Abstract: A cabinet for receiving a server includes two opposite sidewalls, two movable frames slidably mounted to rear sides of the sidewalls, and a pair of rails mounted to front sides of the sidewalls. Each rail forms a supporting piece for supporting a server together with the supporting piece of the fixing member. Each movable frame has a blocking member for blocking a rear side of the server.

Abstract: A cabinet includes a chassis, a server module, a first cooling module, and a number of second cooling modules. The server module includes servers received in the chassis, and each server includes heat generating components. The first cooling module includes first fans. The second cooling modules are mounted in each server. Each second cooling module includes a second fan and a temperature sensor electrically connected to the second fan. When temperatures measured by the sensors are lower than a predetermined temperature, only the first fans are employed to dissipate heat of the servers; when any of the measured temperatures is higher than the predetermined temperature, the temperature sensor that detected the higher temperature transmits a signal to the corresponding second fan for starting the second fan.

Abstract: A rack-mount server system includes a cabinet, a number of server units mounted in the cabinet, and a number of fan modules. Each fan module cools one or a group of server units. Each fan module includes a mounting bracket fixed to the cabinet, a number of fans attached to the mounting bracket, an air flap, and a control box to control the power supply to the fans. The mounting bracket defines an air passage dedicated to each fan, through which air from the fan is guided to the one or a group of server units. Each mounting bracket defines a cutout, through which the air passages of two neighboring fans communicate with each other. The air flap may be slid closed or slid open to redirect or gather a cooling airflow as required, depending on the distribution of server units within the cabinet.

Abstract: A heat dissipating apparatus includes a heat sink, a fan, and an airflow guide. The heat sink includes a conducting base board and a number of parallel fins vertically extending from the conducting base board. An air intake and an air outlet are defined in opposite ends of the heat sink. The airflow guide includes a mounting cover accommodating the heat sink, and a guiding element connected to the mounting cover. The fan is mounted to the mounting cover and at the air intake of the heat sink. The guiding element is arranged at the air outlet of the heat sink. The guiding element includes a guiding board. An angle between the guiding board and the fins at the air outlet is less than 90 degrees and more than 0 degrees.

Abstract: A cooling fan module includes a first cooling fan pivotally connected with a second cooling fan. The second cooling fan is rotatable relative to the first cooling fan between a first state and a second state. The second cooling fan is located on the first cooling fan in the first state. The second cooling fan is located at a lateral side of the first cooling fan in the second state.

Abstract: A blower includes a base, a cover, a centrifugal impeller, and a rotating member. The cover is covered on the base, and defines a number of air outlets towards different directions. The centrifugal impeller is mounted between the base and the cover. The rotating member is rotatably mounted to the cover, and includes a shield. The rotating member is operable to rotate to cover one of the air outlets.

Abstract: A cabinet includes an enclosure and a fan module. The enclosure includes a first sidewall and a second sidewall opposite to the first sidewall. The fan module includes a bracket, a number of fans mounted to the bracket, a fixing member pivotably connected to a first end of the bracket, and a fixing portion formed on a second end of the bracket opposite to the first end. The fixing member is fixed to the first sidewall of the enclosure. When the bracket is rotated towards the second sidewall of the enclosure, the fixing portion engages with the second sidewall.

Abstract: A heat dissipation device is used to dissipate heat generated by a number of memory chips of a motherboard. The heat dissipation device includes a bracket attached to the motherboard and at one side of the memory chips, at least one fan, and at least one connection member attached to the corresponding fan. The fan is adjustably attached to the bracket by the connection member.

Abstract: A cooling system includes a fixing device and a fan. The fixing device includes a fixing rack and a latching rack. The fixing rack includes a first latching arm and two opposite supporting arms protruding from two ends of the first latching arm. The latching rack includes a second latching arm and two opposite adjusting arms protruding from two ends of the second latching arm. The adjusting arms can be adjustably fixed to the supporting arms at different positions to adjust a distance between the first latching arms and the second latching arm to releasably fix the fan between the first latching arm and the second latching arm.

Abstract: A fan assembly for a computer system includes a fan and a frame connected to the fan. A number of louvers are rotatably connected to the frame and are capable of rotating between an open position in response to air pressure established by the fan in which air is permitted to flow through the fan, and a closed position under a force of gravity when the fan is inoperable in which the louvers block the air to flow through the fan. Each louver defines at least one groove along a width direction, and each of the at least one groove allows two portions at opposite sides to be broken off from each other.

Abstract: An air guiding device includes a side plate defining an opening. Two shielding plates are slidably attached to the side plate and respectively located beside opposite ends of the opening to adjustably cover the opening.

Abstract: A heat dissipation device is used to dissipate heat generated by a number of memory chips of a motherboard. The heat dissipation device includes two brackets attached to the motherboard and at opposite sides of the memory chips, are a support, and a fan. The support includes a fixing plate and two clamping plates extending from opposite ends of the fixing plate. The clamping plates are rotatably mounted to the brackets, and are positioned above the memory chips. The fan is sandwiched between the clamping plates or mounted to the fixing plate.

Abstract: An exemplary heat dissipation system includes a built-in heat dissipation module for being positioned in a computer case, a liquid pump communicating with the built-in heat dissipation module, and an add-on heat dissipation module for being positioned outside of the computer case. The built-in heat dissipation module includes cooling fluid. The add-on heat dissipation module includes a receiving frame and a heat dissipation device fixed to the receiving frame. The receiving frame engages with the heat dissipation device to receive the cooling fluid. The receiving frame communicates with the built-in heat dissipation module and the liquid pump, such that the cooling fluid can be circulated between the built-in heat dissipation module and the receiving frame under the control of the liquid pump.

Abstract: A heat sink clip for fastening a heat sink on a printed circuit board (PCB) includes a wire clip and two hooks. The wire clip can be deformed in assembly to make the hooks extend through two locking slots of the PCB to lock to a second side of the PCB, the clip functions as a lever, a clip, and a latch.

Abstract: A computer casing includes several electronic components, a first heat sink, a side plate, a second heat sink, a container, a pump, and a tube. The first heat sink is attached to an electronic component, and defines a channel including an inlet and an outlet. The side plate defines an opening. The second heat sink is fixed to the side plate and covers the opening. The second heat sink includes a first side facing the opening and an opposite side external to the side plate. The container is used to store coolant and is fixed to the first side of the second heat sink. A pump is connected to the container. The tube includes a first end connected to the pump and a second end connected to the inlet of the channel of the first heat sink, and stays in contact with the first side of the second heat sink.

Abstract: An electrical device enclosure includes a front panel, a power supply and a switch assembly mounted on the front panel. The power supply includes an alternating current (AC) plug and a power circuit. The AC plug is used to receive an AC voltage. The power circuit is used to convert the AC voltage from the AC plug into a direct current voltage. The switch assembly is connected between the AC plug and the power circuit to turn on/off a connection between the AC plug and the power circuit.

Abstract: A heat dissipation device includes a heat conducting board attached to an electronic component mounted on a printed circuit board, a fin unit disposed on the heat conducting board, a fixing module, and a fan secured on the fixing module. The fixing module includes a pivoting post extending through the fin unit, a fan holder spanning over the fin unit and pivotally fixed to the pivoting post, and two fastening members engaging with two opposite ends of the pivoting post and being capable of fixing the fan holder at different positions relative to the fin unit. The fan is fixed to the fan holder of the fixing module and provides airflow towards the fin unit.

Abstract: A motherboard includes a printed circuit board and a number of power connectors mounted on the printed circuit board. Each of the power connectors includes a connector body, a cover, and a connecting arm connecting the cover to the connector body. The connecting arm includes a first connecting portion extending from the connector body, and a second connecting portion extending from the cover and rotatably connected to the first connecting portion. The connector body includes a number of pins. The cover defines a number of retaining slots correspondingly to retain the pins of the connector body.

Abstract: A mounting apparatus for fixing a fan defining fixing notches in an exterior surface of the fan to a chassis includes a frame. The frame includes a base panel fixed to the chassis, two side panels respectively extending up from opposite ends of the base panel, and two elastic fixing portions respectively extending up from the side panels away from the base panel. When the fan is disposed in the frame, the base panel, the side panels, and the fixing portions of the frame resist the exterior surface of the fan and the fixing portions are received in the corresponding fixing notches of the fan.

Abstract: A liquid cooling system includes a heat conductive member, a liquid tank, and plural conduits connecting the heat conductive member with the liquid tank. The heat conductive member is configured for thermally connecting to a heat-generating electronic component. The liquid tank defines a liquid injection hole therein. A clip assembly is connected to the liquid tank. When pressed against the clip assembly by a user, the liquid tank is fastened by the clip assembly and thus retained in position. When pressed again toward the clip assembly, the liquid tank is released from the clip assembly and ejected in a direction away from the heat-generating electronic component. An electronic device using the liquid cooling system is also provided.