Abstract: A computer implemented system and method is provided for generating a layout of the cell defining a circuit component, the layout providing a layout pattern for a target process technology. The method comprises obtaining an archetype layout providing a valid layout pattern for the cell having regard to design rules of the target process technology, and receiving an input data file providing a process technology independent schematic of the circuit component for which the cell is to be generated. A schematic sizing operation is then performed on the input data file, having regard to both schematic constraints applicable to the target process technology and layout constraints derived from the archetype layout, in order to generate an output data file providing a process technology dependent schematic of the circuit component. A cell generation operation is then performed using the output data file and layout data determined from the archetype layout in order to generate the layout of the cell.

Abstract: Disclosed are compounds, compositions and methods for treating various diseases, syndromes, conditions and disorders, including pain. Such compounds are represented by Formula I as follows: wherein R0, R1, R2, R3, R4 and a are defined herein.

Abstract: A method of forming a seal ring structure includes the following steps. A substrate is provided, and the substrate includes a seal ring region. A metal stack is formed in the seal ring region. A first dielectric layer covering the metal stack is formed. A part of the first dielectric layer is removed to form an opening to expose the metal stack, and at least a side of the opening is not perpendicular to a top surface of the first dielectric layer. A conductive layer is formed to fill the opening. A second dielectric layer is formed to continuously cover the first dielectric layer and the conductive layer, and the second dielectric layer has a v-shaped surface totally overlapping the conductive layer.

Abstract: Disclosed are compounds, compositions and methods for treating various diseases, syndromes, conditions and disorders, including pain. Such compounds are represented by Formula (I) as follows: wherein A, L, R1, R2, R4, and R5 are defined herein.

Abstract: Disclosed are compounds, compositions and methods for treating various diseases, syndromes, conditions and disorders, including pain. Such compounds are represented by Formula I as follows: wherein R0, R1, R2, R3, R4 and a are defined herein.

Abstract: Disclosed are compounds, compositions and methods for treating various diseases, syndromes, conditions and disorders, including pain. Such compounds are represented by Formula I as follows: wherein R0, R1, R2, R3, R4 and a are defined herein.

Abstract: A method of forming a seal ring structure includes the following steps. A substrate is provided, and the substrate includes a seal ring region. A metal stack is formed in the seal ring region. A first dielectric layer covering the metal stack is formed. A part of the first dielectric layer is removed to form an opening to expose the metal stack, and at least a side of the opening is not perpendicular to a top surface of the first dielectric layer. A conductive layer is formed to fill the opening. A second dielectric layer is formed to continuously cover the first dielectric layer and the conductive layer, and the second dielectric layer has a v-shaped surface totally overlapping the conductive layer.

Abstract: A method of forming an isolation structure and a through silicon via includes the following steps. First, at least a first trench and at least a second trench are formed in the substrate by a single etch step. Then, an insulating layer is formed to simultaneously fill up the first trench and cover a sidewall and a bottom of the second trench. After that, a conductive layer is formed to fill in the second trench. Subsequently, the insulating layer and the conductive layer on a front side of the substrate are removed. Later, a back side of the substrate is thinned to expose the conductive layer in the second trench. The insulating layer in the first trench serves as an insulating filling, and the insulating layer on the sidewall of the second trench serves as a liner of the through silicon via.

Abstract: Disclosed are compounds, compositions and methods for treating various diseases, syndromes, conditions and disorders, including pain. Such compounds are represented by Formula (I) as follows: wherein A, L, R1, R2, R4, and R5 are defined herein.

Abstract: Disclosed are compounds, compositions and methods for treating various diseases, syndromes, conditions and disorders, including pain. Such compounds are represented by Formula (I) as follows: wherein A, L, R1, R2, R4 and R5 are defined herein.

Abstract: This application discloses a method for controlling an electronic apparatus and the electronic apparatus. The method for controlling the electronic apparatus is applied to a first electronic apparatus including a touch control screen. This electronic apparatus is capable to connect to at least one display screen, the method comprises: detecting whether there is a first touch control operation in the first region of the touch control screen; detecting to obtain a working mode of the touch control screen when there is the first touch control operation; generating a first control instruction based on the first touch control operation when the working mode is a first extended working mode, the second display screen corresponding to the the first extended working mode in at least one display screen being capable to obtain and display a first execution result.

Abstract: Disclosed are compounds, compositions and methods for treating various diseases, syndromes, conditions and disorders, including pain. Such compounds are represented by Formula I as follows: wherein R0, R1, R2, R3, R4 and a are defined herein.

Abstract: Disclosed are compounds, compositions and methods for treating various diseases, syndromes, conditions and disorders, including pain. Such compounds are represented by Formula I as follows: wherein R0, R1, R2, R3, R4 and a are defined herein.

Abstract: Disclosed are compounds, compositions and methods for treating various diseases, syndromes, conditions and disorders, including pain. Such compounds are represented by Formula I as follows: wherein A, B, L, Q, R1, R2, and R3 are defined herein.

Abstract: Disclosed are compounds, compositions and methods for treating various diseases, syndromes, conditions and disorders, including pain. Such compounds are represented by Formula I as follows: wherein R0, R1, R2, R3, R4 and a are defined herein.

Abstract: Disclosed are compounds, compositions and methods for treating various diseases, syndromes, conditions and disorders, including pain. Such compounds are represented by Formula I as follows: wherein A, B, L, Q, R1, R2, and R3 are defined herein.

Abstract: Disclosed are compounds, compositions and methods for treating various diseases, syndromes, conditions and disorders, including pain. Such compounds are represented by Formula I as follows: wherein A, B, L, Q, R1, R2, and R3 are defined herein.

Abstract: This invention relates to a method of extracting crude polysaccharide by microwave-assisted from Artemisia sphaerocephala seed de-oiling dregs. In particular, the invention comprising: microwave-assisted extraction, enzymatic hydrolysis, dialysis et. al. It provides a technique whereby the polysaccharide can be extracted effectively, in a relatively short period of time (20-30 min) with respect to conventional extraction methods and allows for an enhanced extraction yield (more than 30%). Furthermore, the invention also allows for the extraction of material with less solvent consumption, good reproducibility, excellent solubility, energy conservation, environmental protection, and showed great potential for efficient sample preparation and large-scale industrial application in the near future. With great resource advantage of Artemisia sphaerocephala in China, the invention has bright perspectives in promoting local economic development.

Abstract: Disclosed are compounds, compositions and methods for treating various diseases, syndromes, conditions and disorders, including pain. Such compounds are represented by Formula I as follows: wherein R0, R1, R2, R3, R4 and a are defined herein.

Abstract: Disclosed are compounds, compositions and methods for treating various diseases, syndromes, conditions and disorders, including pain. Such compounds are represented by Formula I as follows: wherein R0, R1, R2, R3, R4 and a are defined herein.