Abstract: An upconverting pigment dispersion includes an upconverting pigment, such as a ?-NaYF4 crystal doped with at least one of Erbium, Ytterbium or Thulium. The upconverting pigment dispersion is aqueous. Upconverting inkjet ink is made by mixing the crystals with a polymer dispersant and water and milling the mixture until the crystal particles are between 50 nanometers and 200 nanometers. Deionized water, a colorant and a humectant are added to the milled mixture.

Abstract: An aqueous composition for forming a micro-fluid jet printable dielectric film layer, methods for forming dielectric film layers, and dielectric film layers formed by the method. The aqueous composition includes from about 5 to about 20 percent by 65 weight of a polymeric binder emulsion, from about 10 to about 30 percent by weight of a humectant, from about 0 to about 3 percent by weight of a surfactant, and an aqueous carrier fluid. The aqueous composition has a viscosity ranging from about 2 to about 6 centipoise at a temperature of about 23° C.

Abstract: An upconverting pigment dispersion includes an upconverting pigment, such as a ?-NaYF4 crystal doped with at least one of Erbium, Ytterbium or Thulium. The upconverting pigment dispersion is aqueous and, thus, includes water. A dispersant is added to increase the stability of the upconverting pigment of the dispersion.

Abstract: An aqueous penetrating ink includes a pigment and a water-soluble dye. The ink also includes a humectant in which the water-soluble dye is to be at least partially dissolved. The humectant is present in the ink between 20 percent by weight and 70 percent by weight. This amount of humectant results in a slow evaporation rate. The ink also includes water, making it suitable for use with some inkjet printers. Because the pigment is not dissolved in the humectant or the water, it forms an image on the surface of a printed side of a substrate. The slow evaporation rate of the humectant allows it to carry the ink through a thickness of a substrate so that it is visible on a non-printed side of the substrate.

Abstract: High security inkjet inks are made my milling two or more functional materials, such as invisible ultraviolet fluorescent dyes or pigments, infrared Anti Stokes upconverting pigments, infrared absorption and fluorescent dyes or pigments and iron oxide magnetic pigments, into a pigment dispersion. A wet media mill is used to mill the pigment dispersion until the average particle size is below 300 nm. The dispersion is combined with main components of an inkjet ink, such as deionized water, humectants, surfactants, polymer resin and biocides, to produce the high security inkjet ink.

Abstract: Active LEDs have a control transistor in series with an LED and have a top electrode, a bottom electrode, and a control electrode. The active LEDs are microscopic and dispersed in an ink. A substrate has column lines, and the active LEDs are printed at various pixel locations so the bottom electrodes contact the column lines. A hydrophobic mask defines the pixel locations. Due to the printing process, there are different numbers of active LEDs in the various pixel locations. Row lines and control lines contact the top and control electrodes so that the active LEDs in each single pixel location are connected in parallel. If the LEDs emit blue light, red and green phosphors are printed over various pixel locations to create an ultra-thin color display. Any active LED may be addressed using row and column addressing, and the brightness may be controlled using the control lines.

Abstract: A method for creating a secure document, registering the secure document and verifying the authenticity of the secure document includes receiving a print object that has content. A security feature, including an identifier, is created and is associated with the content. The identifier may be a barcode. The barcode may represent a character string. The security feature may include the identifier barcode and a decoy barcode that is not associated with the content. The identifier barcode (or the character string represented by the barcode) and the content are transmitted to a database for storage. Once stored, the identifier and the content are considered to be registered. A print object that includes the security feature and the content is then transmitted to a printer for printing.

Abstract: An upconverting pigment dispersion includes an upconverting pigment, such as a ?-NaYF4 crystal doped with at least one of Erbium, Ytterbium or Thulium. The upconverting pigment dispersion is aqueous. Upconverting inkjet ink is made by mixing the crystals with a polymer dispersant and water and milling the mixture until the crystal particles are between 50 nanometers and 200 nanometers. Deionized water, a colorant and a humectant are added to the milled mixture.

Abstract: A secure document includes a fluorescent barcode and a fluorescent filler printed onto a substrate. The fluorescent barcode is printed using a first fluorescent ink of a first color and the fluorescent filler is printed using a second fluorescent ink of a second color that is different than the first color. In order to read the fluorescent barcode, the secure document must be illuminated with ultraviolet and/or infrared light. Then, a color filter must be used to filter the fluorescent filler out, leaving the fluorescent barcode visible.

Abstract: An aqueous penetrating ink includes a pigment and a water-soluble dye. The ink also includes a humectant in which the water-soluble dye is to be at least partially dissolved. The humectant is present in the ink between 20 percent by weight and 70 percent by weight. This amount of humectant results in a slow evaporation rate. The ink also includes water, making it suitable for use with some inkjet printers. Because the pigment is not dissolved in the humectant or the water, it forms an image on the surface of a printed side of a substrate. The slow evaporation rate of the humectant allows it to carry the ink through a thickness of a substrate so that it is visible on a non-printed side of the substrate.

Abstract: An aqueous MICR inkjet ink includes between 20% to 60% by weight of a magnetic iron oxide with cobalt doping, pigment dispersion, mixed with between 5% to 30% by weight of a humectant, in a water solution emulsion. The dispersion is milled in a wet media mill to obtain particle size in the 150 nm range. Additional humectant, surfactants, jetting agents, and stabilizing additives are added for the final ink composition.

Abstract: An upconverting pigment dispersion includes an upconverting pigment, such as a ?-NaYF4 crystal doped with at least one of Erbium, Ytterbium or Thulium. The upconverting pigment dispersion is aqueous and, thus, includes water. A dispersant is added to increase the stability of the upconverting pigment of the dispersion.

Abstract: An aqueous composition for forming a micro-fluid jet printable dielectric film layer, methods for forming dielectric film layers, and dielectric film layers formed by the method. The aqueous composition includes from about 5 to about 20 percent by 65 weight of a polymeric binder emulsion, from about 10 to about 30 percent by weight of a humectant, from about 0 to about 3 percent by weight of a surfactant, and an aqueous carrier fluid. The aqueous composition has a viscosity ranging from about 2 to about 6 centipoise at a temperature of about 23° C.

Abstract: A secure document includes a fluorescent barcode and a fluorescent filler printed onto a substrate. The fluorescent barcode is printed using a first fluorescent ink of a first color and the fluorescent filler is printed using a second fluorescent ink of a second color that is different than the first color. In order to read the fluorescent barcode, the secure document must be illuminated with ultraviolet and/or infrared light. Then, a color filter must be used to filter the fluorescent filler out, leaving the fluorescent barcode visible.

Abstract: An aqueous MICR inkjet ink includes between 20% to 60% by weight of a magnetic iron oxide with cobalt doping, pigment dispersion, mixed with between 5% to 30% by weight of a humectant, in a water solution emulsion. The dispersion is milled in a wet media mill to obtain particle size in the 150 nm range. Additional humectant, surfactants, jetting agents, and stabilizing additives are added for the final ink composition.

Abstract: Vias (holes) are formed in a wafer or a dielectric layer. A low viscosity conductive ink, containing microscopic metal particles, is deposited over the top surface of the wafer to cover the vias. An external force is applied to urge the ink into the vias, including an electrical force, a magnetic force, a centrifugal force, a vacuum, or a suction force for outgassing the air in the vias. Any remaining ink on the surface is removed by a squeegee, spinning, an air knife, or removal of an underlying photoresist layer. The ink in the vias is heated to evaporate the liquid and sinter the remaining metal particles to form a conductive path in the vias. The resulting wafer may be bonded to one or more other wafers and singulated to form a 3-D module.

Abstract: Vias (holes) are formed in a wafer or a dielectric layer. A low viscosity conductive ink, containing microscopic metal particles, is deposited over the top surface of the wafer to cover the vias. An external force is applied to urge the ink into the vias, including an electrical force, a magnetic force, a centrifugal force, a vacuum, or a suction force for outgas sing the air in the vias. Any remaining ink on the surface is removed by a squeegee, spinning, an air knife, or removal of an underlying photoresist layer. The ink in the vias is heated to evaporate the liquid and sinter the remaining metal particles to form a conductive path in the vias. The resulting wafer may be bonded to one or more other wafers and singulated to form a 3-D module.

Abstract: Vias (holes) are formed in a wafer or a dielectric layer. A low viscosity conductive ink, containing microscopic metal particles, is deposited over the top surface of the wafer to cover the vias. An external force is applied to urge the ink into the vias, including an electrical force, a magnetic force, a centrifugal force, a vacuum, or a suction force for outgassing the air in the vias. Any remaining ink on the surface is removed by a squeegee, spinning, an air knife, or removal of an underlying photoresist layer. The ink in the vias is heated to evaporate the liquid and sinter the remaining metal particles to form a conductive path in the vias. The resulting wafer may be bonded to one or more other wafers and singulated to form a 3-D module.

Abstract: Disclosed is an ejection device for an inkjet printer that includes an ejection chip having a substrate and at least one fluid ejecting element. The ejection device further includes a fluidic structure configured over the ejection chip. The fluidic structure includes a nozzle plate composed of an organic material and includes a plurality of nozzles. The fluidic structure further includes a flow feature layer configured in between the ejection chip and the nozzle plate. The flow feature layer is composed of an organic material and includes a plurality of flow features. Furthermore, the fluidic structure includes a liner layer encapsulating the nozzle plate. The liner layer further at least partially encapsulates each flow feature of the plurality of flow features. The liner layer is composed of an inorganic material. Further disclosed is a method for fabricating the ejection device.

Abstract: Vias (holes) are formed in a wafer or a dielectric layer. A low viscosity conductive ink, containing microscopic metal particles, is deposited over the top surface of the wafer to cover the vias. An external force is applied to urge the ink into the vias, including an electrical force, a magnetic force, a centrifugal force, a vacuum, or a suction force for outgassing the air in the vias. Any remaining ink on the surface is removed by a squeegee, spinning, an air knife, or removal of an underlying photoresist layer. The ink in the vias is heated to evaporate the liquid and sinter the remaining metal particles to form a conductive path in the vias. The resulting wafer may be bonded to one or more other wafers and singulated to form a 3-D module.