Abstract: Film bulk acoustic resonator (FBAR) is provided. An exemplary FBAR includes a substrate; a first insulating material layer on the substrate, the first insulating material layer containing a first cavity; a second insulating material layer on the first insulating material layer, the second insulating material layer containing a second cavity and a third cavity spaced apart from the second cavity, the second cavity and the third cavity both in communication with the first cavity; a resonator sheet covering the second cavity and partially extending over the second insulating material layer; a third insulating material layer over the second insulating material layer and the resonator sheet, the third insulating material layer containing a fourth cavity, the fourth cavity in communication with the third cavity, and the fourth cavity partially overlapping the second cavity; and a capping layer on the third insulating material layer.

Abstract: The present disclosure provides a pH-sensitive membranolytic polymer material and a preparation method and application thereof. The pH-sensitive membranolytic polymer material has the structure shown in Formula (I). At normal physiological pH, the polymer material is hydrophobic neutral, and can be self-assembled into PEG coated nanoparticles with weak interaction with cell membrane; when the pH decreases, the polymer material can be protonated to form an amphiphilic structure consisting of hydrophobic domain and cationic domain, which has strong interaction with the cell membrane and strong membranolytic activity, so the polymer material can kill tumor cells or bacteria efficiently and selectively.

Abstract: Methods for forming a film bulk acoustic resonator (FBAR) are provided. In the method, formation of several mutually overlapped and hence connected sacrificial material layers above and under a resonator sheet facilitates the removal of the sacrificial material layers. Cavities left after the removal overlap at a polygonal area with non-parallel sides. This reduces the likelihood of boundary reflections of transverse parasitic waves causing standing wave resonance in the FBAR, thereby enhancing its performance in parasitic wave crosstalk. Further, according to the disclosure, the FBAR is enabled to be integrated with CMOS circuitry and hence exhibits higher reliability.

Abstract: A thermoformable film including a polyethylene composition. The polyethylene composition includes a first polyethylene which is an ethylene copolymer having a weight average molecular weight of from 70,000 to 250,000 and a molecular weight distribution Mw/Mn of <2.3, a second polyethylene which is an ethylene copolymer or homopolymer having a weight average molecular weight of less than 75,000 and a molecular weight distribution Mw/Mn of <2.3, a third polyethylene which is an ethylene copolymer or homopolymer having a weight average molecular weight of less than 75,000 and a molecular weight distribution Mw/Mn of <2.3, and a fourth polyethylene which is an ethylene copolymer or homopolymer having a weight average molecular weight of from 100,000 to 250,000 and a molecular weight distribution Mw/Mn of >2.3, where the first polyethylene has more short chain branching than the second polyethylene or the third polyethylene.

Abstract: A polyethylene composition which when made into a film layer having a thickness of about 1 mil exhibits a machine direction (MD) 1% secant modulus of ?190 MPa and an oxygen transmission rate (OTR) of ?650 cm3 per 100 inch2 per day, and when made into a film layer having a thickness of about 2 mil exhibits a seal initiation temperature (SIT) of ?100° C. and an area of hot tack window (AHTW) of ?160 Newtons·° C.

Abstract: A polyethylene composition which when made into a film layer having a thickness of about 1 mil has a machine direction (MD) 1% secant modulus of ?200 MPa and an oxygen transmission rate (OTR) of ?600 cm3 per 100 inch2 per day and when made into a film layer having a thickness of about 2 mil has a seal initiation temperature (SIT) of ?90° C. and an area of hot tack window (AHTW) of ?160 Newtons·° C.

Abstract: A polyethylene composition includes a first polyethylene which is an ethylene copolymer having a weight average molecular weight of from 70,000 to 250,000 and a molecular weight distribution Mw/Mn of <2.3, a second polyethylene which is an ethylene copolymer or homopolymer having a weight average molecular weight of from 15,000 to 100,000 and a molecular weight distribution Mw/Mn of <2.3, and a third polyethylene which is an ethylene copolymer or homopolymer having a weight average molecular weight of from 70,000 to 250,000 and a molecular weight distribution Mw/Mn of >2.3, where the first polyethylene has more short chain branching than the second polyethylene or the third polyethylene. The polyethylene composition has a soluble fraction in a CEF analysis of at least 10 weight percent. Film made from the polyethylene composition may have a machine direction 1% secant modulus of ?190 MPa (at a film thickness of about 1 mil), a seal initiation temperature (SIT) of ?100° C.

Abstract: A polyethylene composition comprises a first polyethylene which is an ethylene copolymer having a weight average molecular weight of from 70,000 to 250,000 and a molecular weight distribution Mw/Mn of <2.3, a second polyethylene which is an ethylene copolymer or homopolymer having a weight average molecular weight of from 50,000 to 200,000 and a molecular weight distribution Mw/Mn of <2.3, and a third polyethylene which is an ethylene copolymer or homopolymer having a weight average molecular weight of from 70,000 to 200,000 and a molecular weight distribution Mw/Mn of <2.3, where the first polyethylene has more short chain branching than the second polyethylene or the third polyethylene. The polyethylene composition has a composition distribution breadth index, CDBI50 obtained from a crystallization elution fractionation (CEF) analysis of <45 weight %.

Abstract: A dual reactor solution process gives high density polyethylene compositions containing a first ethylene copolymer and a second ethylene copolymer and which have good processability, stiffness, and environmental stress crack resistance. The polyethylene compositions are suitable for compression molding or injection molding applications and are particularly useful in the manufacture of caps and closures for bottles.

Abstract: A polyethylene composition includes a first polyethylene which is an ethylene copolymer having a weight average molecular weight of from 70,000 to 250,000 and a molecular weight distribution Mw/Mn of <2.3, a second polyethylene which is an ethylene copolymer or homopolymer having a weight average molecular weight of from 15,000 to 100,000, a molecular weight distribution Mw/Mn of >2.3, and a third polyethylene which is an ethylene copolymer or homopolymer having a weight average molecular weight of from 70,000 to 250,000 and a molecular weight distribution Mw/Mn of >2.3, where the first polyethylene has more short chain branching than the second polyethylene or the third polyethylene. The polyethylene composition has a soluble fraction in a CEF analysis of at least 10 weight percent. Film made from the polyethylene composition may have a machine direction 1% secant modulus of 200 ?MPa (at a film thickness of about 1 mil), a seal initiation temperature (SIT) of ?90° C.

Abstract: The present invention provides a semiconductor structure for a split gate flash memory cell and a method of manufacturing the same. The split gate flash memory cell provided by the present invention at least includes a select gate and a floating gate formed on the substrate, one side of the select gate is formed with an isolation wall, and the floating gate is on the other side of the isolation wall. An ion implantation region is formed in an upper portion of the substrate below the isolation wall, wherein the ion implantation type of the ion implantation region is different from the ion implantation type of the substrate. The invention also provides a manufacturing method for manufacturing the above-mentioned split gate flash memory cell, and the manufacturing method provided by the invention can be compatible with the existing manufacturing process of the split gate flash memory cell without increasing the process cost and the process complexity.

Abstract: The copolymerization of ethylene with a cyclic mono olefin (such as norbornene) is conducted in the presence of a catalyst system comprising a bridged hafnocene catalyst and a three part activator. The catalyst system provides excellent activity at high polymerization temperatures. Copolymers produced according to this invention have unique microstructure (with methyl branching being observed) and unique rheology.

Abstract: A polyethylene composition including a first polyethylene which is an ethylene copolymer having a weight average molecular weight of from 70,000 to 250,000 and a molecular weight distribution Mw/Mn of <2.3, a second polyethylene which is an ethylene copolymer or homopolymer having a weight average molecular weight of less than 75,000 and a molecular weight distribution Mw/Mn of <2.3, and a third polyethylene which is an ethylene copolymer or homopolymer having a weight average molecular weight of from 100,000 to 300,000 and a molecular weight distribution Mw/Mn of >2.3, where the first polyethylene has more short chain branching than the second polyethylene or the third polyethylene. The polyethylene composition has a soluble fraction in a CEF analysis of at least 15 weight percent.

Abstract: A thermoformable film including a polyethylene composition. The polyethylene composition includes a first polyethylene which is an ethylene copolymer having a weight average molecular weight of from 70,000 to 250,000 and a molecular weight distribution Mw/Mn of <2.3, a second polyethylene which is an ethylene copolymer or homopolymer having a weight average molecular weight of less than 75,000 and a molecular weight distribution Mw/Mn of <2.3, a third polyethylene which is an ethylene copolymer or homopolymer having a weight average molecular weight of less than 75,000 and a molecular weight distribution Mw/Mn of <2.3, and a fourth polyethylene which is an ethylene copolymer or homopolymer having a weight average molecular weight of from 100,000 to 250,000 and a molecular weight distribution Mw/Mn of >2.3, where the first polyethylene has more short chain branching than the second polyethylene or the third polyethylene.

Abstract: A thermoformable film comprises a polyethylene composition. The polyethylene composition comprises a first polyethylene which is an ethylene copolymer having a weight average molecular weight of from 70,000 to 250,000 and a molecular weight distribution Mw/Mn of <2.3, a second polyethylene which is an ethylene copolymer or homopolymer having a weight average molecular weight of from 15,000 to 100,000 and a molecular weight distribution Mw/Mn of <2.3, and a third polyethylene which is an ethylene copolymer or homopolymer having a weight average molecular weight of from 70,000 to 250,000 and a molecular weight distribution Mw/Mn of >2.3, where the first polyethylene has more short chain branching than the second polyethylene or the third polyethylene. The polyethylene composition has a melt flow ratio (I21/I2) of 50 and an area Dimensional Thermoformability Index (aDTI) at 105° C. of less than 15.

Abstract: A dual reactor solution polymerization process gives polyethylene compositions containing a first ethylene copolymer and a second ethylene copolymer and which has a balance of barrier properties, toughness and environmental resistance. The polyethylene compositions are suitable for end use applications which may benefit from low oxygen transmission rates such as closures for bottles or barrier film.

Abstract: A polyethylene composition including a first polyethylene which is an ethylene copolymer having a weight average molecular weight of from 70,000 to 250,000 and a molecular weight distribution Mw/Mn of <2.3, a second polyethylene which is an ethylene copolymer or homopolymer having a weight average molecular weight of from 50,000 to 200,000 and a molecular weight distribution Mw/Mn of <2.3, and a third polyethylene which is an ethylene copolymer or homopolymer having a weight average molecular weight of from 70,000 to 200,000 and a molecular weight distribution Mw/Mn of <2.3, where the first polyethylene has more short chain branching than the second polyethylene or the third polyethylene.

Abstract: A dual reactor solution polymerization process gives high density polyethylene compositions containing a first ethylene copolymer and a second ethylene copolymer. The polyethylene compositions can be used in the manufacture of injection molded closures or cast film having good barrier properties.

Abstract: In some embodiments disclosed herein are polyethylene composition including a first polyethylene which is an ethylene copolymer having a weight average molecular weight of from 70,000 to 250,000 and a molecular weight distribution Mw/Mn of <2.3, a second polyethylene which is an ethylene copolymer or homopolymer having a weight average molecular weight of less than 75,000 and a molecular weight distribution Mw/Mn of <2.3, a third polyethylene which is an ethylene copolymer or homopolymer having a weight average molecular weight of less than 75,000 and a molecular weight distribution Mw/Mn of <2.3, and a fourth polyethylene which is an ethylene copolymer or homopolymer having a weight average molecular weight of from 100,000 to 250,000 and a molecular weight distribution Mw/Mn of >2.3, where the first polyethylene has more short chain branching than the second polyethylene or the third polyethylene. The polyethylene composition may have a soluble fraction in a CEF analysis of at least 7.

Abstract: A polyethylene homopolymer composition comprises: a first ethylene homopolymer having a density, d1 of from 0.943 to 0.975 g/cm3, a melt index, I21 of from 0.01 to 10 g/10 min, and a molecular weight distribution, Mw/Mn of less than 3.0; and a second ethylene homopolymer having a density, d2 of from 0.950 to 0.985 g/cm3, a melt index, I22 of at least 500 g/10 min, and a molecular weight distribution, Mw/Mn of less than 3.0; wherein the ratio of the melt index, I22 of the second ethylene homopolymer to the melt index, I21 of the first ethylene homopolymer is at least 50. The polyethylene homopolymer compositions which may be nucleated have a weight average molecular weight, Mw of ?75,000, a high load melt index, I21 of at least 200 g/10 min, a molecular weight distribution, Mw/Mn of from 4.0 to 12.0 and may be usefully employed in molding applications, such as, for example, in compression molded closures.