Abstract: According to at least some embodiments of the present disclosure, a light-emitting diode (LED) chip includes a semiconductor material portion, a transparent conductive layer disposed above the semiconductor material portion, a current blocking layer disposed above the transparent conductive layer, one or more electrodes disposed above the current blocking layer, and a plurality of electron outflow channels that electrically interconnect at least one electrode and the semiconductor material portion across the transparent conductive layer and the current blocking layer.

Abstract: According to at least some embodiments of the present disclosure, a method of manufacturing semiconductor wafers comprises: selectively growing a nitride buffer layer on a first surface of a patterned substrate, the patterned substrate including at least the first surface and a second surface; and growing an epitaxial layer on the nitride buffer layer, wherein a crystal surface of the epitaxial layer grows along a normal direction of the patterned substrate. The epitaxial layer does not include multiple crystal surfaces having different crystal growth directions that cause a stress at a junction interface where the crystal surfaces having the different crystal growth directions meet.

Abstract: Disclosed is a wafer or a material stack for semiconductor-based optoelectronic or electronic devices that minimizes or reduces misfit dislocation, as well as a method of manufacturing such wafer of material stack. A material stack according to the disclosed technology includes a substrate; a basis buffer layer of a first material disposed above the substrate; and a plurality of composite buffer layers disposed above the basis buffer layer sequentially along a growth direction. The growth direction is from the substrate to a last composite buffer layer of the plurality of composite buffer layers. Each composite buffer layer except the last composite buffer layer includes a first buffer sublayer of the first material, and a second buffer sublayer of a second material disposed above the first buffer sublayer. The thicknesses of the first buffer sublayers of the composite buffer layers decrease along the growth direction.

Abstract: Disclosed is a wafer or a material stack for semiconductor-based optoelectronic or electronic devices that minimizes or reduces misfit dislocation, as well as a method of manufacturing such wafer of material stack. A material stack according to the disclosed technology includes a substrate; a basis buffer layer of a first material disposed above the substrate; and a plurality of composite buffer layers disposed above the basis buffer layer sequentially along a growth direction. The growth direction is from the substrate to a last composite buffer layer of the plurality of composite buffer layers. Each composite buffer layer except the last composite buffer layer includes a first buffer sublayer of the first material, and a second buffer sublayer of a second material disposed above the first buffer sublayer. The thicknesses of the first buffer sublayers of the composite buffer layers decrease along the growth direction.

Abstract: An HV-LED module having 3D light-emitting structure and a method for manufacturing the HV-LED module are disclosed. The HV-LED module has at least two stacked parts of substage LEDs that each have an independent light-emitting structure and are bonded in a staggered pattern, and the substage LEDs are connected in series to form the 3D light-emitting structure, thereby significantly increasing light-emitting power per unit area, downsizing a high-voltage chip module using it by nearly two times, and effectively reducing packaging costs for the HV-LED module.

Abstract: Disclosure is a method for detecting the safety driving state of a driver, the method comprises the following steps: (a) detecting the current sight direction of a driver in real time and acquiring a scene image signal in a front view field of the driver when a vehicle runs; (b) processing the acquired current road scene image signal according to a visual attention calculation model to obtain the expected attention distribution of the driver under the current road scene; and (c) performing fusion analysis on the real-time detected current sight direction of the driver in the step (a) and the calculated expected attention distribution of the driver in step (b), and judging whether the current driver is in a normal driving state and whether the driver can timely make a proper response to the sudden road traffic accident.

Abstract: According to at least some embodiments of the present disclosure, a light-emitting diode (LED) chip includes a semiconductor material portion, a transparent conductive layer disposed above the semiconductor material portion, a current blocking layer disposed above the transparent conductive layer, one or more electrodes disposed above the current blocking layer, and a plurality of electron outflow channels that electrically interconnect at least one electrode and the semiconductor material portion across the transparent conductive layer and the current blocking layer.

Abstract: Disclosed is a method of manufacturing a semiconductor-based wafer for reducing misfit dislocation. The method includes steps of depositing a basis buffer layer of aluminum nitride (AlN) on a substrate; forming an AlN sublayer of a composite buffer layer on the basis buffer layer by supplying pulses of reactants for AlN for a first total pulse time period; forming an gallium nitride (GaN) sublayer of the composite buffer layer on the AlN sublayer by supplying pulses of reactants for GaN for a second total pulse time period; and growing additional composite buffer layers along a growth direction from the substrate to the composite buffer layers, by repeating steps of forming the AlN sublayer and forming the GaN sublayer. The first total pulse time period for each AlN sublayer decreases among the composite buffer layers along the growth direction.

Abstract: Disclosed is a wafer or a material stack for semiconductor-based optoelectronic or electronic devices that minimizes or reduces misfit dislocation, as well as a method of manufacturing such wafer of material stack. A material stack according to the disclosed technology includes a substrate; a basis buffer layer of a first material disposed above the substrate; and a plurality of composite buffer layers disposed above the basis buffer layer sequentially along a growth direction. The growth direction is from the substrate to a last composite buffer layer of the plurality of composite buffer layers. Each composite buffer layer except the last composite buffer layer includes a first buffer sublayer of the first material, and a second buffer sublayer of a second material disposed above the first buffer sublayer. The thicknesses of the first buffer sublayers of the composite buffer layers decrease along the growth direction.

Abstract: Disclosure is a method for detecting the safety driving state of a driver, the method comprises the following steps: (a) detecting the current sight direction of a driver in real time and acquiring a scene image signal in a front view field of the driver when a vehicle runs; (b) processing the acquired current road scene image signal according to a visual attention calculation model to obtain the expected attention distribution of the driver under the current road scene; and (c) performing fusion analysis on the real-time detected current sight direction of the driver in the step (a) and the calculated expected attention distribution of the driver in step (b), and judging whether the current driver is in a normal driving state and whether the driver can timely make a proper response to the sudden road traffic accident.

Abstract: An HV-LED module having 3D light-emitting structure and a method for manufacturing the HV-LED module are disclosed. The HV-LED module has at least two stacked parts of substage LEDs that each have an independent light-emitting structure and are bonded in a staggered pattern, and the substage LEDs are connected in series to form the 3D light-emitting structure, thereby significantly increasing light-emitting power per unit area, downsizing a high-voltage chip module using it by nearly two times, and effectively reducing packaging costs for the HV-LED module.

Abstract: The invention discloses an artificial pairing and breeding method of Platysternon megacephalum. The method comprises the selection of species sources, domestication before pairing, setting of a breeding pond, artificial pairing, collection and hatching of turtle eggs. The method fully considers the ecological and biological characteristics of the Platysternon megacephalum, including the behavior, feeding habit, habitat, and breeding ecology. The main problems in artificial pairing and captive breeding of the Platysternon megacephalum can be effectively solved, including the breeding turtle selection, pairing, pairing stage selection, sex ratio, density, artificial food, setting of the reproduction and hatching environments, the occurrence of disabilities and fatal events during the pairing and mating process is significantly reduced; the egg laying rate of female turtles and the hatching rate of turtle eggs are both significantly improved.

Abstract: The present invention discloses use of borrelidin for preventing and controlling phytophthora root rot of soybean. The present invention also discloses formulations of borrelidin seed coating agents and wettable powders and preparation methods thereof. Borrelidin exhibits significant effects on Phytophthora sojae. As compared with the conventional fungicide metalaxyl which is used for preventing and controlling phytophthora root rot of soybean, the mycelial growth inhibition assay indicates that the IC50 and IC95 values of borrelidin are 1/62 and 1/263, respectively, of those of metalaxyl. In the indoor pot-culture experiment, the seed coating agent and wettable powder exhibit significant controlling effects on phytophthora root rot of soybean.

Abstract: An expandable cooler bag is disclosed. In a particular embodiment, the expandable cooler bag includes a front panel, a rear panel, a plurality of pockets disposed on the front and rear panels, a pair of foldable side panels disposed on opposing sides of the front panel, where the pair of foldable side panels each having a longitudinal crease line to allow each side panel to collapse and expand thereupon. The cooler bag also includes a bottom panel, where the bottom panel is adapted to collapse and expand about a bottom crease line. The plurality of pockets contain a fluid coolant and are sealed. Each pocket of the plurality of pockets are configured to flex about sealed edges of its periphery in at least three different directions to conform to vertical curved surfaces of contents of the bag.

Abstract: The groundwater well sample device is an elongated, cylindrical sample tube, having a top end and a bottom end. The top end is open. A knothole is formed through the wall of the sample tube near the top end. The knothole is large enough for the knotted end of a string to be easily passed through the knothole. A zigzagging string-retaining slot is formed through the sample tube wall, extending from the knothole toward the top end of the sample tube. The string-retaining slot is slightly narrower than the diameter of a string. The string-retaining slot terminates in a stress-reducing aperture. In use, the knotted end of a string is passed through the knothole, and the string then pulled into the string-retaining slot where the string, slightly compressed within the slot, is held tightly in place. The top end is angled to allow easy access to the string-insertion aperture.

Abstract: The groundwater well sample device is an elongated, cylindrical sample tube, having a top end and a bottom end. The top end is open. A knothole is formed through the wall of the sample tube near the top end. The knothole is large enough for the knotted end of a string to be easily passed through the knothole. A zigzagging string-retaining slot is formed through the sample tube wall, extending from the knothole toward the top end of the sample tube. The string-retaining slot is slightly narrower than the diameter of a string. The string-retaining slot terminates in a stress-reducing aperture. In use, the knotted end of a string is passed through the knothole, and the string then pulled into the string-retaining slot where the string, slightly compressed within the slot, is held tightly in place. The top end is angled to allow easy access to the string-insertion aperture.

Abstract: The present invention provides, inter alia, durable and renewable biocidal wooden materials for safe food contact items, such as cutting boards and containers, to be used in home kitchens and the food processing industries. The biocidal food contact surfaces of the present invention reduce and eliminate cross-contamination of diseases and make the surfaces or wood cutting boards safer to use. The biocidal materials inactivate any microorganisms that are deposited and prevent the materials from building up biofilms.