Abstract: A foot pump and an inflatable bed are provided. The foot pump may include: a pump cavity and an air outlet is provided in a sidewall of the pump cavity. The pump cavity is in fluid communication with the inflatable body through the air outlet. An air inlet valve seat is provided at the top of the pump cavity, wherein the air inlet valve seat comprises an air inlet. A diaphragm valve is provided at the air inlet, and the diaphragm valve is arranged inside the pump cavity to allow the air inlet to switch between an open state and a closed state. An elastic return component is provided inside the pump cavity, wherein a first end of the elastic return component abuts against the bottom of the pump cavity, and a second end of the elastic return component abuts against the air inlet valve seat. An inflatable bed including the above-mentioned foot pump is also provided.

Abstract: A sheet and an apparatus and method for manufacturing the sheet are provided. The sheet includes a fabric layer and a covering layer, including a first layer including an elastic polymer material, a second layer including a binding material, and an intermediate layer, between the first layer and the second layer, including a mixture of the elastic polymer material and the binding material. The sheet additionally includes a fabric layer bonded to the binding material of the second layer.

Abstract: A non-inflatable above-ground pool is provided including a pool bottom and a pool wall connected to an edge of the pool bottom to thereby enclose a water storage cavity. The pool bottom includes interconnected upper bottom sheet and lower bottom sheets. The pool wall includes an inner and outer wall and a top sheet. Each of the inner wall and outer walls have an upper edge connected to the top sheet and a lower edge connected to the pool bottom, defining a filling chamber. Alternatively, inner and outer walls and top sheets are connected to an upper edge of each of the inner wall and the outer wall, thereby enclosing a filling chamber. A lower edge of the inner wall may be connected to the lower bottom sheet. A support wall body is disposed within the filling chamber, and in an embodiment, includes a wall body opening therethrough.

Abstract: A non-inflatable above-ground pool is provided, including: a pool bottom and a pool wall connected to an edge of the pool bottom, together defining a water storage cavity. The pool wall comprises an inner wall, an outer wall, and a top sheet. Each of the inner wall and the outer wall have an upper edge connected to the top sheet and a lower edge connected to the pool bottom so as to define a filling chamber. A support wall body is disposed in the filling chamber and includes a wall body opening therethrough. A control box is arranged in the wall body opening and is in fluid communication with the water storage cavity via the inner wall.

Abstract: A pool cleaning device is provided, including: a main body; a rotating unit rotatably disposed on the main body, the rotating unit including a rotating member, a fluid outlet extending radially outward from the rotating member, and a first positioning protrusion extending radially outward from the rotating member and spaced apart from the fluid outlet; and a reversing member including a plurality of stoppers spaced apart from each other and disposed along a path of rotation of the rotating member. Each of the plurality of stoppers is reciprocable between a position in a path of rotation of the first positioning protrusion and a position out of the path of rotation of the first positioning protrusion.

Abstract: An inflatable pool having a built-in seat is provided. The inflatable pool may include: a pool body comprising a bottom wall and a side wall, together defining a water-holding space; and an inflatable stool disposed in a water-holding space. The inflatable stool may include a top sheet, a side enclosure sheet, and an inflation chamber defined by the top sheet and the side enclosure sheet. The inflatable stool may be fixedly connected to the bottom wall or may be connected to the bottom wall in a detachable manner.

Abstract: An electric leakage protection device for a pool apparatus is provided. The electric leakage protection device may be arranged on a control board of the pool apparatus. The electric leakage protection device comprises: a leakage current detection module configured to detect whether there is a leakage current in a ground wire; and a control circuit operatively connected to the leakage current detection module, wherein the leakage current detection module transmits an electric leakage detection signal to the control circuit in response to detecting the leakage current.

Abstract: An inflatable stand-up paddle board (SUP) and a built-in inflation pump are provided. The inflation pump includes a pump body incorporated into a body of the SUP, an inflation assembly, and inflation and deflation valves in communication with an air chamber of the SUP. The body of the SUP includes first and second surfaces and a lateral confining band extending in a circumferential direction of the SUP and covering edges of the first and second surfaces. A mounting space may extend through the air chamber and the inflation pump may be mounted within the mounting space.

Abstract: A heat spreader for printed wiring boards and a method of manufacture are disclosed. The heat spreader is made from a plurality of graphene sheets that are thermo-mechanically bonded using an alloy bonding process that forms a metal alloy layer using a low temperature and pressure that does not damage the graphene sheets. The resulting heat spreader has a higher thermal conductivity than graphene sheets alone.

Abstract: A sensor assembly for determining whether a hermetically sealed cavity between opposing substrate wafers in a wafer level packaged (WLP) chip is leaking. The sensor assembly includes a thermal insulating layer provided within the cavity, and a heater and temperature sensor deposited on the insulation layer. The thermal insulating layer is made of a suitable dielectric that is compatible with WLP and MMIC fabrication processes and can be, for example, benzocyclobutene (BCB) or polyimide. The sensor is responsive to a current that heats the thermal insulation layer so that heat dissipated by the thermal insulation layer is drawn away by gas between the layer and the substrate that determines the temperature of the sensor, which is detected.

Abstract: A method of manufacturing electronics using a nanoparticle ink printing method includes: synthesizing a phase change material (PCM) ink composition using hot injection to develop nanoparticles of the PCM; suspending the nanoparticles with a solvent; and printing a reconfigurable component using the PCM ink composition in additive manufacturing. Electronics includes: a substrate layer; an insulator layer printed on top of the substrate layer; a heater layer printed on top of the insulator layer; a barrier layer printed on top of one or more of the insulator layer and the heater layer; a phase change material (PCM) printed on top of the barrier layer; a connectivity layer printed on top of the PCM; and a passivation layer printed on top of one or more of the PCM and the connectivity layer.

Abstract: A heat spreader for printed wiring boards and a method of manufacture are disclosed. The heat spreader is made from a plurality of graphene sheets that are thermo-mechanically bonded using an alloy bonding process that forms a metal alloy layer using a low temperature and pressure that does not damage the graphene sheets. The resulting heat spreader has a higher thermal conductivity than graphene sheets alone.

Abstract: A vertical cavity surface emitting laser (VCSEL) including a substrate and a bottom distributed Bragg reflector (DBR) having a plurality of layers deposited on the substrate. The VCSEL also includes a first charge confining layer deposited on the bottom DBR, an active region deposited on the first charge confining layer, and a second charge confining layer deposited on the active region. A current blocking layer is provided on the second charge confining layer, and a top epitaxial DBR including a plurality of top epitaxial DBR layers is deposited on the current blocking layer. A top electrode is deposited on the top epitaxial DBR, a bottom electrode is deposited on the bottom DBR and adjacent to the active region, and a top dielectric DBR is deposited on the top epitaxial DBR and the top electrode.

Abstract: A heat spreader for printed wiring boards and a method of manufacture are disclosed. The heat spreader is made from a plurality of graphene sheets that are thermo-mechanically bonded using an alloy bonding process that forms a metal alloy layer using a low temperature and pressure that does not damage the graphene sheets. The resulting heat spreader has a higher thermal conductivity than graphene sheets alone.

Abstract: A method of manufacturing electronics using a nanoparticle ink printing method includes: synthesizing a phase change material (PCM) ink composition using hot injection to develop nanoparticles of the PCM; suspending the nanoparticles with a solvent; and printing a reconfigurable component using the PCM ink composition in additive manufacturing. Electronics includes: a substrate layer; an insulator layer printed on top of the substrate layer; a heater layer printed on top of the insulator layer; a barrier layer printed on top of one or more of the insulator layer and the heater layer; a phase change material (PCM) printed on top of the barrier layer; a connectivity layer printed on top of the PCM; and a passivation layer printed on top of one or more of the PCM and the connectivity layer.

Abstract: A three-dimensional wafer level packaged (WLP) integrated circuit that includes a pair of opposing circuit cells fabricated on separate wafers that have been bonded together to provide vertical circuit redundancy. The integrated circuits on each of the separate wafers are performance tested prior to the wafers being bonded together so as to designate good performing circuits as active circuit cells and poor performing circuits as inactive circuit cells. The inactive circuit cell for a particular pair of integrated circuits is metalized with a short circuiting metal layer to make it inoperable. The WLP integrated circuit implements a yield-enhancing circuit redundancy scheme on spatially uncorrelated wafers that avoids wasting valuable wafer x-y planar area, which provides cost savings as a result of more wafer area being available for distinct circuits on each wafer rather than sacrificed for traditional side-by-side redundant copies of circuits.

Abstract: A plasma power limiter fabricated using wafer-level fabrication techniques with other circuit elements. The plasma limiter includes a signal substrate and a trigger substrate defining a hermetically sealed cavity therebetween in which is encapsulated an ionizable gas. The signal substrate includes a signal line within the cavity and the trigger substrate includes at least one trigger probe extending from the trigger substrate towards the transmission line. If a signal propagating on the transmission line exceeds a power threshold, the gas within the cavity is ionized creating a conduction path between the transmission line and the trigger probe that draws off the high power current.

Abstract: A wafer-level package that employs one or more integrated hydrogen getters within the wafer-level package on a substrate wafer or a cover wafer. The hydrogen getters are provided between and among the integrated circuits on the substrate wafer or the cover wafer, and are deposited during the integrated circuit fabrication process. In one non-limiting embodiment, the substrate wafer is a group III-V semiconductor material, and the hydrogen getter includes a titanium layer, a nickel layer, and a palladium layer.

Abstract: A method for mounting a dielectric substrate to a semiconductor substrate, such as mounting a dielectric antenna substrate to an MMIC semiconductor substrate. The method includes providing a thin dielectric antenna substrate having metallized layers on opposing sides. In one embodiment, carrier wafers are used to handle and maintain the dielectric substrate in a flat configuration as the metallized layers are patterned. The dielectric substrate is sealed to the semiconductor substrate using a low temperature bonding process. In an alternate embodiment, the metallized layers on the dielectric substrate are patterned simultaneously so as to prevent the substrate from curling.

Abstract: A wafer circuit, such as a wafer-level package, that includes a semiconductor substrate on which is fabricated one or more integrated circuits. A backside metal layer is deposited on the semiconductor substrate, and is electrically coupled to the integrated circuit by metallized vias extending through the substrate wafer. The backside metal layer is cut to provide electrically isolated backside metal layers for RF, DC and/or ground signals. An adhesion layer is deposited on the backside of the substrate before the metal layer is deposited so that the metal layer is firmly secured to the substrate, and resists peeling. The adhesion layer can be sputtered silicon, sputtered silicon nitride, silicon nitride deposited by chemical vapor deposition, nickel deposited by evaporation and nickel chromium deposited by evaporation.