Patents by Inventor Xian Qin
Xian Qin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10365430Abstract: A method for manufacturing high frequency signal transmission structure comprises: providing two dielectric layers, each of the two dielectric layers defining a top surface and a bottom surface and comprising a channel with a bottom open end opened at the top surface and a top open end opened at the bottom surface, an inner diameter of the each of the two channels gradually reducing further from the top open end to the bottom open end; providing a circuit layer with a transmission portion; providing two copper plates; combining the circuit layer, the two dielectric layers and the two copper plates to form a combination; providing a shielding layer around the two air chambers; and providing at least one solder mask covering the shielding layer. The present disclosure also provides a high frequency signal transmission structure obtained by the method.Type: GrantFiled: July 19, 2017Date of Patent: July 30, 2019Assignees: Avary Holding (Shenzhen) Co., Limited., HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.Inventors: Xian-Qin Hu, Fu-Yun Shen, Ming-Jaan Ho, Feng-Yuan Hu
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Patent number: 10321561Abstract: A flexible printed circuit board (PCB), a method for manufacturing the flexible PCB, and a PCB structure having the flexible PCB are disclosed. A flexible printed circuit board includes a first conductive pattern layer, a second conductive pattern layer, a plurality of first conductive pillars, and a plurality of second conductive pillars. Each of the plurality of first conductive pillars electrically connects to the first conductive pattern layer and is spaced from the second conductive pattern layer, and a plurality of second conductive pillars electrically connects to the second conductive pattern layer and is spaced from the first conductive pattern layer. The plurality of first conductive pillars and the plurality of second conductive pillars are exposed from one surface of the flexible printed circuit board to form a plurality of electrical contact pads.Type: GrantFiled: July 6, 2017Date of Patent: June 11, 2019Assignees: Avary Holding (Shenzhen) Co., Limited., HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.Inventors: Xian-Qin Hu, Ming-Jaan Ho
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Patent number: 10285260Abstract: The flexible printed circuit board includes a base layer, a first circuit layer and a second circuit layer, the first circuit and the second circuit layer formed on both sides of the base layer; conducting holes extending through the base layer and the first copper layer, the conducting holes include annular copper ring embedded in the first circuit layer. A height difference between a surface of the annular copper ring and a surface of the first circuit layer is in a range from 0 to 3 micrometers. A method for manufacturing the flexible printed circuit board is also provided.Type: GrantFiled: October 30, 2015Date of Patent: May 7, 2019Assignees: Avary Holding (Shenzhen) Co., Limited., HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., GARUDA TECHNOLOGY CO., LTD.Inventors: Xian-Qin Hu, Yan-Lu Li, Li-Bo Zhang
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Patent number: 10278307Abstract: A cooling plate of a first embodiment of the present disclosure is configured with a electronic device for heat dissipation. The cooling plate of the first embodiment disclosure includes a first plate, a second plate opposite to the first plate, a bonding line connected with the first plate and the second plate, a plurality of supporting columns, and a cooling liquid received between the first plate and the second plate. The first plate, the second plate, and the bonding line together define a cavity, the plurality of supporting columns and the cooling liquid are received in the cavity. The plurality of supporting columns connects perpendicularly with the first plate and the second plate. The cooling liquid communicates between the plurality of the supporting columns.Type: GrantFiled: November 27, 2017Date of Patent: April 30, 2019Assignees: Avary Holding (Shenzhen) Co., Limited, HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.Inventors: Xian-Qin Hu, Fu-Yun Shen, Ming-Jaan Ho, Hsiao-Ting Hsu
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Publication number: 20190116676Abstract: A method for manufacturing the circuit board comprises following steps of providing an insulating substrate, and defining at least one through-hole on the insulating substrate to extending through two opposite surfaces of the insulating substrate; forming a silver layer on each of the two opposite surfaces, and forming a silver conductive structure in each through-hole connecting the silver layers; forming a copper wiring layer on the silver layers to cover each silver conductive structure and a portion region of the silver layers; and etching the silver layers to form a silver wiring layer corresponding to the copper wiring layer, wherein a first etching liquid, which does not etch the copper wiring layer, is used for etching the silver layers.Type: ApplicationFiled: November 17, 2017Publication date: April 18, 2019Inventors: XIAN-QIN HU, Mei Yang, Jun Dai
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Publication number: 20190116674Abstract: A method for manufacturing a flexible printed circuit board includes having a base layer, and creating a pattern line and at least one conductive pole. The base layer defines at least one communication hole penetrating through the base layer. The pattern line includes two conductive circuit layers formed on opposite surfaces of the base layer. The at least one conductive pole is formed in the at least one communication hole and electrically connects the two conductive circuit layers. A diameter of each conductive pole is less than a diameter of a communication hole.Type: ApplicationFiled: July 31, 2018Publication date: April 18, 2019Inventors: XIAN-QIN HU, CHENG-JIA LI
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Publication number: 20190069406Abstract: A composite circuit board includes an insulation layer, an inner circuit layer, a first conductive layer and a second conductive layer embedded in the insulation layer, a third conductive layer and a fourth conductive layer formed on opposite surfaces of the insulation layer. The third conductive layer electrically connects with the first conductive layer. The fourth conductive layer electrically connects with the second conductive layer. The inner circuit layer is in a middle portion of the insulation layer. The first conductive layer and the second conductive layer respectively forms on opposite sides of the inner circuit layer. The insulation layer forms a plurality of first through holes between the first conductive layer and the inner circuit layer, a plurality of second through holes between the second conductive layer and the inner circuit layer.Type: ApplicationFiled: October 25, 2018Publication date: February 28, 2019Inventors: XIAN-QIN HU, MEI YANG, CHENG-JIA LI
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Publication number: 20190059174Abstract: A cooling plate of a first embodiment of the present disclosure is configured with a electronic device for heat dissipation. The cooling plate of the first embodiment disclosure includes a first plate, a second plate opposite to the first plate, a bonding line connected with the first plate and the second plate, a plurality of supporting columns, and a cooling liquid received between the first plate and the second plate. The first plate, the second plate, and the bonding line together define a cavity, the plurality of supporting columns and the cooling liquid are received in the cavity. The plurality of supporting columns connects perpendicularly with the first plate and the second plate. The cooling liquid communicates between the plurality of the supporting columns.Type: ApplicationFiled: November 27, 2017Publication date: February 21, 2019Inventors: XIAN-QIN HU, FU-YUN SHEN, MING-JAAN HO, HSIAO-TING HSU
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Patent number: 10205487Abstract: A wireless power consortium device includes a flexible substrate layer, at least one first WPC coil on the flexible substrate layer, at least one first NFC coil on the flexible substrate layer, at least one WPC module, and at least one NFC module. Each WPC module comprises a first matching circuit and a WPC power supply chip electrically connected to the first matching circuit. Each NFC module comprises a second matching circuit and an NFC controlling chip electrically connected to the second matching circuit. The first matching circuit and the second matching circuit are different parts of one circuit and are formed on the flexible substrate layer.Type: GrantFiled: January 13, 2018Date of Patent: February 12, 2019Assignees: Avary Holding (Shenzhen) Co., Limited., HongQiSheng Precision Electronics (QinHuangDao) CoInventors: Ming-Jaan Ho, Xian-Qin Hu, Fu-Yun Shen
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Patent number: 10159149Abstract: A composite circuit board includes an insulation layer, an inner circuit layer, a first conductive layer and a second conductive layer embedded in the insulation layer, a third conductive layer and a fourth conductive layer formed on opposite surfaces of the insulation layer. The third conductive layer electrically connects with the first conductive layer. The fourth conductive layer electrically connects with the second conductive layer. The inner circuit layer is in a middle portion of the insulation layer. The first conductive layer and the second conductive layer respectively forms on opposite sides of the inner circuit layer. The insulation layer forms a plurality of first through holes between the first conductive layer and the inner circuit layer, a plurality of second through holes between the second conductive layer and the inner circuit layer.Type: GrantFiled: April 28, 2017Date of Patent: December 18, 2018Assignees: HongQiSheng Precision Electronics (QinHuangDao) Co, Avary Holding (Shenzhen) Co., Limited.Inventors: Xian-Qin Hu, Mei Yang, Cheng-Jia Li
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Patent number: 10136207Abstract: A printed circuit board used as a voice coil includes N board units stacked over one another, each board unit having a first electrically connecting region and a second electrically connecting region, all of the first electrically connecting regions being stacked over one another, all of the second electrically connecting regions being stacked over one another, each board unit having a first circuit structure, a base, and a second circuit structure arranged from top to bottom, in each two adjacent board units, the first electrically connecting region of the second circuit structure of an upper board unit being electrically connected in series with the first electrically connecting region of the first circuit structure of a lower board unit, in each board unit, the first circuit structure being electrically connected in series with the second circuit structure in the second electrically connecting region.Type: GrantFiled: August 1, 2017Date of Patent: November 20, 2018Assignees: Avary Holding (Shenzhen) Co., Limited., HongQiSheng Precision Electronics (QinHuangDao) CoInventors: Xian-Qin Hu, Fu-Wei Zhong, Yi-Qiang Zhuang, Chun-Ming Zhou
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Publication number: 20180310406Abstract: A method for making a circuit board comprising: providing a silver clad laminate comprising a substrate and two silver foils; forming at least one through hole on the silver clad laminate, the through hole comprises an annular middle wall and two annular edge walls connected to two sides of the annular middle wall; forming an organic conductive film on the annular middle wall; forming a dry film pattern layer on the second area; plating copper to form a copper circuit layer on the first area, and to form a via hole in the through hole; removing the dry film pattern layer; and etching the second area of the silver foil away. The first area changes to a silver circuit layer. The copper circuit layer and the silver circuit layer define a conductive circuit layer. A circuit board made by the method is also provided.Type: ApplicationFiled: August 7, 2017Publication date: October 25, 2018Inventors: MING-JAAN HO, XIAN-QIN HU, FU-YUN SHEN, WEN-ZHU WEI
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Patent number: 10104771Abstract: A method for making a circuit board comprising: providing a silver clad laminate comprising a substrate and two silver foils; forming at least one through hole on the silver clad laminate, the through hole comprises an annular middle wall and two annular edge walls connected to two sides of the annular middle wall; forming an organic conductive film on the annular middle wall; forming a dry film pattern layer on the second area; plating copper to form a copper circuit layer on the first area, and to form a via hole in the through hole; removing the dry film pattern layer; and etching the second area of the silver foil away. The first area changes to a silver circuit layer. The copper circuit layer and the silver circuit layer define a conductive circuit layer. A circuit board made by the method is also provided.Type: GrantFiled: August 7, 2017Date of Patent: October 16, 2018Assignees: Avary Holding (Shenzhen) Co., Limited., HongQiSheng Precision Electronics (QinHuangDao) CoInventors: Ming-Jaan Ho, Xian-Qin Hu, Fu-Yun Shen, Wen-Zhu Wei
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Publication number: 20180295434Abstract: A printed circuit board used as a voice coil includes N board units stacked over one another, each board unit having a first electrically connecting region and a second electrically connecting region, all of the first electrically connecting regions being stacked over one another, all of the second electrically connecting regions being stacked over one another, each board unit having a first circuit structure, a base, and a second circuit structure arranged from top to bottom, in each two adjacent board units, the first electrically connecting region of the second circuit structure of an upper board unit being electrically connected in series with the first electrically connecting region of the first circuit structure of a lower board unit, in each board unit, the first circuit structure being electrically connected in series with the second circuit structure in the second electrically connecting region.Type: ApplicationFiled: August 1, 2017Publication date: October 11, 2018Inventors: XIAN-QIN HU, FU-WEI ZHONG, YI-QIANG ZHUANG, CHUN-MING ZHOU
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Publication number: 20180274869Abstract: A heat dissipation device includes etched or other grooves for adhesive surrounding etched or other recesses for heat-dissipating fluid, these being created in a first copper sheet and a second copper sheet brought together. The first copper sheet includes first recesses and the second copper sheet includes corresponding second recesses. The second copper sheet is adhesively fixed on the first copper sheet and an airtight receiving cavity is formed by the first and second recesses being brought together. The heat-dissipating fluid in the airtight receiving cavity carries away heat generated by a heat-producing device to which the heat-dissipating device is fixed.Type: ApplicationFiled: May 28, 2018Publication date: September 27, 2018Inventors: XIAN-QIN HU, FU-YUN SHEN, MING-JAAN HO
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Publication number: 20180196192Abstract: A method for manufacturing high frequency signal transmission structure comprises: providing two dielectric layers, each of the two dielectric layers defining a top surface and a bottom surface and comprising a channel with a bottom open end opened at the top surface and a top open end opened at the bottom surface, an inner diameter of the each of the two channels gradually reducing further from the top open end to the bottom open end; providing a circuit layer with a transmission portion; providing two copper plates; combining the circuit layer, the two dielectric layers and the two copper plates to form a combination; providing a shielding layer around the two air chambers; and providing at least one solder mask covering the shielding layer. The present disclosure also provides a high frequency signal transmission structure obtained by the method.Type: ApplicationFiled: July 19, 2017Publication date: July 12, 2018Inventors: XIAN-QIN HU, FU-YUN SHEN, MING-JAAN HO, FENG-YUAN HU
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Publication number: 20180192516Abstract: A composite circuit board includes an insulation layer, an inner circuit layer, a first conductive layer and a second conductive layer embedded in the insulation layer, a third conductive layer and a fourth conductive layer formed on opposite surfaces of the insulation layer. The third conductive layer electrically connects with the first conductive layer. The fourth conductive layer electrically connects with the second conductive layer. The inner circuit layer is in a middle portion of the insulation layer. The first conductive layer and the second conductive layer respectively forms on opposite sides of the inner circuit layer. The insulation layer forms a plurality of first through holes between the first conductive layer and the inner circuit layer, a plurality of second through holes between the second conductive layer and the inner circuit layer.Type: ApplicationFiled: April 28, 2017Publication date: July 5, 2018Inventors: XIAN-QIN HU, MEI YANG, CHENG-JIA LI
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Patent number: 10012454Abstract: A heat dissipation device includes a first copper sheet and a second copper sheet. The first copper sheet includes a number of first recesses and the second copper sheet includes a number of corresponding second recesses. The second copper sheet is fixed on the first copper sheet and an airtight receiving cavity is formed by each first recess and each the second recess, a working fluid in the airtight receiving cavity carries unwanted heat away.Type: GrantFiled: April 20, 2015Date of Patent: July 3, 2018Assignees: Avary Holding (Shenzhen) Co., Limited., GARUDA TECHNOLOGY CO., LTDInventors: Xian-Qin Hu, Fu-Yun Shen, Ming-Jaan Ho
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Patent number: 9992858Abstract: A printed circuit board includes a first printed circuit substrate and a second printed circuit substrate. The first printed circuit substrate includes a substrate layer and a first conductive circuit layer. The first conductive circuit layer is formed on the substrate layer. The substrate layer includes at least two first grooves. The first conductive circuit layer includes at least one signal wire. The first grooves are defined in both sides of the signal wire. The second printed circuit substrate is formed on the first printed circuit substrate. The second circuit substrate includes a third copper layer. A second groove is defined in the third copper layer. The first grooves are opposite to the second groove. The first grooves and the second groove form a space.Type: GrantFiled: May 25, 2017Date of Patent: June 5, 2018Assignees: Avary Holding (Shenzhen) Co., Limited, HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., GARUDA TECHNOLOGY CO., LTDInventors: Ming-Jaan Ho, Xian-Qin Hu, Yi-Qiang Zhuang, Fu-Wei Zhong
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Publication number: 20180139841Abstract: A flexible printed circuit board (PCB), a method for manufacturing the flexible PCB, and a PCB structure having the flexible PCB are disclosed. A flexible printed circuit board includes a first conductive pattern layer, a second conductive pattern layer, a plurality of first conductive pillars, and a plurality of second conductive pillars. Each of the plurality of first conductive pillars electrically connects to the first conductive pattern layer and is spaced from the second conductive pattern layer, and a plurality of second conductive pillars electrically connects to the second conductive pattern layer and is spaced from the first conductive pattern layer. The plurality of first conductive pillars and the plurality of second conductive pillars are exposed from one surface of the flexible printed circuit board to form a plurality of electrical contact pads.Type: ApplicationFiled: July 6, 2017Publication date: May 17, 2018Inventors: XIAN-QIN HU, MING-JAAN HO