Abstract: A substrate processing system includes a source unit configured to supply a deposition material to a substrate, a substrate holder configured to hold a substrate to receive the deposition material, a shadow mask comprising a frame that includes two opposing arms; and a crossbar configured to be mounted to the two opposing arms. The frame and the crossbar define a plurality of openings that allow the deposition material supplied by the source unit to be deposited on the substrate. A transport mechanism can produce relative movement between the shadow mask and the substrate.

Abstract: A method for substrate processing includes producing a magnetic field by a magnetron across the full width of a sputtering surface of a target in a first direction. The magnetron can produce two erosion grooves separated by a distance S on the sputtering surface. The method includes moving the magnetron continuously at a first speed by the distance S in a first segment along a linear travel path. The linear travel path is along a second direction perpendicular to the first direction. The method includes continuously sputtering a material off the sputtering surface and depositing the material on the substrate during the first segment, and moving the magnetron by the distance S in a second segment along the linear travel path at a second speed higher than the first speed without sputtering the material off the sputtering surface or sputtering materials off at significant lower rate.

Abstract: A substrate processing system includes a source unit configured to supply a deposition material to a substrate, a substrate holder configured to hold a substrate to receive the deposition material, a shadow mask comprising a frame that includes two opposing arms; and a crossbar configured to be mounted to the two opposing arms. The frame and the crossbar define a plurality of openings that allow the deposition material supplied by the source unit to be deposited on the substrate. A transport mechanism can produce relative movement between the shadow mask and the substrate.

Abstract: The present invention relates to hydrogenated nitrile rubber polymers having lower molecular weights and narrower molecular weight distributions than those known in the art.

Abstract: The present invention relates to the process for preparing hydrogenated nitrile rubber polymers having lower molecular weights and narrower molecular weight distributions than those known in the art.

Abstract: A substrate processing system includes a first load lock, a process chamber having a first opening to allow an exchange of a substrate between the first load lock and the first process chamber, first rollers in the process chamber; and second rollers in the first load lock, wherein the first rollers and the second rollers are configured to transport a substrate thereon through the first opening between the first load lock and the process chamber. At least some of the first rollers and the second rollers are idler rollers.

Abstract: A substrate processing system includes a first load lock, a process chamber having a first opening to allow an exchange of a substrate between the first load lock and the first process chamber, first rollers in the process chamber; and second rollers in the first load lock, wherein the first rollers and the second rollers are configured to transport a substrate thereon through the first opening between the first load lock and the process chamber. The first rollers and the second rollers are not rotated by an active transport mechanism.

Abstract: The present invention relates to hydrogenated nitrile rubber polymers having lower molecular weights and narrower molecular weight distributions than those known in the art.

Abstract: The present invention relates to the process for preparing hydrogenated nitrile rubber polymers having lower molecular weights and narrower molecular weight distributions than those known in the art.

Abstract: The present invention relates to hydrogenated nitrite rubber polymers having lower molecular weights and narrower molecular weight distributions than those known in the art. The present invention is also related to shaped articles containing hydrogenated nitrile rubber polymers having lower molecular weights and narrower molecular weight distributions than those known in the art.

Abstract: The present invention relates to nitrile rubber polymers having lower molecular weights and narrower molecular weight distributions than those known in the art. The present invention also relates to a process for the manufacture of said nitrile rubber and the use of said nitrile rubber for the manufacture of shaped articles.

Abstract: The present invention relates to thermoplastic vulcanizates (TPVs) based on low Mooney, optionally hydrogenated nitrile butadiene rubber and polyamides. The present invention also relates to TPVs based on low Mooney, optionally, hydrogenated nitrile terpolymers and polyamides. TPVs prepared according to the present invention have improved morphology, smaller rubber particle size, and improved processability compared to TPVs containing non-low Mooney, optionally hydrogenated nitrile butadiene rubber.

Abstract: A substrate processing system includes a processing chamber that can house a substrate therein; a target comprises a sputtering surface in the processing chamber, wherein the substrate is configured to receive material sputtered off the sputtering surface; a magnetron positioned adjacent to the target, wherein the magnetron can produce two erosion grooves separated by a distance S on the sputtering surface, wherein at least one of the two erosion grooves is characterized by an erosion width W; and a first transport mechanism that can move the magnetron in N steps along a travel path in a first direction. N is an integer. The magnetron can stop at each of the N steps to allow materials to be sputtered off the sputtering surface and to be deposited on the substrate. The N steps have substantially the same step size. The step size is approximately equal to the erosion width W.

Abstract: The present invention relates to adhesive polymer composites containing at least one nitrile rubber polymer having a Mooney viscosity (ML 1+4 @ 100° C.) below 30, optionally at least one filler and optionally at least one cross-linking agent, a process for preparing the polymer composite wherein at least one nitrile rubber polymer having a Mooney viscosity (ML 1+4 @ 100° C.) below 30, optionally at least one filler and optionally at least one cross-linking agent are mixed and a self-supporting shaped article containing the compound optionally layered on or interposed between one or more supporting means. The present invention also relates to a tape containing the adhesive polymer composite optionally layered on or interposed between one or more supporting means. Further, the present invention relates to a sealant composition containing the adhesive polymer composite.

Abstract: A substrate processing system includes a first load lock, a process chamber having a first opening to allow an exchange of a substrate between the first load lock and the first process chamber, first rollers in the process chamber; and second rollers in the first load lock, wherein the first rollers and the second rollers are configured to transport a substrate thereon through the first opening between the first load lock and the process chamber. The first rollers and the second rollers are not rotated by an active transport mechanism.

Abstract: A target assembly for material deposition includes a first target piece having a first sputtering surface and comprising a first target material that is to be sputtered off the first sputtering surface and to deposit on a substrate. The target assembly also includes a second target piece juxtaposed to the first target piece. The second target piece comprises a second sputtering surface and a second target material that can be sputtered off the second sputtering surface and to deposit on the substrate. The first target piece and the second target piece are configured to be switched in positions and/or orientations after a period of sputtering operations.

Abstract: A substrate processing system includes a source unit configured to supply a deposition material to a substrate, a substrate holder configured to hold a substrate to receive the deposition material, a shadow mask comprising a frame that includes two opposing arms; and a crossbar configured to be mounted to the two opposing arms. The frame and the crossbar define a plurality of openings that allow the deposition material supplied by the source unit to be deposited on the substrate. A transport mechanism can produce relative movement between the shadow mask and the substrate.

Abstract: The present invention relates to a process for the production of hydrogenated nitrile rubber polymers having lower molecular weights and narrower molecular weight distributions than those known in the art in the absence of a co-(olefin).

Abstract: A processing system includes a chamber. A plurality of processing stations in a center region in the chamber can be sequentially positioned when viewed in a first direction. The plurality of processing stations is configured to provide at least one processing step selected from the group consisting of thermal evaporation, thermal sublimation, sputtering, chemical vapor deposition (CVD), plasma enhanced chemical vapor deposition (PECVD), ion etching, or sputter etching. A plurality of substrates in the chamber can be sequentially positioned when viewed in the first direction. At least one of the plurality of substrate comprises a receiving surface configured to receive the at least one processing step from the plurality of processing stations.

Abstract: A deposition system includes a chamber, a plurality of targets in a center region in the chamber and a plurality of substrates in the chamber. The targets are sequentially positioned when viewed in a first direction. At least one of the targets includes a sputtering surface facing outward. The substrates are sequentially positioned when viewed in the first direction. At least one of the substrates includes a deposition surface configured to receive material sputtered off the sputtering surface.