Abstract: Methods and systems are provided for utilizing audio commands onboard an aircraft. A method comprises identifying a flight phase for the aircraft, resulting in an identified flight phase, receiving an audio input, resulting in received audio input, filtering the received audio input in a manner that is influenced by the identified flight phase for the aircraft, resulting in filtered audio input, and validating the filtered audio input as a first voice command of a first plurality of possible voice commands.

Abstract: A flexible printed circuit board includes a flexible printed circuit unit and an electromagnetic shielding structure. The flexible printed circuit unit includes a base layer and a first circuit layer formed on a surface of the base layer. The electromagnetic shielding structure includes a first insulating layer and a copper layer. The first insulating layer is adhered on a surface of the first circuit layer away from the base layer. At least one blind hole is defined in the electromagnetic shielding structure. The copper layer is electrically connected to the first circuit layer by a plating structure filled in the blind hole.

Abstract: A flexible printed circuit board (PCB) used for near field communication and a method for manufacturing the flexible PCB are provided. The flexible PCB includes an insulating layer; a first conductive circuit layer adhered on a surface of the insulating layer, the first conductive circuit layer includes at least one first conductive circuit arranged as spiral-shaped and defines a plurality of first spaces; a first resin layer is adhered on a surface of the insulating layer and fills the first spaces; and a first cover layer adhered on a surface of the first resin layer and a surface of the first conductive circuit layer away from the insulating layer.

Abstract: This disclosure relates to a printed circuit board comprising a light-pervious insulation layer, a patterned electrically conductive layer and a light-pervious overlay. The patterned electrically conductive layer includes a first black oxide layer, a copper layer and a second black oxide layer. The copper layer includes two opposite surfaces and a plurality of inner surfaces interconnecting the two opposite surfaces of the copper layer. The first black oxide layer is formed on one of the surfaces, and the second black oxide layer is formed on the other surface and the inner surfaces. The patterned electrically conductive layer is arranged on the light-pervious insulation layer. The light-pervious overlay is arranged on the second black oxide layer. A method for manufacturing the printed circuit board is also provided in this disclosure.

Abstract: A heat dissipation device includes a first copper sheet and a second copper sheet. The first copper sheet includes a number of first recesses and the second copper sheet includes a number of corresponding second recesses. The second copper sheet is fixed on the first copper sheet and an airtight receiving cavity is formed by each first recess and each the second recess, a working fluid in the airtight receiving cavity carries unwanted heat away.

Abstract: Provided is a stress-relieving, second-level interconnect structure that is low-cost and accommodates thermal coefficient of expansion (TCE) mismatch between low-TCE packages and printed circuit boards (PCBs). The interconnect structure comprises at least a first pad, a supporting pillar, and a solder bump, wherein the first pad and supporting pillar are operative to absorb substantially all plastic strain, thereby enhancing compliance between the two electronic components.

Abstract: A printed circuit board (PCB) and a method for manufacturing the PCB are disclosed. A PCB includes a transparent insulating substrate, a conductive circuit layer 16, and a transparent cover layer. The conductive circuit layer is located between the transparent insulating substrate and the transparent cover layer. The conductive circuit layer includes a first Ni—W alloy pattern layer, a copper pattern layer, and a second Ni—W alloy pattern layer. The first Ni—W alloy pattern layer is adhered with the transparent adhesive layer. Bottom surfaces of the conductive pattern layer are coated by the first Ni—W alloy pattern layer. Top surfaces and side surfaces of conductive pattern layer are coated by the second Ni—W alloy pattern layer.

Abstract: A PCB includes a base layer, a wiring pattern formed on a surface of the base layer, and a protecting layer formed on the wiring pattern. The protecting layer is formed by printing and solidifying an ink on the wiring pattern. The ink includes a cycloaliphatic epoxy resin, a phenoxyl resin solution, a solvent, a hardener, and an antifoaming agent.

Abstract: An FPCB includes a flexible base, a wiring layer formed on a top surface of the base, a covering layer formed on the wiring layer, and a shielding layer formed on a portion of the covering layer. The wiring layer includes a grounding line. The covering layer defines an opening to expose the grounding line to the outside. A portion of the shielding layer fills into the opening. The shielding layer is electrically connected to the grounding line through the opening.

Abstract: A printed circuit board (PCB) with visible circuit includes a circuited substrate, a first and second release films, and a first and second optical clear adhesive (OCA) layers. The first and second release films are pressed onto and are adhered to two opposite surfaces of the circuited substrate via the first and second OCA layers respectively, and the first and second OCA layers are made of polymethyl methacrylate (PMMA).

Abstract: A printed circuit board with circuit visible includes a wiring layer, a first adhesive layer, a first dielectric layer, and a cover film, which are stacked in described order, the wiring layer comprising at least one electrical contact pad. The cover film has at least one opening corresponding to the electrical contact pad. The cover film includes a second dielectric layer and a second adhesive layer. A flow initiation temperature of the first adhesive layer is in a range from 85 degrees centigrade to 90 degrees centigrade, and a hardening temperature of the first adhesive being lower than 150 degrees centigrade.

Abstract: Methods and systems are provided for communicating information from an aircraft to a computer system at a ground location. One exemplary method involves obtaining an audio input from an audio input device onboard the aircraft, generating text data comprising a textual representation of the one or more words of the audio input, and communicating the text data to the computer system at the ground location.

Abstract: This disclosure relates to a printed circuit board comprising a light-pervious insulation layer, a patterned electrically conductive layer and a light-pervious overlay. The patterned electrically conductive layer includes a first black oxide layer, a copper layer and a second black oxide layer. The copper layer includes two opposite surfaces and a plurality of inner surfaces interconnecting the two opposite surfaces of the copper layer. The first black oxide layer is formed on one of the surfaces, and the second black oxide layer is formed on the other surface and the inner surfaces. The patterned electrically conductive layer is arranged on the light-pervious insulation layer. The light-pervious overlay is arranged on the second black oxide layer. A method for manufacturing the printed circuit board is also provided in this disclosure.

Abstract: The various embodiments of the present invention provide a stress-relieving, second-level interconnect structure that is low-cost and accommodates TCE mismatch between low-TCE packages and PCBs. The various embodiments of the interconnect structure are reworkable and can be scaled to pitches from about 1 millimeter (mm) to about 150 micrometers (?m). The interconnect structure comprises at least a first pad, a supporting pillar, and a solder bump, wherein the first pad and supporting pillar are operative to absorb substantially all plastic strain, therefore enhancing compliance between the two electronic components. The versatility, scalability, and stress-relieving properties of the interconnect structure of the present invention make it a desirable structure to utilize in current two-dimensional and ever-evolving three-dimensional IC structures.

Abstract: Methods and systems are provided for utilizing audio commands onboard an aircraft. A method comprises identifying a flight phase for the aircraft, resulting in an identified flight phase, receiving an audio input, resulting in received audio input, filtering the received audio input in a manner that is influenced by the identified flight phase for the aircraft, resulting in filtered audio input, and validating the filtered audio input as a first voice command of a first plurality of possible voice commands.

Abstract: Methods and systems are provided for communicating information from an aircraft to a computer system at a ground location. One exemplary method involves obtaining an audio input from an audio input device onboard the aircraft, generating text data comprising a textual representation of the one or more words of the audio input, and communicating the text data to the computer system at the ground location.

Abstract: Disclosed is a method and apparatus for non-invasive bone fracture detection and accelerated healing, that simultaneously maps, via a paired phased array ultrasound scanning apparatus having multi-element transducers, three dimensional bone surface topology at opposite surfaces along an ultrasound wave pathway; that measures, using the mapped three dimensional topology, a thickness of the mapped bone; that detects, using the mapped three dimensional topology, a region of interest with bone deterioration or fracture; that calculates an ultrasonic wave velocity and attenuation as the ultrasound wave passes through the detected region of interest; and that applies a low-intensity pulsed ultrasound (LIPUS) pulse to the region of interest. The paired phased array ultrasound scanning apparatus focuses the application of the LIPUS pulse.

Abstract: Methods and systems are provided for utilizing audio commands onboard an aircraft. A method comprises identifying a flight phase for the aircraft, resulting in an identified flight phase, receiving an audio input, resulting in received audio input, filtering the received audio input in a manner that is influenced by the identified flight phase for the aircraft, resulting in filtered audio input, and validating the filtered audio input as a first voice command of a first plurality of possible voice commands.

Abstract: A method of communicating bit-oriented data over an Aircraft Communications Addressing and Reporting System (ACARS) character-oriented data link comprises splitting the bit-oriented data into a plurality of segments; calculating a plurality of intermediate values corresponding to each segment; mapping each intermediate value to an ACARS character; and transmitting the ACARS characters over the ACARS data link.

Abstract: A surface topology map technique and apparatus are disclosed for determining calcaneus thickness for imaging quantitative ultrasound measurements; improving measurement accuracy, particularly in in vivo applications.