Abstract: A polarizer includes a light-transmissible substrate, a plurality of metal wires, and a protective layer. The light-transmissible substrate has a mounting surface. The metal wires are parallelly arranged on the mounting surface of the light-transmissible substrate. Each of the metal wires extends in a direction parallel to the mounting surface, and has an upper surface and a peripheral surface. The protective layer has a first portion and a plurality of second portions. The first portion covers the upper surface of each of the metal wires and is formed into a continuous structure. Each of the second portions covers the peripheral surface of a respective one of the metal wires. Two adjacent ones of the second portions are spaced apart from each other. A light emitting device including the polarizer and a light emitting apparatus including the light emitting device are also disclosed.

Abstract: A tip shroud, comprising a plurality of tip shoes encircling a rotor assembly, in a turbine may deform due to thermal gradients experienced during operation of the turbine. Accordingly, a tip shoe is disclosed that utilizes an internal cooling cavity to supply coolant throughout the interior of the tip shoe, as well as to the slash faces of the tip shoe. In addition, features are described that increase the surface area exposed to the coolant, while remaining suitable for additive manufacturing.

Abstract: A light emitting device includes at least one light emitting and connecting unit that includes an epitaxial layer structure and a metallic connecting layer structure, and an insulating substrate that has a main substrate body and first and second contact members. The connecting layer structure interconnects the epitaxial layer structure and the main substrate body, and is completely plane at least right under the epitaxial layer structure. The contact members extend from a first surface to a second surface on the main substrate body, and are disposed outside an imaginary projection of the epitaxial layer structure on the main substrate body. The first contact member is electrically connected with the connecting layer structure. Alight emitting apparatus including the device is also disclosed.

Abstract: A tip shroud, comprising a plurality of tip shoes encircling a rotor assembly, in a turbine may deform due to thermal gradients experienced during operation of the turbine. Accordingly, a tip shoe is disclosed that utilizes an internal cooling cavity to supply coolant throughout the interior of the tip shoe, as well as to the slash faces of the tip shoe. In addition, features are described that increase the surface area exposed to the coolant, while remaining suitable for additive manufacturing.

Abstract: A light-emitting chip includes a light-emitting unit, first and second electrode units. The light-emitting unit includes first and second conductivity type semiconductor layers and an active layer. The first electrode unit includes two first electrodes which are spaced apart from each other by a first distance, and which are electrically connected to the first conductivity type semiconductor layer. The second electrode unit includes two second electrodes electrically connected to the second conductivity type semiconductor layer. The first and second electrode units are spaced apart from each other by a second distance, and the first distance is greater than the second distance.

Abstract: A light-emitting device includes a number (N) (not smaller than two) of light-emitting units, a interconnect structure connecting the light-emitting units in series, first and second electrodes, and an auxiliary electrode structure. The light-emitting units each having an light-emitting stack having first and second semiconductor layers of opposite doping types and an active layer. The first and second electrodes are respectively connected to the first semiconductor layer of a first light-emitting unit and the second semiconductor layer of an Nth light-emitting unit. The auxiliary electrode structure is connected to the light-emitting stack of at least one of the light-emitting units.

Abstract: A light-emitting diode (LED) chip includes a semiconductor epitaxial structure, an insulating substrate, a first metal layer, and a second metal layer. The semiconductor epitaxial structure includes a first semiconductor epitaxial layer, a second semiconductor epitaxial layer, and a light-emitting layer interposed between the first semiconductor epitaxial layer and the second semiconductor epitaxial layer. The insulating substrate has two opposite surfaces, and the first and second metal layers are respectively disposed on the two surfaces of the insulating substrate. An LED device and an LED lamp including the LED chip are also disclosed.

Abstract: A light-emitting device includes a lead frame having a first surface on which a patterned conductive layer is provided, and a light-emitting element. The light-emitting element includes an insulating substrate formed on the first surface, a plurality of light-emitting units formed on the insulating substrate, at least one first electrode, at least one second electrode and at least a pair of bonding wires. The first and second electrodes are respectively placed in electrical connection with a first one and a second one of the light-emitting units, and are disposed outward of the light-emitting units. Each of the pair of bonding wires is disposed to electrically connect a respective one of the first and second electrodes to the patterned conductive layer.

Abstract: A light emitting diode includes a semiconductor layer sequence stack, a reflective polarizing layer and a diffuse reflection structure. The semiconductor layer sequence stack includes first and second semiconductor layers, and a light emitting layer disposed therebetween. The reflective polarizing layer is disposed on the semiconductor layer sequence stack. The diffuse reflection structure is disposed on the light emitting layer opposite to the reflective polarizing layer. A light emitting device including the light emitting diode, and a projector including the light emitting device are also provided.

Abstract: A light-emitting device includes an LED chip disposed on a supporting component. The LED chip includes a semiconductor stack formed on a substrate, a first electrode, and a second electrode. A light-blocking layer fills the supporting component to cover a lateral side of the LED chip and expose a top chip surface of the LED chip. The light-blocking layer has a top surface not lower than the top chip surface of the LED chip. A height difference among the top chip surface, the top surface of the light-blocking layer and a top end of the supporting component is less than 10 ?m. A top light exit port defined by the light-blocking layer to expose the top chip surface has a cross sectional area not larger than that of the top chip surface.

Abstract: Disclosed is a light-emitting diode chip. A first electrode and a second electrode of the light-emitting diode chip face towards a front side. A back side of a first conduction layer is directly connected to a front side of a base. A portion of the first conduction layer is at least exposed from the front side to be used for the arrangement of the first electrode. A portion of a second conduction layer is at least exposed from the front side to be used for the arrangement of the second electrode. The exposed first conduction layer and the exposed second conduction layer are of equal height. An insulating layer extending from a recess covers a back side of the second conductive layer.

Abstract: A light emitting device includes at least one light emitting unit that includes an insulating layer, a first electrically conductive layer, and a semiconductor layer structure having at least one recess. The first electrically conductive layer and the insulating layer extend into the recess. A contact area between a conductive protrusion portion of the first electrically conductive layer and a first-type semiconductor layer of the semiconductor layer structure is larger than 1.5% of an area of a bottom surface of the first-type semiconductor layer. A method for producing the light emitting device is also disclosed.

Abstract: A light-emitting diode includes an epitaxial layered structure, a reflective layered unit, and a light-transmissive structure. The epitaxial layered structure has opposite upper and lower surfaces and a side surface interconnecting the upper and lower surfaces. The reflective layered unit is disposed on the lower surface of the epitaxial layered structure. The light-transmissive structure covers the upper surface of the epitaxial layered structure and a portion of the side surface of the epitaxial layered structure, and is configured to allow light emitted from the epitaxial layered structure to exit therefrom at a light-exit angle of not smaller than 125°.

Abstract: A light emitting device includes at least one light emitting and connecting unit that includes an epitaxial layer structure and a metallic connecting layer structure, and an insulating substrate that has a main substrate body and first and second contact members. The connecting layer structure interconnects the epitaxial layer structure and the main substrate body, and is completely plane at least right under the epitaxial layer structure. The contact members extend from a first surface to a second surface on the main substrate body, and are disposed outside an imaginary projection of the epitaxial layer structure on the main substrate body. The first contact member is electrically connected with the connecting layer structure. Alight emitting apparatus including the device is also disclosed.

Abstract: A light-emitting diode (LED) chip includes a semiconductor epitaxial structure, an insulating substrate, a first metal layer, and a second metal layer. The semiconductor epitaxial structure includes a first semiconductor epitaxial layer, a second semiconductor epitaxial layer, and a light-emitting layer interposed between the first semiconductor epitaxial layer and the second semiconductor epitaxial layer. The insulating substrate has two opposite surfaces, and the first and second metal layers are respectively disposed on the two surfaces of the insulating substrate. An LED device and an LED lamp including the LED chip are also disclosed.

Abstract: A surface-mounted light-emitting device is fabricated by epitaxial growth: forming the LED epitaxial structure over a growth substrate through epitaxial growth; chip fabrication: determining P and N electrode regions and an isolating region over the LED epitaxial structure surface and fabricating the P and N electrode pads and the insulator over the P and N electrode regions and the isolating region, wherein the P and N electrode pads have sufficient thicknesses to support the LED epitaxial structure, and the insulator is formed between the P and N electrode pads to prevent the P and N electrode pads from a short circuit; removing the growth substrate and unitizing the LED epitaxial structure to form the chip; and SMT packaging: providing the supporting substrate and directly mounting the P and N electrode pads of the chip over the supporting substrate through SMT packaging to thereby form the surface-mounted LED light-emitting device.

Abstract: A system includes a turbine casing assembly that includes an outer shell and an inner shell positioned substantially concentrically within the outer shell. The inner shell includes an inner surface facing away from the outer shell and an outer surface facing toward the outer shell, and the outer surface has one or more false flanges. At least one of the one or more false flanges includes a first surface protruding from the outer surface and facing the outer shell, and a flow diverting portion extending between the first surface and the outer surface of the inner shell. The flow diverting portion includes a first portion that diverges in a first circumferential direction between the first surface and the outer surface.

Abstract: The present disclosure relates to a liquid crystal (LC) display field and discloses an LC pump. The LC pump may include a case; a second linear container arranged within the case; and a nozzle arranged at the bottom of the case. The second linear container may include an LC delivery channel and at least two LC inlets. And LC may flow through the LC inlets and the LC delivery channel sequentially and then may be ejected from the nozzle.

Abstract: A sealant applying device and a working method thereof, and a sealant applying apparatus are disclosed. The sealant applying device includes a nozzle; the nozzle includes an air inlet portion and a sealant outflow portion, a switch plate is arranged below the sealant outflow portion, the switch plate includes a plate body configured to horizontally move between a first state and a second state, one end of the plate body is provided with a through hole, and a discharge portion is provided at a position corresponding to the through hole and on a side of the plate body facing away from the sealant outflow portion.

Abstract: A sealant applying device and a working method thereof, and a sealant applying apparatus are disclosed. The sealant applying device includes a nozzle: the nozzle includes an air inlet portion and a sealant outflow portion, a switch plate is arranged below the sealant outflow portion, the switch plate includes a plate body configured to horizontally move between a first state and a second state, one end of the plate body is provided with a through hole, and a discharge portion is provided at a position corresponding to the through hole and on a side of the plate body facing away from the sealant outflow portion.