Abstract: In some embodiments, a lighting apparatus includes a light passing cover, two light bars, a base bracket, two terminal covers, a driver module and an internal cover. The light passing cover is made with a flexible material. The two light bars are disposed on the base plate for generating a light passing through the light passing cover. The base bracket has a base plate and two lateral walls. The base plate has a rectangular shape with two long sides and two short sides. The two lateral walls are disposed at the two long sides of the base plate. The light passing cover is fixed between the two lateral walls when the first external force is removed. The terminal cover has a wiring hole for passing a connecting wire. The connecting wire is connected between the driver module to an external lighting apparatus.

Abstract: In some embodiments, a lighting apparatus includes a light passing cover, two light bars, a base bracket, two terminal covers, a driver module and an internal cover. The light passing cover is made with a flexible material. The two light bars are disposed on the base plate for generating a light passing through the light passing cover. The base bracket has a base plate and two lateral walls. The base plate has a rectangular shape with two long sides and two short sides. The two lateral walls are disposed at the two long sides of the base plate. The light passing cover is fixed between the two lateral walls when the first external force is removed. The terminal cover has a wiring hole for passing a connecting wire. The connecting wire is connected between the driver module to an external lighting apparatus.

Abstract: The present disclosure provides an MEMS microphone including a base having a rear cavity and a capacitor system disposed on the base. The capacitor system includes a rear plate and a diaphragm that are spaced relatively apart to form an acoustic cavity. A piezoelectric diaphragm is attached to a side of the diaphragm, the side being away from the acoustic cavity. The piezoelectric diaphragm, under the deformation effect of the diaphragm, deforms to generate and output charges. Therefore, the MEMS microphone can output two groups of electrical signals, one group of electrical signals output by the capacitor system and one group of electrical signals output by the piezoelectric diaphragm, thereby sensitivity of the microphone is improved.

Abstract: A deep cavity etching method is disclosed. The deep cavity includes a large cavity and a small cavity forming a step. The method includes the following steps: providing a silicon substrate containing at least an upper surface; forming an oxide layer on the upper surface of the silicon substrate; and coating the first photoresist on the side of the oxide layer away from the silicon substrate. The deep cavity of the step avoids the photoresist spraying process with higher efficiency and lower cost, reduces the process cost and improves the production capacity.

Abstract: The present invention provides a MEMS microphone, having a base and a capacitive system provided on the base. The capacitive system includes a diaphragm and a back plate. The MEMS microphone is further provided with a supporting frame located between the back plate and the diaphragm. One end of the supporting frame is connected with the back plate, and the other end is connected with the diaphragm. The supporting frame divides the cavity into a first cavity body and a second cavity body. The supporting frame is provided with a connection channel. During the production process of the MEMS microphone, the etchant enters the first cavity body, and then enters the second cavity body, which prevents oxides from remaining in the microphone product and affecting the use of MEMS microphone.

Abstract: Provided is a piezoelectric type and capacitive type combined MEMS microphone, comprising a base with a back cavity and a capacitor system arranged on the base; wherein, the capacitor system comprises a back plate and a diaphragm; the back plate is opposite to and apart from the diaphragm to form a first sound cavity; a piezoelectric diaphragm structure is between the capacitor system and the base; a second sound cavity is formed between the capacitor system and the piezoelectric diaphragm structure; the second sound cavity is at least in communication with the first sound cavity or the back cavity; the piezoelectric type and capacitive type combined MEMS microphone can output two groups of electric signals comprising a group of electric signals output from the capacitor system and a group of electric signals output from the piezoelectric diaphragm structure, thus improving sensitivity of the microphone.

Abstract: The present disclosure provides a method for processing a conductive structure. The method includes the following steps of: forming on a first surface a groove concave from the first surface towards a second surface by means of dry etching; extending the groove from the second surface to form a via through a silicon base; and processing a conductive structure within the via. The method can be applied to a silicon base having a thickness larger than 300 ?m. It breaks the limit on thickness that can be processed in the related art and is capable of providing electrical connectivity on both sides of a silicon base. The method is simple and highly reliable, has high processing efficiency and is applicable to mechanized production.

Abstract: The present invention provides a MEMS microphone, having a base and a capacitive system provided on the base. The capacitive system includes a diaphragm and a back plate. The MEMS microphone is further provided with s a supporting frame located between the back plate and the diaphragm. One end of the supporting frame is connected with the back plate, and the other end is connected with the diaphragm. The supporting frame divides the cavity into a first cavity body and a second cavity body. The supporting frame is provided with a connection channel. During the production process of the lo MEMS microphone, the etchant enters the first cavity body, and then enters the second cavity body, which prevents oxides from remaining in the microphone product and affecting the use of MEMS microphone.

Abstract: A MEMS microphone includes a base comprising a back cavity and a capacitive system provided on the base. The capacitive system includes a diaphragm and a back plate spaced from the diaphragm for forming a cavity with the diaphragm. The back plate is provided with an electrode layer. An isolation groove is provided on the back plate for separating the electrode layer into an induction electrode and a floating motor. In the invention the induction electrode is separated from the floating electrode by the isolation groove to avoid the influence of the parasitic capacitance generated by the floating electrode on the MEMS microphone when the MEMS microphone is powered and working.

Abstract: The present invention provides a manufacturing method for MEMS structure. The method includes steps of: S1: providing a substrate, including a structural layer and a silicon-based layer overlapped with the structural layer; S2: carrying out a main etching process for etching out a cavity hole from an end of the silicon-based layer, which is far away from the structural layer, in a direction toward the structural layer until the cavity hole contacts the structural layer; and S3: carrying out an over-etching process for deepening the cavity hole and control an included angle ? between a side wall of the cavity hole and the structural layer to be larger than 10° but smaller than 90°. The invention also provides a MEMS structural and a MEMS microphone manufactured by the method.

Abstract: The present disclosure provides an MEMS microphone including a base having a rear cavity and a capacitor system disposed on the base. The capacitor system includes a rear plate and a diaphragm that are spaced relatively apart to form an acoustic cavity. A piezoelectric diaphragm is attached to a side of the diaphragm, the side being away from the acoustic cavity. The piezoelectric diaphragm, under the deformation effect of the diaphragm, deforms to generate and output charges. Therefore, the MEMS microphone can output two groups of electrical signals, one group of electrical signals output by the capacitor system and one group of electrical signals output by the piezoelectric diaphragm, thereby sensitivity of the microphone is improved.

Abstract: Provided is a piezoelectric type and capacitive type combined MEMS microphone, comprising a base with a back cavity and a capacitor system arranged on the base; wherein, the capacitor system comprises a back plate and a diaphragm; the back plate is opposite to and apart from the diaphragm to form a first sound cavity; a piezoelectric diaphragm structure is between the capacitor system and the base; a second sound cavity is formed between the capacitor system and the piezoelectric diaphragm structure; the second sound cavity is at least in communication with the first sound cavity or the back cavity; the piezoelectric type and capacitive type combined MEMS microphone can output two groups of electric signals comprising a group of electric signals output from the capacitor system and a group of electric signals output from the piezoelectric diaphragm structure, thus improving sensitivity of the microphone.

Abstract: The present disclosure provides a method for manufacturing a polycrystalline silicon thin film, a polycrystalline silicon thin film and an acoustic sensor. The method includes: providing a base material, the base material including a baseplate and a polycrystalline silicon base film stacked with the baseplate; ex-situ doping one of boron, phosphorus and arsenic in the polycrystalline silicon base film to obtain a semi-finished product of the polycrystalline silicon thin film; thermally activating, and then annealing the semi-finished product to obtain the polycrystalline silicon thin film. The polycrystalline silicon thin film manufactured by the method according to the present disclosure has a high uniformity of grain growth, and a reduced surface roughness. Moreover, the polycrystalline silicon thin film also has an excellent mechanical strength, and thus is suitable for applications requiring high mechanical strength. Further, a passing rate in an air blowing test is relatively high.

Abstract: The present invention provides a manufacturing method for MEMS structure. The method includes steps of: S1: providing a substrate, including a structural layer and a silicon-based layer overlapped with the structural layer; S2: carrying out a main etching process for etching out a cavity hole from an end of the silicon-based layer, which is far away from the structural layer, in a direction toward the structural layer until the cavity hole contacts the structural layer; and S3: carrying out an over-etching process for deepening the cavity hole and control an included angle ? between a side wall of the cavity hole and the structural layer to be larger than 10° but smaller than 90°. The invention also provides a MEMS structural and a MEMS microphone manufactured by the method.

Abstract: The present disclosure provides a method for processing a conductive structure. The method includes the following steps of: forming on a first surface a groove concave from the first surface towards a second surface by means of dry etching; extending the groove from the second surface to form a via through a silicon base; and processing a conductive structure within the via. The method can be applied to a silicon base having a thickness larger than 300 ?m. It breaks the limit on thickness that can be processed in the related art and is capable of providing electrical connectivity on both sides of a silicon base. The method is simple and highly reliable, has high processing efficiency and is applicable to mechanized production.

Abstract: A method for manufacturing a microphone chip, includes steps of: providing a first underlay, and depositing insulating oxide layers at both sides; depositing the component layers on the insulating oxide layers respectively; depositing the tetraethyl orthosilicate oxide layers on the component layers; etching the tetraethyl orthosilicate oxide layers; patterning various deposition layers in the first underlay; providing the second underlay; depositing the oxide layers on the substrate; etching and patterning oxide layer; releasing the back plate; combining the first underlay and the second underlay by welding the tetraethyl orthosilicate oxide layer on the first underlay and the oxide layer on the second underlay under ambient temperature; etching the second underlay to form the back cavity; etching the first underlay to release the diaphragm and obtaining the microphone chip.

Abstract: A method for manufacturing a microphone chip, includes steps of: providing a first underlay, and depositing insulating oxide layers at both sides; depositing the component layers on the insulating oxide layers respectively; depositing the tetraethyl orthosilicate oxide layers on the component layers; etching the tetraethyl orthosilicate oxide layers; patterning various deposition layers in the first underlay; providing the second underlay; depositing the oxide layers on the substrate; etching and patterning oxide layer; releasing the back plate; combining the first underlay and the second underlay by welding the tetraethyl orthosilicate oxide layer on the first underlay and the oxide layer on the second underlay under ambient temperature; etching the second underlay to form the back cavity; etching the first underlay to release the diaphragm and obtaining the microphone chip.

Abstract: A kind of piperphentonamine hydrochloride lyophilized powder for injection and a preparation method thereof. The injection is prepared by one portion of piperphentonamine hydrochloride, 2.5-30 parts of excipient and 400-600 parts of water for injection with pH 1.5-5.5 via freeze-drying. The excipient is mannitol, dextran, lactose, saccharose, polyethylene glycol, poloxamer, glycine, etc.; It is preferred that the injection comprises one part of piperphentonamine hydrochloride, 10 parts of mannitol and 500 parts of water for injection with pH 2.0-3.0. The product is prepared by adding said piperphentonamine hydrochloride and excipient into water for injection, heating at 40° C.-90° C., ultrasonic dissolving, degerming, individually packing, pre-freezing and multistage drying, and packaging. Individually packing into a tubular glass bottle with brown color is preferred. The appearance, color & luster and solubility of the injection are excellent, the stability is good and with long storage period.

Abstract: A kind of piperphentonamine hydrochloride lyophilized powder for injection and a preparation method thereof. The injection is prepared by one portion of piperphentonamine hydrochloride, 2.5-30 parts of excipient and 400-600 parts of water for injection with pH 1.5-5.5 via freeze-drying. The excipient is mannitol, dextran, lactose, saccharose, polyethylene glycol, poloxamer, glycine, etc.; It is preferred that the injection comprises one part of piperphentonamine hydrochloride, 10 parts of mannitol and 500 parts of water for injection with pH 2.0-3.0. The product is prepared by adding said piperphentonamine hydrochloride and excipient into water for injection, heating at 40° C.-90° C., ultrasonic dissolving, degerming, individually packing, pre-freezing and multistage drying, and packaging. Individually packing into a tubular glass bottle with brown color is preferred. The appearance, color & luster and solubility of the injection are excellent, the stability is good and with long storage period.