Abstract: A semiconductor device is formed on a semiconductor substrate. The device comprises a drain, an epitaxial layer overlaying the drain, and an active region. The active region comprises a body disposed in the epitaxial layer, having a body top surface and a body bottom surface, a source embedded in the body, extending from the body top surface into the body, a gate trench extending into the epitaxial layer, a gate disposed in the gate trench, an active region contact trench extending through the source and at least part of the body into the drain, wherein the active region contact trench is shallower than the body bottom surface, and an active region contact electrode disposed within the active region contact trench.

Abstract: A semiconductor device is formed on a semiconductor substrate. The device includes a drain, an epitaxial layer overlaying the drain, and an active region. The active region includes a body disposed in the epitaxial layer, having a body top surface, a source embedded in the body, extending from the body top surface into the body, a gate trench extending into the epitaxial layer, a gate disposed in the gate trench, an active region contact trench extending through the source and into the body, an active region contact electrode disposed within the active region contact trench, wherein a thin layer of body region separating the active region contact electrode from the drain.

Abstract: A semiconductor device is formed on a semiconductor substrate. The semiconductor device comprises a drain, an epitaxial layer overlaying the drain, and an active region. The active region comprises a body disposed in the epitaxial layer, having a body top surface, a source embedded in the body, extending from the body top surface into the body, a gate trench extending into the epitaxial layer, a gate disposed in the gate trench, an active region contact trench extending through the source and the body into the drain, an active region contact electrode disposed within the active region contact trench, wherein the active region contact electrode and the drain form a Schottky diode, and a Schottky barrier controlling layer disposed in the epitaxial layer adjacent to the active region contact trench.

Abstract: An adhesive formulation including an acrylate monomer and/or a methacrylate monomer, a chlorosulfonated polymer resin, and a reducing agent. The adhesive also includes a cycloheteroatom zirconate or a cycloheteroatom titannate, which is utilized as a cure profile regulator. Further, the adhesive includes toughening-agent copolymers having a very low Tg to increase impact strength of the cured adhesives at low temperatures.

Abstract: A semiconductor package assembly may include a lead frame having a die bonding pad and plurality of leads coupled to the first die bonding pad. A vertical semiconductor device may be bonded to the die bonding pad. The device may have a conductive pad electrically connected to one lead through a first bond wire. An electrically isolated conductive trace may be formed from a layer of conductive material of the first semiconductor device. The conductive trace provides an electrically conductive path between the first bond wire and a second bond wire. The conductive path may either pass underneath a third bond wire thereby avoiding the third bond wire crossing another bond wire, or the conductive path may result in a reduced length for the first and second bond wires that is less than a predetermined maximum length.

Abstract: This invention discloses a semiconductor power device that includes an active cell area having a plurality of power transistor cells. Each of said power transistor cells has a planar Schottky diode that includes a Schottky junction barrier metal covering areas above gaps between separated body regions between two adjacent power transistor cells. The separated body regions further provide a function of adjusting a leakage current of said Schottky diode in each of said power transistor cells. Each of the planar Schottky diodes further includes a Shannon implant region disposed in a gap between the separated body regions of two adjacent power transistor cells for further adjusting a leakage current of said Schottky diode. Each of the power transistor cells further includes heavy body doped regions in the separated body regions next to source regions surrounding said Schottky diode forming a junction barrier Schottky (JBS) pocket region.

Abstract: An adhesive formulation including an acrylate monomer and/or a methacrylate monomer, a chlorosulfonated polymer resin, and a reducing agent. The adhesive also includes a cycloheteroatom zirconate or a cycloheteroatom titannate, which is utilized as a cure profile regulator. Further, the adhesive includes toughening-agent copolymers having a very low Tg to increase impact strength of the cured adhesives at low temperatures.

Abstract: An adhesive formulation including an acrylate monomer and/or a methacrylate monomer, a chlorosulfonated polymer resin, and a reducing agent. The adhesive also includes a cycloheteroatom zirconate or a cycloheteroatom titannate, which is utilized as a cure profile regulator. Further, the adhesive includes toughening-agent copolymers having a very low Tg to increase impact strength of the cured adhesives at low temperatures.

Abstract: Certain exemplary embodiments can provide for automatic power control and/or torque boost for retarding a machine that considers a machine weight and/or a machine slope. The automatic power control and/or torque boost can provide a control margin under retard. Certain exemplary embodiments can control, or attempt to control, a speed of the machine at less than a maximum safe speed.

Abstract: Certain exemplary embodiments comprise a method, which can comprise automatically setting a service brake of a mining haulage vehicle. The service brake can be set responsive to a determination that a wheel comprising a wheel motor is rotating at a rotational speed that is above a predetermined rotational speed. In certain exemplary embodiments, the service brake can be automatically released.

Abstract: A perpendicular magnetic recording medium adapted for high recording density and high data recording rate comprises a non-magnetic substrate having at least one surface with a layer stack formed thereon, the layer stack including a perpendicular recording layer containing a plurality of columnar-shaped magnetic grains extending perpendicularly to the substrate surface for a length, with a first end distal the surface and a second end proximal the surface, wherein each of the magnetic grains has: (1) a gradient of perpendicular magnetic coercivity Hk extending along its length between the first end and second ends; and (2) predetermined local exchange coupling strengths along the length.

Abstract: Adhesive formulations having acrylate monomer or methacrylate monomer, or mixtures thereof, and having a reducing agent and an initiator (e.g., peroxide). The formulations may include a chelating agent solution to improve storage stability and other properties. Further, the mole ratio of the initiator to the reducing agent may be adjusted to control weight loss of the adhesives during cure. Polyvinyl acetate or its derivatives may also be employed in the adhesive formulations to reduce weight loss during cure. Moreover, certain embodiments of the formulations include a toughening-agent copolymer having a glass transition temperature (of at least one domain) that is lower than ?50° C. (?58° F.). These toughening-agent copolymers may be added to the adhesive formulations to improve impact strength and other properties of the cured adhesives at lower temperatures, e.g., ?40° C. (?40 ° F.), while maintaining performance of the cured adhesives at higher temperatures, e.g., 82° C. (180° F.).

Abstract: An adhesive formulation including an acrylate monomer and/or a methacrylate monomer, a chlorosulfonated polymer resin, and a reducing agent. The adhesive also includes a cycloheteroatom zirconate or a cycloheteroatom titannate, which is utilized as a cure profile regulator. Further, the adhesive includes toughening-agent copolymers having a very low Tg to increase impact strength of the cured adhesives at low temperatures.

Abstract: Certain exemplary embodiments can provide for automatic power control and/or torque boost for retarding a machine. The automatic power control and/or torque boost can provide a control margin under retard. Certain exemplary embodiments comprise a method comprising: for a machine comprising a wheel drive system comprising a braking system, comparing an acceleration to a predetermined acceleration threshold; determining a dynamic maximum retard torque associated with the braking system based on said comparing activity; controlling a retard torque to no greater than the dynamic maximum retard torque; and affecting a retard power.

Abstract: Certain exemplary embodiments comprise a method comprising: receiving a measurement of a vehicle speed; receiving information indicative of a drive speed; comparing a value related to the measurement of the vehicle speed with the information indicative of the drive speed to obtain a first speed deviation metric; and controlling a torque output of the drive within a limited range, the limited range at least partially based upon the first speed deviation metric.

Abstract: Certain exemplary embodiments can provide for automatic power control and/or torque boost for retarding a machine that considers a machine weight and/or a machine slope. The automatic power control and/or torque boost can provide a control margin under retard. Certain exemplary embodiments can control, or attempt to control, a speed of the machine at less than a maximum safe speed.

Abstract: Certain exemplary embodiments can provide for automatic power control and/or torque boost for retarding a machine. The automatic power control and/or torque boost can provide a control margin under retard. Certain exemplary embodiments comprise a method comprising: for a machine comprising a wheel drive system comprising a braking system, comparing an acceleration to a predetermined acceleration threshold; determining a dynamic maximum retard torque associated with the braking system based on said comparing activity; controlling a retard torque to no greater than the dynamic maximum retard torque; and affecting a retard power.

Abstract: Certain exemplary embodiments comprise a method comprising: receiving a measurement of a vehicle speed; receiving information indicative of a drive speed; comparing a value related to the measurement of the vehicle speed with the information indicative of the drive speed to obtain a first speed deviation metric; and controlling a torque output of the drive within a limited range, the limited range at least partially based upon the first speed deviation metric.

Abstract: A two-part adhesive comprising acrylic and/or methacrylic monomers, and advantageously toughening agents, impact modifiers including graft co-polymer (core-shell and non core-shell) impact modifiers, carboxylic acids, reducing agents, inhibitors, retarding agents, initiators and chain transfer agents is provided. Particularly advantageous reducing agents include anilines, toluidines, substituted anilines and substituted toluidines. The adhesive composition in accordance with the invention can achieve working times of 40 to 80 minutes or longer at 95° F., exhibits superior low-sliding performance, is resistant to boiling even for larger beads, and is non-sagging. In addition the adhesive composition of this invention achieves superior characteristics of high bonding strength, high impact strength, high tensile strength and high elongation of the cured adhesive.

Abstract: The silylated polyurethane polymer includes a polyurethane prepolymer having between greater than about 50 to about 95% of NCO groups terminated with silane capping agents. The polymer has an improved mechanical properties. The polymer can also have between about 5% to less than about 50% of the NCO groups terminated with low molecular weight terminators.