Abstract: A substrate for integrated circuit package is disclosed. The substrate comprises an electrically conductive leadframe having a first side and an opposing second side. The substrate has a first bonding compound disposed in a first recessed portion of the first side and a second bonding compound disposed in at least a portion of a second recessed portion of the leadframe, selectively exposing a selected area of the leadframe on the second side. In an exemplary embodiment, the second bonding compound is a photolithographic material. A method of manufacturing a substrate for integrated circuit package is also disclosed.

Abstract: A substrate and a method of making thereof are disclosed. The substrate comprises an electrically conductive leadframe, the leadframe having a plurality of lands on a first side of the leadframe with a first recessed portion between the lands, and a plurality of routing leads on an opposing second side of the leadframe with a second recessed portion between the routing leads. The substrate also comprises a first bonding compound filling the first recessed portion. In one embodiment, the substrate also comprises a support material attached to the first bonding compound for holding the leadframe together. In another embodiment, the substrate comprises a second bonding compound filling the second recessed portion.

Abstract: A substrate and a method of making thereof are disclosed. The substrate comprises an electrically conductive leadframe, the leadframe having a plurality of lands on a first side of the leadframe with a first recessed portion between the lands, and a plurality of routing leads on an opposing second side of the leadframe with a second recessed portion between the routing leads. The substrate also comprises a first bonding compound filling the first recessed portion. In one embodiment, the substrate also comprises a support material attached to the first bonding compound for holding the leadframe together. In another embodiment, the substrate comprises a second bonding compound filling the second recessed portion.

Abstract: A lens module array comprising a spacer plate comprising (i) first and second surfaces, and (ii) an array of lens barrels, each lens barrel comprising (1) a lens opening extending inward from the first surface of the spacer plate, and (2) a sensor cavity extending inward from the second surface of the spacer plate to meet the lens opening; and (b) at least one lens positioned over each lens opening of a lens barrel, the outer circumference of the lens being attached to the spacer plate.

Abstract: A lens assembly comprises a spacer plate having first and second surfaces, and an array of lens barrels that each comprise a lens opening extending inward from the first surface of the spacer plate and a sensor cavity extending inward from the second surface of the spacer plate. An alignment tool comprising an array of alignment holes or prongs is used to align the lens to the orifices of the lens openings.

Abstract: A method for transmitting audio data of a plurality of audio sources through a single SPDIF link, includes: sequencing and multiplexing the audio data of the plurality of audio sources to pack the audio data of the plurality of audio sources into a plurality of frames of a block; performing bi-phase mark encoding on the audio data in the frames; appending preambles Z, X, and Y of the AES3/SPDIF stream format to the frames according to the number of audio sources in a first mode, or appending preambles Z, X, and Y of the AES3/SPDIF stream format and a specific preamble differing from preambles Z, X, and Y to the frames according to the number of audio sources in a second mode; and outputting the frames carrying the audio data into the SPDIF link with a frame rate greater than an audio sampling frequency of one of the audio sources.

Abstract: A lens assembly comprises a spacer plate having first and second surfaces, and an array of lens barrels that each comprise a lens opening extending inward from the first surface of the spacer plate and a sensor cavity extending inward from the second surface of the spacer plate. An alignment tool comprising an array of alignment holes or prongs is used to align the lens to the orifices of the lens openings.

Abstract: An antenna comprising a network of arrayed radiating elements, a first reflective means comprising a flat central part upon which are disposed the radiating elements and longitudinally folded edges on either side of the array of elements, and at least one second reflective means which is a choke reflector disposed outside of the space separating the radiating elements of the reflector's folded edge.

Abstract: A computing system is communicated with a metal fabrication device for analyzing performance of an industrial robot. The metal fabrication device includes the industrial robot, and a plate bender. The computing system is operable to generate an analysis report of the performance of the industrial robot by providing section model creating function, bending point obtainting function, bending operation monitoring function, workpiece modeling function for the metal fabrication device. The quality of a finished workpiece bent by the industrial robot from a metal plate may be analyzed from the analysis report generated by the computing system.

Abstract: A clamp changing apparatus includes a holder (70) including a plurality of clamp-holding devices (72), each of which holding a clamp (10) thereon, a robot (50) including a shaft (501), and a coupling device (30) secured on the shaft of the robot. The robot selects one of the clamps held on the clamp-holding devices according to a predetermined machining program therein, changes out a used clamp for the selected clamp, and mounts the selected clamp on the coupling device.

Abstract: A production monitoring system for remotely monitoring a production device includes a database, a monitoring device, and a translating device. The database saves attribute data of the production device, and the attribute data includes operation signals, operation statuses, and production data. The monitoring device sends a monitoring message. The translating device translates attribute data sent by the production device into data recognizable to the monitoring device, and includes a parsing module and a performing module. The parsing module parses the attribute data sent by the production device, determines whether the attribute data matches previous attribute data, and classifies the attribute data if the attribute data does not match the previous attribute data. The performing module receives and processes the monitoring message sent by the monitoring device, receives the classified attribute data from the parsing module, and sends the classified attribute data to the monitoring device.

Abstract: A method for transmitting audio data of a plurality of audio sources through a single SPDIF link, includes: sequencing and multiplexing the audio data of the plurality of audio sources to pack the audio data of the plurality of audio sources into a plurality of frames of a block; performing bi-phase mark encoding on the audio data in the frames; appending preambles Z, X, and Y of the AES3/SPDIF stream format to the frames according to the number of audio sources in a first mode, or appending preambles Z, X, and Y of the AES3/SPDIF stream format and a specific preamble differing from preambles Z, X, and Y to the frames according to the number of audio sources in a second mode; and outputting the frames carrying the audio data into the SPDIF link with a frame rate greater than an audio sampling frequency of one of the audio sources.

Abstract: A clamp changing apparatus includes a holder (70) including a plurality of clamp-holding devices (72), each of which holding a clamp (10) thereon, a robot (50) including a shaft (501), and a coupling device (30) secured on the shaft of the robot. The robot selects one of the clamps held on the clamp-holding devices according to a predetermined machining program therein, changes out a used clamp for the selected clamp, and mounts the selected clamp on the coupling device.

Abstract: A method for producing a cis-9, trans-11 fatty acid from a fatty acid containing double bonds in the cis-configuration at positions 9 and 12, includes the step of combining a Lactobacillus microorganism with free fatty acids in a fermentation process. The conjugated fatty acid products can include, for example, cis-9, trans-11 conjugated linoleic acid (CLA).

Abstract: A method for producing a cis-9, trans-11 fatty acid from a fatty acid containing double bonds in the cis-configuration at positions 9 and 12, includes the step of combining a Lactobacillus microorganism with free fatty acids in a fermentation process. The conjugated fatty acid products can include, for example, cis-9, trans-11 conjugated linoleic acid (CLA).