Abstract: A thin-film storage transistor includes (a) first and second polysilicon layers of a first conductivity serving, respectively, as a source terminal and a drain terminal of the thin-film storage transistor; (b) a third polysilicon layer of a second conductivity adjacent the first and second polysilicon layers, serving as a channel region of the thin-film storage transistor; (c) a conductor serving as a gate terminal of the thin-film storage transistor; and (d) a charge-trapping region between the conductor and third polysilicon layer, wherein a fourth body layer polysilicon of the second conductivity is included to provide an alternative source of free charge careers to accelerate device operation.

Abstract: A process for manufacturing a 3-dimensional memory structure includes: (a) providing one or more active layers over a planar surface of a semiconductor substrate, each active layer comprising (i) first and second semiconductor layers of a first conductivity; (ii) a dielectric layer separating the first and second semiconductor layer; and (ii) one or more sacrificial layers, at least one of sacrificial layers being adjacent the first semiconductor layer; (b) etching the active layers to create a plurality of active stacks and a first set of trenches each separating and exposing sidewalls of adjacent active stacks; (c) filling the first set of trenches by a silicon oxide; (d) patterning and etching the silicon oxide to create silicon oxide columns each abutting adjacent active stacks and to expose portions of one or more sidewalls of the active stacks; (e) removing the sacrificial layers from exposed portions of the sidewalls by isotropic etching through the exposed portions of the sidewalls of the active stack

Abstract: A method to ease the fabrication of high aspect ratio three dimensional memory structures for memory cells with feature sizes of 20 nm or less, or with a high number of memory layers. The present invention also provides an improved isolation between adjacent memory cells along the same or opposite sides of an active strip. The improved isolation is provided by introducing a strong dielectric barrier film between adjacent memory cells along the same side of an active strip, and by staggering memory cells of opposite sides of the active strip.

Abstract: A method addresses low cost, low resistance metal interconnects and mechanical stability in a high aspect ratio structure. According to the various implementations disclosed herein, a replacement metal process, which defers the need for a metal etching step in the fabrication process until after all patterned photoresist is no longer present. Under this process, the conductive sublayers may be both thick and numerous.

Abstract: A memory structure formed above a semiconductor substrate includes two or more modules each formed on top of each other separated by a layer of global interconnect conductors. Each memory module may include a 3-dimensional array of memory transistors organized as NOR array strings. Each 3-dimensional array of memory transistors is provided vertical local word lines as gate electrodes to the memory transistors. These vertical local word lines are connected by the layers of global interconnect conductors below and above the 3-dimensional array of memory transistors to circuitry formed in the semiconductor substrate.

Abstract: A switch device structure serves to help in stably moving an operation rod. The switch device includes a contact fixing support assembled with an insulation case. The fixing support is formed with multiple openings. A connection board and multiple support members are correspondingly assembled in the openings. The support member has a base section and a neck section, which together define a passage. The operation rod is assembled with an elastic unit and can pass through the passage and the connection board to extend into the fixing support so as to move a wire connection assembly in the case. The switch device structure improves the shortcoming of the conventional switch device that the operation rod is apt to shake and deflect.

Abstract: A switch device structure serves to help in stably moving an operation rod. The switch device includes a contact fixing support assembled with an insulation case. The fixing support is formed with multiple openings. A connection board and multiple support members are correspondingly assembled in the openings. The support member has a base section and a neck section, which together define a passage. The operation rod is assembled with an elastic unit and can pass through the passage and the connection board to extend into the fixing support so as to move a wire connection assembly in the case. The switch device structure improves the shortcoming of the conventional switch device that the operation rod is apt to shake and deflect.

Abstract: A switch device structure includes at least one contact seat having a first end wall, a second end wall, two sidewalls, an upper section and a bottom section to together define a cavity for arranging a contact assembly. Each of the first and second end walls of the contact seat has a protruding assembling section and an oblique socket directed to the assembling section. The switch device structure includes a contact support equipped with a fixing board. The contact support is formed with latch sections detachably latched with the assembling sections. An operator can use a tool to directly pass through the oblique socket to unlatch the latch section from the assembling section to quickly install/uninstall the contact seat and the contact support. This solves the problem of the conventional switch device that it is troublesome and time-consuming to install/uninstall the contact seat and the contact support.

Abstract: A switch device structure includes at least one contact seat having a first end wall, a second end wall, two sidewalls, an upper section and a bottom section to together define a cavity for arranging a contact assembly. Each of the first and second end walls of the contact seat has a protruding assembling section and an oblique socket directed to the assembling section. The switch device structure includes a contact support equipped with a fixing board. The contact support is formed with latch sections detachably latched with the assembling sections. An operator can use a tool to directly pass through the oblique socket to unlatch the latch section from the assembling section to quickly install/uninstall the contact seat and the contact support. This solves the problem of the conventional switch device that it is troublesome and time-consuming to install/uninstall the contact seat and the contact support.

Abstract: A flexible printed circuit board (FPCB) includes a main portion and a number of interfaces connected to the main portion. The main portion incorporates a low-voltage differential signal (LVDS) cable and at least one function cable. The main portion includes a first connecting strip, a second connecting strip, and a third connecting strip, which are all connected together at one end. The interfaces includes a first interface connected to the first connecting strip, a second interface connected to the second connecting strip, and a third interface connected to the third connecting strip. The first interface incorporates a LVDS interface and a function module interface. The second interface is a LVDS interface. The third interface is a function module interface.

Abstract: In some aspects, a method of fabricating a memory cell is provided that includes fabricating a steering element above a substrate, and fabricating a reversible-resistance switching element coupled to the steering element by selectively fabricating carbon nano-tube (“CNT”) material above the substrate, wherein the CNT material comprises a single CNT. Numerous other aspects are provided.

Abstract: A metallic shell includes a metal layer having an outer surface. The outer surface defines at least one engraving portion. Each engraving portion includes a base portion and a sidewall connected between the outer surface and the base portion. The metallic shell further includes a protective layer with a first color. The protective layer coats the outer surface and the base portion. A second antioxidation coating with a second color different from the first color is coated on the sidewall of the at least one engraving portion. A method for etching a pattern on a metallic shell is also provided.

Abstract: A flexible printed circuit board (FPCB) includes a main portion and a number of interfaces connected to the main portion. The main portion incorporates a low-voltage differential signal (LVDS) cable and at least one function cable. The main portion includes a first connecting strip, a second connecting strip, and a third connecting strip, which are all connected together at one end. The interfaces includes a first interface connected to the first connecting strip, a second interface connected to the second connecting strip, and a third interface connected to the third connecting strip. The first interface incorporates a LVDS interface and a function module interface. The second interface is a LVDS interface. The third interface is a function module interface.

Abstract: In some aspects, a method of fabricating a memory cell is provided that includes fabricating a steering element above a substrate, and fabricating a reversible-resistance switching element coupled to the steering element by selectively fabricating carbon nano-tube (“CNT”) material above the substrate, wherein the CNT material comprises a single CNT. Numerous other aspects are provided.

Abstract: A belt (1) for tying a number of cables is provided. The belt includes a flexible strip body (10) adapted to encircle said plurality cables, and a head forming an elastic hook (20) having a receiving portion and a latching arm (21) close to the flexible strip body (10). The latching arm (21) is flexible to be opened from the strip body (10) when a part of the cables slides into the receiving portion and then to be closed due to an elasticity of the hook (20).

Abstract: A die sucking module comprises a holder, a sucking head arranged below the holder and used to suck a die, and two pressing structures respectively arranged below the holder and at two sides of the sucking head. Each pressing structure further comprises a pressing head pressing against an adjacent die when the sucking head sucks a die; and an elastic element providing resilience to implement the function of the pressing head. The present invention can prevent from the double-die problem and promote the yield of the die-bond process.

Abstract: A hardwood floor structure includes a piece of sponge, a plurality of plastic E-shaped racks with apertures and ribs extending upward, and a plurality of rectangular floor boards composed of an upper portion, an intermediate portion having a protruding flange extending from two adjacent lateral sides and a recess on another two adjacent lateral sides such that the protruding flange is configured and sized to engage with said recess, and a lower portion having an inclined upper edge along a longitudinal side, an inclined lower edge along another longitudinal side, and a shoulder above the inclined lower edge. The ribs on the E-shaped racks have an enlarged head with an inclined surface forming a lower projection to be positioned on the shoulder of a respective one of said floor board. The rib has an upper projection at the other side to be positioned on the inclined upper edge of a respective floor board.

Abstract: An improvement in the structure of a hardwood floor includes a piece of sponge, a plurality of floor boards each being a generally rectangular member composed of an upper portion, an intermediate portion and a lower portion, said upper portion having a top surface for walking, said intermediate portion having a protruded flange extending outwardly from two adjacent lateral sides thereof and a recess on another two adjacent lateral sides thereof, said protruded flange being configured and sized to engage with said recess, said lower portion having an inclined upper edge along a longitudinal side thereof, an inclined lower edge along another longitudinal side thereof, and a shoulder above said inclined lower edge, a plurality of plastic racks with an E-shaped cross section having a plurality of ribs extending upwardly from a top thereof, each of said ribs having an enlarged head with an inclined surface thereby forming a lower projection at one side adapted to be positioned on said shoulder of a respective one