Patents by Inventor Xiaomeng Chen

Xiaomeng Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240087879
    Abstract: A method includes performing a plasma activation on a surface of a first package component, removing oxide regions from surfaces of metal pads of the first package component, and performing a pre-bonding to bond the first package component to a second package component.
    Type: Application
    Filed: November 14, 2023
    Publication date: March 14, 2024
    Inventors: Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Hsun-Chung Kuang, Yuan-Chih Hsieh, Lan-Lin Chao, Chia-Shiung Tsai, Xiaomeng Chen
  • Patent number: 11917614
    Abstract: An uplink control information transmission method and apparatus. The method includes: determining, by a terminal device, a preamble that needs to be sent; determining, by the terminal device based on the preamble, a first resource set that is in a physical uplink shared channel resource and that is used to send uplink control information, where the PUSCH resource includes a plurality of resource sets; and sending, by the terminal device, the uplink control information and uplink data on the PUSCH resource, where the uplink control information is mapped to the first resource set, the uplink data is mapped to a resource that is other than the plurality of resource sets and that is in the PUSCH resource, and no information or uplink data is mapped to a resource set that is other than the first resource set and that is in the plurality of resource sets.
    Type: Grant
    Filed: September 28, 2021
    Date of Patent: February 27, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Xiaomeng Chai, Yiqun Wu, Yan Chen
  • Patent number: 11900586
    Abstract: A hot spot defect detecting method and a hot spot defect detecting system are provided. In the method, hot spots are extracted from a design of a semiconductor product to define a hot spot map comprising hot spot groups, wherein local patterns in a same context of the design yielding a same image content are defined as a same hot spot group. During runtime, defect images obtained by an inspection tool performing hot scans on a wafer manufactured with the design are acquired and the hot spot map is aligned to each defect image to locate the hot spot groups. The hot spot defects in each defect image are detected by dynamically mapping the hot spot groups located in each defect image to a plurality of threshold regions and respectively performing automatic thresholding on pixel values of the hot spots of each hot spot group in the corresponding threshold region.
    Type: Grant
    Filed: December 15, 2020
    Date of Patent: February 13, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien-Huei Chen, Pei-Chao Su, Xiaomeng Chen, Chan-Ming Chang, Shih-Yung Chen, Hung-Yi Chung, Kuang-Shing Chen, Li-Jou Lee, Yung-Cheng Lin, Wei-Chen Wu, Shih-Chang Wang, Chien-An Lin
  • Patent number: 11894408
    Abstract: A device includes two BSI image sensor elements and a third element. The third element is bonded in between the two BSI image sensor elements using element level stacking methods. Each of the BSI image sensor elements includes a substrate and a metal stack disposed over a first side of the substrate. The substrate of the BSI image sensor element includes a photodiode region for accumulating an image charge in response to radiation incident upon a second side of the substrate. The third element also includes a substrate and a metal stack disposed over a first side of the substrate. The metal stacks of the two BSI image sensor elements and the third element are electrically coupled.
    Type: Grant
    Filed: June 14, 2021
    Date of Patent: February 6, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ping-Yin Liu, Yeur-Luen Tu, Chia-Shiung Tsai, Xiaomeng Chen, Pin-Nan Tseng
  • Patent number: 11854795
    Abstract: A method includes performing a plasma activation on a surface of a first package component, removing oxide regions from surfaces of metal pads of the first package component, and performing a pre-bonding to bond the first package component to a second package component.
    Type: Grant
    Filed: March 21, 2022
    Date of Patent: December 26, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Hsun-Chung Kuang, Yuan-Chih Hsieh, Lan-Lin Chao, Chia-Shiung Tsai, Xiaomeng Chen
  • Patent number: 11856750
    Abstract: A semiconductor arrangement includes a logic region and a memory region. The memory region has an active region that includes a semiconductor device. The memory region also has a capacitor within one or more dielectric layers over the active region, where the capacitor is over the semiconductor device. The semiconductor arrangement also includes a protective ring within at least one of the logic region or the memory region and that separates the logic region from the memory region. The capacitor has a first electrode, a second electrode and an insulating layer between the first electrode and the second electrode, where the first electrode is substantially larger than other portions of the capacitor.
    Type: Grant
    Filed: May 17, 2021
    Date of Patent: December 26, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
    Inventors: Chern-Yow Hsu, Chen-Jong Wang, Chia-Shiung Tsai, Shih-Chang Liu, Xiaomeng Chen
  • Publication number: 20230411224
    Abstract: A system configured to detect defects on a wafer is provided. The system includes an inspection subsystem configured to acquire scan data of a target region on the wafer. The target region comprises a plurality of circuit layout streaming data on the wafer and the defects in proximity to the circuit layout streaming data or in the circuit layout streaming data. A graphic design subsystem (GDS) is configured to store a map of circuit layout streaming data of the wafer. A software tool for designing electronic systems is configured to label the scan data with attributes from the map of circuit layout streaming data. A decision subsystem is configured to qualify the process based on a predetermined defect level from the labeled scan data by using a multi-dimension clustering method, wherein the predetermined defect level is an accumulated defect formed on the semiconductor wafer during processing.
    Type: Application
    Filed: June 16, 2022
    Publication date: December 21, 2023
    Inventors: SHIH-CHANG WANG, HSIU-HUI HUANG, FENG-JU CHANG, YEN-FONG CHAN, CHIEN-HUEI CHEN, XIAOMENG CHEN
  • Publication number: 20230411223
    Abstract: A method of qualifying semiconductor wafer processing includes: illuminating a semiconductor wafer simultaneously with source light having wavelengths in a plurality of wavebands, including at least a first waveband and a second waveband, the second waveband being different from the first waveband; separating light reflected from the semiconductor wafer as a result of said illuminating, the separating dividing the reflected light according to waveband; generating a first image of the semiconductor wafer based on reflected light separated into the first waveband; and, generating a second image of the semiconductor wafer base on reflected light separated into the second waveband.
    Type: Application
    Filed: May 27, 2022
    Publication date: December 21, 2023
    Inventors: Shih-Chang Wang, Hsiu-Hui Huang, Hung-Yi Chung, Chien-Huei Chen, Xiaomeng Chen
  • Patent number: 11705923
    Abstract: Disclosed are a method and apparatus for storing data. The method includes: acquiring data to be stored; converting the data to be stored from an initial data type to a target data type, a data length corresponding to the target data type being less than that corresponding to the initial data type; and storing the data to be stored of the target data type to a database. In the method according to the present disclosure, a storage space occupied by the data to be stored in the database is greatly reduced. In addition, the method according to the present disclosure is performed prior to lossy or lossless data compression storage of the data to be stored in the related art. That is, on the basis of a compression ratio when the data to be stored is stored in the related art, the present disclosure further improves a compression effect of the data to be stored by reducing the data length when the data to be stored is stored, and further saves storage resources of the database.
    Type: Grant
    Filed: November 20, 2020
    Date of Patent: July 18, 2023
    Assignees: ENVISION DIGITAL INTERNATIONAL PTE. LTD., SHANGHAI ENVISION DIGITAL CO., LTD.
    Inventors: Li Lei, Hong Zhao, Xiaomeng Chen, Degang Ning
  • Publication number: 20230188830
    Abstract: An image color retention method includes displaying a first preview image on a preview interface, where an image of a first region in the first preview image is displayed in color, and an image of a second region in the first preview image is an image obtained after processing is performed according to a target processing mode, determining a second individual object as a target object in response to a first operation of a user, and displaying a second preview image on the preview interface, where an image of a third region in the second preview image is displayed in color, and an image of a fourth region in the second preview image is an image obtained after processing is performed according to the target processing mode.
    Type: Application
    Filed: March 8, 2021
    Publication date: June 15, 2023
    Inventors: Xiaomeng Chen, Xin Guo
  • Patent number: 11611005
    Abstract: A photo-sensitive device includes a uniform layer, a gradated buffer layer over the uniform layer, a silicon layer over the gradated buffer layer, a photo-sensitive light-sensing region in the uniform layer and the silicon layer, a device layer on the silicon layer, and a carrier wafer bonded to the device layer.
    Type: Grant
    Filed: August 14, 2020
    Date of Patent: March 21, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yu-Hung Cheng, Chia-Shiung Tsai, Cheng-Ta Wu, Xiaomeng Chen, Yen-Chang Chu, Yeur-Luen Tu
  • Publication number: 20230006688
    Abstract: Disclosed are a method and apparatus for storing data. The method includes: acquiring data to be stored; converting the data to be stored from an initial data type to a target data type, a data length corresponding to the target data type being less than that corresponding to the initial data type; and storing the data to be stored of the target data type to a database. In the method according to the present disclosure, a storage space occupied by the data to be stored in the database is greatly reduced. In addition, the method according to the present disclosure is performed prior to lossy or lossless data compression storage of the data to be stored in the related art. That is, on the basis of a compression ratio when the data to be stored is stored in the related art, the present disclosure further improves a compression effect of the data to be stored by reducing the data length when the data to be stored is stored, and further saves storage resources of the database.
    Type: Application
    Filed: November 20, 2020
    Publication date: January 5, 2023
    Applicants: ENVISON DIGITAL INTERNATIONAL PTE, LTD., SHANGHAI ENVISION DIGITAL CO., LTD.
    Inventors: Li LEI, Hong ZHAO, Xiaomeng CHEN, Degang NING
  • Patent number: 11503208
    Abstract: An intelligent assistant control method is provided: starting, by a terminal device, a lens; displaying, by the terminal device, a preview interface on a display screen, where the preview interface includes a to-be-photographed object; and if the terminal device determines that the preview interface has been stably displayed for preset duration, displaying, by the terminal device, first prompt information of a photographing mode in the preview interface, where the first prompt information is used to recommend a first photographing mode to a user, and the first photographing mode is determined by the terminal device based on scene information of the to-be-photographed object.
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: November 15, 2022
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Lei Song, Xin Guo, Xiaomeng Chen, Yunchao Zhang, Xin Chen
  • Publication number: 20220317726
    Abstract: A liquid crystal display (LCD) includes several transparent material layers and several non-transparent material layers that are disposed in a stacked mode. The LCD also has a local transparent region, and no non-transparent material is applied to the several non-transparent material layers in the local transparent region. This forms a transparent channel in the local transparent region along a stacking direction. An optical component is completely or partially disposed in the transparent channel of the LCD display. The optical component may be a camera, an ambient light sensor, an optical fingerprint sensor, or another component disposed under the display by using the local transparent region on the LCD display.
    Type: Application
    Filed: February 8, 2022
    Publication date: October 6, 2022
    Inventors: Bangshi Yin, Fan Yang, Bin Yan, Kangle Xue, Xiaomeng Chen
  • Publication number: 20220310449
    Abstract: An integrated circuit structure includes a package component, which further includes a non-porous dielectric layer having a first porosity, and a porous dielectric layer over and contacting the non-porous dielectric layer, wherein the porous dielectric layer has a second porosity higher than the first porosity. A bond pad penetrates through the non-porous dielectric layer and the porous dielectric layer. A dielectric barrier layer is overlying, and in contact with, the porous dielectric layer. The bond pad is exposed through the dielectric barrier layer. The dielectric barrier layer has a planar top surface. The bond pad has a planar top surface higher than a bottom surface of the dielectric barrier layer.
    Type: Application
    Filed: June 16, 2022
    Publication date: September 29, 2022
    Inventors: Hsun-Chung Kuang, Yen-Chang Chu, Cheng-Tai Hsiao, Ping-Yin Liu, Lan-Lin Chao, Yeur-Luen Tu, Chia-Shiung Tsai, Xiaomeng Chen
  • Publication number: 20220301944
    Abstract: A high atomic number material is applied to one or more surfaces of a semiconductor structure of a wafer. The one or more surfaces are at a depth different from a depth of a surface of the wafer. An electron beam is scanned over the semiconductor structure to cause a backscattered electron signal to be collected at a collector. A profile scan of the semiconductor structure is generated based on an intensity of the backscattered electron signal, at the collector, resulting from the high atomic number material. The high atomic number material increases the intensity of the backscattered electron signal for the one or more surfaces of the semiconductor structure such that contrast in the profile scan is increased. The increased contrast of the profile scan enables accurate critical dimension measurements of the semiconductor structure.
    Type: Application
    Filed: March 19, 2021
    Publication date: September 22, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Pei-Hsuan LEE, Hung-Ming CHEN, Kuang-Shing CHEN, Yu-Hsiang CHENG, Xiaomeng CHEN
  • Publication number: 20220216052
    Abstract: A method includes performing a plasma activation on a surface of a first package component, removing oxide regions from surfaces of metal pads of the first package component, and performing a pre-bonding to bond the first package component to a second package component.
    Type: Application
    Filed: March 21, 2022
    Publication date: July 7, 2022
    Inventors: Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Hsun-Chung Kuang, Yuan-Chih Hsieh, Lan-Lin Chao, Chia-Shiung Tsai, Xiaomeng Chen
  • Publication number: 20220208607
    Abstract: An integrated circuit structure includes a package component, which further includes a non-porous dielectric layer having a first porosity, and a porous dielectric layer over and contacting the non-porous dielectric layer, wherein the porous dielectric layer has a second porosity higher than the first porosity. A bond pad penetrates through the non-porous dielectric layer and the porous dielectric layer. A dielectric barrier layer is overlying, and in contact with, the porous dielectric layer. The bond pad is exposed through the dielectric barrier layer. The dielectric barrier layer has a planar top surface. The bond pad has a planar top surface higher than a bottom surface of the dielectric barrier layer.
    Type: Application
    Filed: March 17, 2022
    Publication date: June 30, 2022
    Inventors: Hsun-Chung Kuang, Yen-Chang Chu, Cheng-Tai Hsiao, Ping-Yin Liu, Lan-Lin Chao, Yeur-Luen Tu, Chia-Shiung Tsai, Xiaomeng Chen
  • Patent number: 11359089
    Abstract: Disclosed in the present invention is a method for preparing a Y-branched hydrophilic polymer carboxylic acid derivative, in particular a method for preparing a Y-branched polyethylene glycol carboxylic acid derivative having a high purity and high molecular weight. The preparation steps are simple, the product of the reaction is easy to be separated, the cost for separation is low, and the purity and yield of the product are high, facilitating the subsequent preparation of other derivatives and medicament conjugates based on the preparation of the carboxylic acid derivative, which is advantageous for industrial scale-up and commercial applications. The prepared Y-branched hydrophilic polymer carboxylic acid derivative (in particular the Y-branched polyethylene glycol carboxylic acid derivative having a high molecular weight) product has a high purity and high commercial application value, in particular in the use of the preparation of medicaments for preventing and/or treating diseases.
    Type: Grant
    Filed: September 30, 2019
    Date of Patent: June 14, 2022
    Assignee: JENKEM TECHNOLOGY CO., LTD. (BEIJING)
    Inventors: Xiaomeng Chen, Meina Lin, Rujun Zhang, Xuan Zhao
  • Patent number: 11281252
    Abstract: A liquid crystal display (LCD) includes several transparent material layers and several non-transparent material layers that are disposed in a stacked mode. The LCD also has a local transparent region, and no non-transparent material is applied to the several non-transparent material layers in the local transparent region. This forms a transparent channel in the local transparent region along a stacking direction. An optical component is completely or partially disposed in the transparent channel of the LCD display. The optical component may be a camera, an ambient light sensor, an optical fingerprint sensor, or another component disposed under the display by using the local transparent region on the LCD display.
    Type: Grant
    Filed: June 25, 2021
    Date of Patent: March 22, 2022
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Bangshi Yin, Fan Yang, Bin Yan, Kangle Xue, Xiaomeng Chen