Abstract: Implementations provide a memory, a method for operating a memory, and a memory system. The discloses method can comprises: applying a multi-plane programming scheme to simultaneously perform programming operations on at least two memory planes of the memory device; and in response to determining that an exceptional memory plane of the at least two memory planes has a programming failure, switching to a single-plane programming scheme to sequentially perform programming operations on the at least two memory planes.

Abstract: A memory device, a method for programming the memory device, a program verification method, and a memory system are provided. In the program verification method, an ith verification result of an ith program verification operation is obtained, where programming states verified by the ith program verification operation range from an nth state to an (n+k)th state, i and n are positive integers, k is a natural number, and the (n+k)th state is less than or equal to a highest programming state of the memory device; a range of programming states to be verified by an (i+1)th program verification operation is determined according to a verification sub-result for the nth state and a verification sub-result for the (n+k)th state in the ith verification result; and the (i+1)th program verification operation is executed according to the determined range of the programming states to be verified by the (i+1)th program verification operation.

Abstract: Methods, systems, and apparatus, including computer programs encoded on computer storage media, for operating a memory device having multiple storage modes. In one example method, a portion of a memory array is selected, wherein the portion of the memory array is programmable in a first storage mode or a second storage mode. The second storage mode has a lower storage density than the first storage mode, and the first storage mode corresponds to a first erase operation. A switch erase operation is performed to switch the portion of the memory array from the first storage mode to a switched second storage mode, wherein the switched second storage mode has the same storage density as the second storage mode and corresponds to the switch erase operation. The switch erase operation is different from the first erase operation on the memory array in the first storage mode.

Abstract: A method for reading a memory device is provided. The memory device includes a plurality of word lines and a plurality of multi-bit memory cells connected to the plurality of word lines, and each of the multi-bit memory cells is configured such that a stored value of the multi-bit memory cell is read through multi-level preset read voltages. The method includes: defining at least one read offset for each of the multi-level preset read voltages respectively, selecting at least one of the multi-level preset read voltages as at least one sampling voltage, reading a multi-bit memory cell on an adjacent word line of a to-be-read multi-bit memory cell, and setting at least one offset flag, each representing a size of a respective one of at least one read offset, according to a sampling reading value of each of the at least one sampling voltage.

Abstract: A method for operating a three-dimensional (3D) memory device includes performing a first read operation for sensing a first memory cell of a first transistor string, and performing a subsequent second read operation for sensing a second memory cell of a second transistor string. Performing the first read operation includes applying a first bit line voltage to a first bit line, and maintaining the first bit line basically undischarged after data state of the first memory cell is detected.

Abstract: A method for controlling cache programming of a NAND flash memory is disclosed. A programming failure signal is received by a memory controller from the NAND flash memory indicative of failure of the cache programming. After receiving the programming failure signal, a first page buffer release command is sent by the memory controller to the NAND flash memory to release new programming data cached by the NAND flash memory. The cached new programming data is received by the memory controller from the NAND flash memory. After receiving the cached new programming data, a second page buffer release command is sent by the memory controller to the NAND flash memory to release current programming data used for the cache programming. The current programming data is received by the memory controller from the NAND flash memory. The current programming data is reconstructed by the NAND flash memory after releasing the cached new programming data.

Abstract: Memory devices can be structured in a three-dimensional arrangement using a circuit under array (CUA) architecture. The memory array of such a memory device can include memory cells disposed in vertically arranged tiers. With the memory array extending over a substrate, the CUA region under the memory array can include control circuitry for the memory array. A space adjacent the memory array and disposed above the CUA region can include a dielectric material and conductive structures, with the conductive structures extending vertically in the dielectric material and alongside the memory array. The conductive structures separated by the dielectric material can be used as a capacitor coupled between nodes with the nodes configured to provide different voltages. This capacitor can be coupled to a circuit or a connection node below the level of the memory array.

Abstract: A transmission delay measurement method, a positioning method, a terminal, a base station and a storage medium are disclosed. The method may include acquiring a downlink reference signal sent by a base station, and determining a LOS path and a reference path from a plurality of transmission paths of the downlink reference signal; acquiring a reference delay difference that is a difference between a downlink transmission delay of the LOS path and the downlink transmission delay of reference path; sending an uplink reference signal to the base station, to cause the base station to obtain an uplink transmission delay of reference path based on the uplink reference signal; and reporting the reference delay difference to the base station, to cause the base station to obtain the uplink transmission delay of LOS path based on the uplink transmission delay of reference path and reference delay difference.

Abstract: Disclosed in the present application are a position measurement method, a signal adjustment apparatus, a base station, a terminal, a storage medium and a program product. The position measurement method is performed by the signal adjustment apparatus, and may include: receiving a target reference signal and sending the target reference signal to a receiving apparatus using a target codebook, wherein the target codebook is used to adjust a beam of a signal received by the signal adjustment apparatus to a beam corresponding to the target codebook, and a signal characteristic of the target reference signal is used to determine a position of the receiving apparatus relative to the signal adjustment apparatus.

Abstract: A memory device includes a memory array having memory cells, a page buffer coupled to the memory array through bit lines and including a latch, and a control logic coupled to the page buffer. The control logic is configured to perform a first read operation on the memory cells, and perform a second read operation on the memory cells by dividing the memory cells into a plurality of groups of memory cells, and performing a second read operation on the plurality of groups of memory cells based on a first set of develop times. Each of the first set of develop times is different. The control logic is also configured to perform a third read operation on the memory cells by performing a third read operation on the plurality of groups of memory cells based on a second set of develop times. Each of the second set of develop times is different. The control logic is further configured to determine a read develop time based on the third read operation.

Abstract: In certain aspects, a memory device includes memory cells coupled to a same word line and bit lines, respectively, and a peripheral circuit coupled to the memory cells through the word line and the bit lines. Each of the memory cells is in one of states. The peripheral circuit is configured to determine a first number of a first set of the memory cells and a second number of a second set of the memory cells. Threshold voltages of the first set of the memory cells are between a first voltage and a second voltage larger than the first voltage. Threshold voltages of the second set of the memory cells are between the second voltage and a third voltage larger than the second voltage. The peripheral circuit is also configured to estimate a valley voltage corresponding to a first state of the states based, at least in part, on a comparison between the first number and the second number.

Abstract: Memory devices can be structured in a three-dimensional arrangement using a circuit under array (CUA) architecture. The memory array of such a memory device can include memory cells disposed in vertically arranged tiers. With the memory array extending over a substrate, the CUA region under the memory array can include control circuitry for the memory array. A space adjacent the memory array and disposed above the CUA region can include a dielectric material and conductive structures, with the conductive structures extending vertically in the dielectric material and alongside the memory array. The conductive structures separated by the dielectric material can be used as a capacitor coupled between nodes with the nodes configured to provide different voltages. This capacitor can be coupled to a circuit or a connection node below the level of the memory array.

Abstract: The present disclosure provides a memory device, comprising a memory array having memory cells, a page buffer coupled to the memory array through bit lines. The page buffer comprises a latch, and a control logic coupled to the page buffer and configured to: perform a first read operation on the memory cells; select, from the memory cells, a first plurality of memory cells in a first state and a second plurality of memory cells in a second state, based on the first read operation; perform a second read operation on the first plurality of memory cells; select, from the first plurality of memory cells, a third plurality of memory cells based on the second read operation; perform a third read operation on the third plurality of memory cells; and determine a read develop time based on the third read operation.

Abstract: A memory device includes memory cells coupled to a same word line and bit lines, respectively, and a peripheral circuit coupled to the memory cells through the word and bit lines. Each memory cell is in one state. The peripheral circuit is configured to determine a first number of a first set of the memory cells and a second number of a second set of the memory cells in parallel. Threshold voltages of the first set of the memory cells are between a first voltage and a second voltage larger than the first voltage. Threshold voltages of the second set of the memory cells are between the second voltage and a third voltage larger than the second voltage. The peripheral circuit is also configured to determine a first read level corresponding to a first state based on the first number and the second number.

Abstract: The present disclosure provides a memory device, comprising a memory array having memory cells, a page buffer coupled to the memory array through bit lines. The page buffer comprises a latch, and a control logic coupled to the page buffer and configured to: perform a first read operation on the memory cells; select, from the memory cells, a first plurality of memory cells in a first state and a second plurality of memory cells in a second state, based on the first read operation; perform a second read operation on the first plurality of memory cells; select, from the first plurality of memory cells, a third plurality of memory cells based on the second read operation; perform a third read operation on the third plurality of memory cells; and determine a read develop time based on the third read operation.

Abstract: The present disclosure provides a memory device that includes a memory array and a page buffer. The memory array includes a plurality of memory cells coupled to a bit line of the memory array. The page buffer is coupled to the plurality of memory cells via the bit line to sense stored data in the memory cells. The page buffer includes first, second, and third transistors coupled to the bit line, first and second nodes, a capacitance structure coupled to the first node, and a latch circuit coupled to the bit line via the first transistor. First terminals of the first, second, and third transistors are coupled to the first node. A second terminal of the second transistor is coupled to the second node. The third transistor amplifies a read margin voltage at the second node. The page buffer shortens a time of a read operation or verify operation.

Abstract: A verify failbit count (VFC) circuit includes a counter including a plurality of counter stages coupled one after another and including one or more cache stages in a cache group and a plurality of reception stages divided into a plurality of reception groups each including one or more reception stages of the plurality of reception stages. Each of the reception stages is configured to receive one of a plurality of verification bits generated by a verification operation of a memory device. The counter further includes one or more switches each coupled between two neighboring ones of the plurality of reception groups.

Abstract: In certain aspects, a memory device includes an array of memory cells in columns and rows, word lines respectively coupled to rows of the memory cells, and a peripheral circuit coupled to the rows of memory cells through the word lines. Each memory cell is set to one of 2N final levels corresponding to a piece of N-bits data, where Nis an integer greater than 2. The peripheral circuit is configured to program, in a first pass, a select row of the rows of the memory cells based on N data pages, such that each memory cell of the selected row is set to one of k intermediate levels, where k is an integer not greater than 2N. The peripheral circuit is also configured to read M data pages of the N data pages from the select row after the first pass, where M is an integer smaller than N.

Abstract: A method includes performing a programming operation on the memory cell using incremental step pulse programming. The programming operation includes applying one or more first voltage steps to the word line using a first step value to increase a threshold voltage of the memory cell toward a programming state. The programming operation also includes determining a quantity of memory cells that have a threshold voltage between first and second verification voltages. The second verification voltage is less than the first verification voltage and outside of a range of threshold voltages corresponding to the programming state. The programming operation also includes determining a step adjustment value based on the determining of the quantity. The programming operation also includes adjusting the first step value using the step adjustment value.

Abstract: In certain aspects, a method for programming a memory device includes caching first program data and preparing first program information, performing a first program operation using the first program data and the first program information, during the first program operation, caching a second program data in a first cache latch and preparing second program information, and after the first program operation is completed, performing a second program operation using the second program data and the second program information.