generate a first modulated data signal. The transmitter further includes a second modulator configured to generate a second modulated data signal. The transmitter includes an output configured to selectively transmit the first modulated data signal and the second modulated data signal to the receiver.Type: GrantFiled: December 15, 2015Date of Patent: August 15, 2017Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Feng Wei Kuo, Chewn-Pu Jou, Huan-Neng Chen, Lan-Chou Cho, Willaim Wu Shen
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Publication number: 20170222795Abstract: A carrier generator includes a phase accumulator configured to generate a phase reference signal based on a frequency command word (FCW) signal, a time to digital converter (TDC) configured to generate a feedback signal based on a divided signal, a loop filter configured to generate a filtered command signal based on the phase reference signal and the feedback signal, and a plurality of tuning arrangements. Each tuning arrangement includes an oscillator configured to receive the filtered command signal and output an adjustment signal, and is configured to output a carrier signal of a corresponding plurality of carrier signals based on the adjustment signal. The divided signal is based on the adjustment signal of a first tuning arrangement.Type: ApplicationFiled: April 13, 2017Publication date: August 3, 2017Inventors: Feng Wei KUO, Chewn-Pu JOU, Huan-Neng CHEN, Lan-Chou CHO, William Wu SHEN
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Publication number: 20170214431Abstract: A communication system includes a carrier generator, a first modulation circuit, a pulse generator, a first transmission line, and a second transmission line. The carrier generator is configured to generate a first carrier signal and a reference clock signal. The first modulation circuit is coupled to the carrier generator, and configured to generate a first modulated signal based on a first data signal and the first carrier signal. The pulse generator is coupled to the carrier generator, and configured to generate a pulse train signal based on the reference clock signal. The first transmission line is configured to carry the modulated signal, and configured to cause a delay to the first modulated signal. The second transmission line is coupled to the pulse generator, configured to carry the pulse train signal, and configured to cause a delay to the pulse train signal.Type: ApplicationFiled: March 22, 2017Publication date: July 27, 2017Inventors: Huan-Neng CHEN, Chewn-Pu JOU, Feng Wei KUO, Lan-Chou CHO, William Wu SHEN
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Publication number: 20170195068Abstract: A radio frequency interconnect (RFI) includes a transmitter side connected to a first end of a channel, a receiver side connected to a second end of the channel opposite the first end and a calibration system. The receiver side includes at least one of the following configurations: (a) at least one gain control amplifier (GCA) or at least one analog to digital converter (ADC). The calibration system is configured to transmit a predetermined data set through the channel, receive an output from the at least one ADC or the at least one GCA, and calibrate the at least one ADC or the at least one GCA based on a measured data set. The output includes the measured data set based on the predetermined data set transmitted through channel.Type: ApplicationFiled: December 30, 2015Publication date: July 6, 2017Inventors: Lan-Chou CHO, William Wu SHEN, Feng Wei KUO, Huan-Neng CHEN
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Publication number: 20170170920Abstract: A transmitter for a radio frequency interconnect (RFI) includes a carrier generator configured to generate a clock recovery signal, and to transmit the clock recovery signal to a receiver. The carrier generator includes a first tuning arrangement configured to receive a first signal and to generate a first carrier signal based on the first signal. The carrier generator includes a second tuning arrangement configured to receive a second signal different from the first signal, and to generate a second carrier signal based on the second signal. The transmitter includes a first modulator configured to generate a first modulated data signal. The transmitter further includes a second modulator configured to generate a second modulated data signal. The transmitter includes an output configured to selectively transmit the first modulated data signal and the second modulated data signal to the receiver.Type: ApplicationFiled: December 15, 2015Publication date: June 15, 2017Inventors: Feng Wei KUO, Chewn-Pu JOU, Huan-Neng CHEN, Lan-Chou CHO, Willaim Wu SHEN