Abstract: A method for making a semiconductor device is provided which comprises (a) providing a semiconductor structure equipped with a gate (209) and a channel region, said channel region being associated with the gate; (b) depositing a first sub-layer (231) of a first stressor material over the semiconductor structure, said first stressor material containing silicon-nitrogen bonds and imparting tensile stress to the semiconductor structure; (c) curing the first stressor material through exposure to a radiation source; (d) depositing a second sub-layer (233) of a second stressor material over the first sub-layer, said second stressor material containing silicon-nitrogen bonds and imparting tensile stress to the semiconductor structure; and (e) curing the second sub-layer of stressor material through exposure to a radiation source.

Abstract: A perforated monocrystalline silicon plate assembly is provided for forming and transferring of monocrystalline silicon thin film solar cells. The assembly comprises a perforated monocrystalline silicon plate with a plurality of through holes and obstructive holes. The assembly is allowed to grow a first p-type epitaxial layer with an inverted pyramid surface on the surface of the silicon plate, which is then selectively converted into a porous silicon layer with an inverted pyramid surface. The assembly is further allowed to grow a second p-type epitaxial layer with an inverted pyramid surface on the surface of the porous silicon layer, which is then used to fabricate a monocrystalline silicon thin film solar cell with an inverted pyramid surface.

Abstract: The present invention relates to a semi-conductive composition comprising carbon nanotubes in a matrix. These semiconductive compositions are useful in printing semiconducting portions of thin film transistors.

Abstract: An IC socket comprises a base, a cover moveably mounted to the base, and an actuating mechanism driving the cover to move between a first position and a second position. The base includes a plurality of passageways and at least a rib extending upwardly from a top surface. The cover defines a hole corresponding to the rib and has a plurality of apertures corresponding to the passageways.

Abstract: Disclosed are methods and apparatus for handling Link State Packets (LSPs) sent between processing nodes within a computer network. At a first node, an LSP sent by a second node is received. The received LSP specifies connectivity information regarding the second node. It is then determined whether one of two conditions is met: either the received LSP is an updated LSP even though it appears older and a corresponding stored LSP fails authentication, or the received LSP fails authentication and it appears newer. If it is determined that one of these conditions is met, as well as purging criteria, then updating procedures are then performed on the LSP information that is maintained by the first node, where the LSP information was originally obtained from a corresponding LSP sent by the second node.

Abstract: A method for making a semiconductor device is provided which comprises (a) providing a semiconductor structure equipped with a gate and a channel region, said channel region being associated with the gate; (b) depositing a first sub-layer (131) of a first stressor material over the semiconductor structure, said first stressor material containing silicon-nitrogen bonds and imparting tensile stress to the semiconductor structure; (c) curing the first stressor material through exposure to a radiation source; (d) depositing a second sub-layer (133) of a second stressor material over the first sub-layer, said second stressor material containing silicon-nitrogen bonds and imparting tensile stress to the semiconductor structure; and (e) curing the second sub-layer of stressor material through exposure to a radiation source.

Abstract: A method for making a semiconductor device is provided which comprises (a) providing a semiconductor structure equipped with a gate (209) and a channel region, said channel region being associated with the gate; (b) depositing a first sub-layer (231) of a first stressor material over the semiconductor structure, said first stressor material containing silicon-nitrogen bonds and imparting tensile stress to the semiconductor structure; (c) curing the first stressor material through exposure to a radiation source; (d) depositing a second sub-layer (233) of a second stressor material over the first sub-layer, said second stressor material containing silicon-nitrogen bonds and imparting tensile stress to the semiconductor structure; and (e) curing the second sub-layer of stressor material through exposure to a radiation source.

Abstract: A compound having the structural formula: where R is H or lower alkyl of 1 through 12 carbon atoms. In general, the compounds of the invention are 132-Oxo-bacteriopyropheophorbide—a carboxylic acid and C1–C12 alkyl esters thereof. A method for the preparation of the carboxylic acid compounds of the invention includes the step of reacting bacteriopyropheophorbide—a alkyl ester with lithium hydroxide tetrahydrofuran and water.

Abstract: A compound having the structural formula: where R is H or lower alkyl of 1 through 12 carbon atoms. In general, the compounds of the invention are 132-Oxo-bacteriopyropheophorbide-a carboxylic acid and C1-C12 alkyl esters thereof. A method for the preparation of the carboxylic acid compounds of the invention includes the step of reacting bacteriopyropheophorbide-a alkyl ester with lithium hydroxide in tetrahydrofuran and water.

Abstract: Self-assembled photonic crystals, including large sphere planar opals, infiltrated planar opals and inverted planar opals, as well as methods for manufacturing same are provided. Large sphere planar opals are manufactured according to a method comprising the steps of: synthesizing monodisperse silica spheres, wherein each of the silica spheres has a diameter greater than or equal to about 400 nanometers; purifying the silica spheres; and self-assembling the silica spheres into a plurality of ordered, planar layers on a substrate. Infiltrated planar opals may also be manufactured by further processing the large sphere planar opal by sintering the planar opal and infiltrating the planar opal with a predetermined material. Inverted planar opals may further be manufactured by removing the silica spheres from the infiltrated planar opal. Various modifications to the substrate and planar opal are also provided to enhance the properties of these photonic crystals.

Abstract: A micro-optical-mechanical-electro-system (MOMES)-based non-invasive blood glucose monitor comprises a micromachined infrared optical filter array, a micromachined infrared mechanical modulator array, at least one micromachined infrared tunable filter, and at least one infrared detector. Each optical filter is aligned with a mechanical modulator along its optical axis direction. The optical filter continuously divides a monochromatic infrared light in a wavelength range within 0.8 to 25 micron from an infrared light. The aligned mechanical modulator turns the monochromatic infrared light into an alternating monochromatic infrared light. The tunable filter is aligned with the infrared detector along its optical axis direction. The tunable filter selects the back-diffused alternating monochromatic infrared light emitted from a measured blood subject that is illuminated by the alternating monochromatic infrared light.

Abstract: An optical microswitch printer head comprising a micromachined optical microswitch array with optical microswitches extending in a main scanning direction. The optical microswitch is based on a variable air gap Fabry-Perot cavity that is defined by two non-absorbing distributed Bragg reflectors. One of the distributed Bragg reflectors is supported by flexible beams so that the length of the Fabry-Perot cavities can be set to be equal to an odd or even multiple of a quarter wavelength of a working optical wave by applying a voltage. As a result, the optical microswitches can be pushed into a transmission state or “on” state for letting a light pass through or a reflection state or “off” state for blocking the light. The optical microswitch printer head can utilize a gas discharge lamp such as a cold cathode fluorescent lamp as a light source.

Abstract: A micro-optical-mechanical-electro-system (MOMES)-based non-invasive blood glucose monitor comprises a micromachined infrared spectrometer array, a micromachined infrared mechanical modulator array, at least one micromachined infrared tunable filter, and at least one infrared detector. Each spectrometer is aligned with a mechanical modulator along its optical axis direction. The spectrometer continuously divides a monochromatic infrared light in a wavelength range within 0.8 to 25 micron from an infrared light. The aligned mechanical modulator turns the monochromatic infrared light into an alternating monochromatic infrared light. The tunable filter is aligned with the infrared detector along its optical axis direction. The tunable filter selects the back-diffused alternating monochromatic infrared light emitted from a measured blood subject that is illuminated by the alternating monochromatic infrared light.

Abstract: A method for fabricating an optical switch array comprising the steps: providing a two side polished lightly dope (110) silicon substrate; forming a heavily doped layer with a same type impurity as the (110) silicon substrate on the back side of the (110) silicon substrate; growing a lightly doped epitaxial layer on the back side of the (110) silicon substrate; converting the heavily dope layer into a porous silicon layer by anodization in HF solution; forming a plurality of microchannels on the front side of the (110) silicon substrate so that each makes a 135 or 45 degree angle to a (111) crystal plane vertical to the surface of the (110) silicon substrate; converting the porous silicon layer into an oxidized porous silicon layer by thermal oxidization; forming electrical interconnections on the front side of the (110) silicon substrate; forming a plurality of (111) silicon planar plates each having two opposite sides made of (111) silicon crystal planes on the front side of the (110) silicon substrate by a

Abstract: A micromachined vertical vibrating gyroscope consists of three single crystal silicon assemblies: an outer single crystal silicon assembly, an intermediate single crystal silicon assembly, and an inner single crystal silicon assembly. The outer assembly includes a plurality of arc-shaped anchors arranged in a circle and extending from a single crystal silicon substrate coated with an insulating annulus thereon. The intermediate assembly is a suspended wheel concentric with the arc-shaped anchors. The inner assembly is a suspended hub concentric with the circle formed by the anchors and having no axle at its center. The three assemblies are connected to each other through several flexures. The intermediate suspended wheel is driven into rotational vibration by lateral comb capacitors. Input angular rates are measured by two vertical capacitors.

Abstract: An optical switch array assembly for DNA probe light synthesis and hybridized DNA probe light detection is composed of a silicon substrate, an optical switch array disposed in the substrate, a glass plate mounted on the top of the substrate, and a DNA probe array disposed on the surface of the glass plate. The substrate also contains a driving circuit for forcing each optical switch on and off and an addressing circuit for locating each optical switch. A plurality of holes is disposed in the substrate so that each hole is aligned with an optical switch and guides a light beam to a corresponding optical switch.

Abstract: An optical microswitch printer head comprising a micromachined optical microswitch array with optical microswitches extending in a main scanning direction. The optical microswitch is based on a variable air gap Fabry-Perot cavity that is defined by two non-absorbing distributed Bragg reflectors. One of the distributed Bragg reflectors is supported by flexible beams so that the length of the Fabry-Perot cavities can be set to be equal to an odd or even multiple of a quarter wavelength of a working optical wave by applying a voltage. As a result, the optical microswitches can be pushed into a transmission state or “on” state for letting a light pass through or a reflection state or “off” state for blocking the light. The optical microswitch printer head can utilize a gas discharge lamp such as a cold cathode fluorescent lamp as a light source.

Abstract: An optical switch array comprises a (110) silicon substrate integrating a plurality of (111) silicon planar plates, a plurality of flexural silicon strips and a plurality of microchannels therein. The (111) silicon planar plates are coated with a reflective layer on both opposite surfaces and are used as double-sided mirrors. Each silicon strip vertically supports a (111) silicon planar plate and can be electrically bent up to lift the (111) silicon planar plates out of the (110) silicon substrate. The microchannels are oriented to a (111) silicon planar plate at a 135 or 45 degree angle. Each microchannel holds an optical fiber or a cylindrical lens therein. A passive alignment can be realized between the optical fibers, the cylindrical lenses and the (110) silicon planar plates.

Abstract: A method for manufacturing a thermal ink jet print head with high efficiency of heat transfer is disclosed. The heating resistors of the head are made of doped single crystalline silicon. Each resistor is disposed in a silicon stripe that is surrounded by a thermal insulating material filled trench and forms a top cover of a corresponding microchannel. The head generated by the resistor can only flow into the ink disposed in the microchannel. The microchannels and nozzles of the head are constructed in a single crystalline silicon substrate. The head is fabricated based on a porous silicon process including: (1) converting heavily doped single crystal silicon into porous silicon; (2) turning porous silicon into oxidized porous silicon; (3) using oxidized porous silicon as a stop barrier for anisotropic etching of single crystal silicon; and (4) selective etching of oxidized porous silicon.

Abstract: An optical switch array assembly for DNA probe light synthesis and hybridized DNA probe light detection is composed of a silicon substrate, an optical switch array disposed in the substrate, a glass plate mounted on the top of the substrate, and a DNA probe array disposed on the surface of the glass plate. The substrate also contains a driving circuit for forcing each optical switch on and off and an addressing circuit for locating each optical switch. A plurality of holes is disposed in the substrate so that each hole is aligned with an optical switch and guides a light beam to a corresponding optical switch.