Patents by Inventor Xiaoxiong Gu

Xiaoxiong Gu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190319338
    Abstract: An apparatus includes an antenna array package cover comprising a radiating surface, a mating surface disposed opposite the radiating surface, and an array of antenna array sub-patterns wherein each antenna array sub-pattern comprises at least one antenna element. The antenna array package also includes an array of sub-pattern interface packages mated to the mating surface of the antenna array package cover. Each sub-pattern interface package of the array of sub-pattern interface packages comprises a package carrier, a sub-pattern integrated circuit electrically and mechanically coupled to the package carrier, and a set of interface lines corresponding to the antenna elements of the antenna array sub-pattern that corresponds to the sub-pattern interface package. Methods for mounting the above apparatus into a host circuit are also disclosed herein.
    Type: Application
    Filed: April 13, 2018
    Publication date: October 17, 2019
    Inventors: Xiaoxiong Gu, Duixian Liu, Christian W. Baks, Alberto Valdes Garcia
  • Patent number: 10431892
    Abstract: Package structures are provided having antenna-in-packages that are integrated with semiconductor RFIC (radio frequency integrated circuit) chips to form compact integrated radio/wireless communications systems that operate in the millimeter wave (mmWave) frequency range with radiation in broadside and end-fire directions.
    Type: Grant
    Filed: July 12, 2017
    Date of Patent: October 1, 2019
    Assignee: International Business Machines Corporation
    Inventors: Alberto V. Garcia, Xiaoxiong Gu, Duixian Liu
  • Publication number: 20190260109
    Abstract: Techniques regarding a scalable phased array are provided. For example, various embodiments described herein can comprise a plurality of integrated circuits having respective flip chip pads, and an antenna-in-package substrate having a ball grid array terminal and a plurality of transmission lines. The plurality of transmission lines can be embedded within the antenna-in-package substrate and can operatively couple the respective flip chip pads to the ball grid array terminal. In one or more embodiments, a die can comprise the plurality of integrated circuits. Further, in one or more embodiments a combiner can also be embedded in the antenna-in-package substrate. The combiner can join the plurality of transmission lines.
    Type: Application
    Filed: February 21, 2018
    Publication date: August 22, 2019
    Inventors: Xiaoxiong Gu, Wooram Lee, Duixian Liu, Christian Wilhelmus Baks, Alberto Valdes-Garcia
  • Publication number: 20190260138
    Abstract: Techniques regarding a scalable phased array are provided. For example, various embodiments described herein can comprise a plurality of integrated circuits having respective flip chip pads, and an antenna-in-package substrate having a ball grid array terminal and a plurality of transmission lines. The plurality of transmission lines can be embedded within the antenna-in-package substrate and can operatively couple the respective flip chip pads to the ball grid array terminal. In one or more embodiments, a die can comprise the plurality of integrated circuits. Further, in one or more embodiments a combiner can also be embedded in the antenna-in-package substrate. The combiner can join the plurality of transmission lines.
    Type: Application
    Filed: February 21, 2018
    Publication date: August 22, 2019
    Inventors: Xiaoxiong Gu, Wooram Lee, Duixian Liu, Christian Wilhelmus Baks, Alberto Valdes-Garcia
  • Patent number: 10381730
    Abstract: A millimeter-wave (MMW) communication system may include an antenna array structure operating within a MMW band, having both a first antenna coupling point and a second antenna coupling point, whereby the first and the second location of the antenna coupling points are within a coplanar surface on which the antenna array structure is formed. The system may further include a first MMW transmitter that couples a first data modulated MMW signal to the first antenna coupling point and a second MMW transmitter that couples a second data modulated MMW signal to the second antenna coupling point. Coupling the first data modulated MMW signal to the first antenna coupling point generates a first MMW radio signal transmitted at a first propagation direction and coupling the second data modulated MMW signal to the second antenna coupling point generates a second MMW radio signal transmitted at a second propagation direction.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: August 13, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Xiaoxiong Gu, Duixian Liu, Bodhisatwa Sadhu, Alberto Valdes Garcia
  • Patent number: 10170838
    Abstract: Package structures are provided having antenna-in-packages that are integrated with semiconductor RFIC (radio frequency integrated circuit) chips to form compact integrated radio/wireless communications systems that operate in the millimeter wave (mmWave) frequency range with radiation in broadside and end-fire directions.
    Type: Grant
    Filed: July 10, 2015
    Date of Patent: January 1, 2019
    Assignee: International Business Machines Corporation
    Inventors: Alberto V. Garcia, Xiaoxiong Gu, Duixian Liu
  • Publication number: 20180159203
    Abstract: Antenna package structures are provided to implement wireless communications packages. For example, an antenna package includes multilayer package substrate, a planar antenna array, antenna feed lines, and resistive transmission lines. The planar antenna array includes an array of active antenna elements and dummy antenna elements surrounding the array of active antenna elements. Each active antenna element is coupled to a corresponding one of the antenna feed lines, and each dummy antenna element is coupled to a corresponding one of the resistive transmission lines. Each resistive transmission line extends through the multilayer package substrate and is terminated in a same metallization layer of the multilayer package substrate.
    Type: Application
    Filed: December 3, 2016
    Publication date: June 7, 2018
    Inventors: Christian W. Baks, Daniel J. Friedman, Xiaoxiong Gu, Duixian Liu, Alberto Valdes Garcia, Joakim Hallin, Ola Ragnar Tageman
  • Patent number: 9985346
    Abstract: Antenna package structures are provided to implement wireless communications packages. For example, an antenna package includes a package carrier and a package cover. The package carrier includes an antenna ground plane and an antenna feed line. The package cover includes a planar lid having a planar antenna element formed on a first surface of the planar lid. The package cover is bonded to a first surface of the package carrier with the first surface of the planar lid facing the first surface of the package carrier, and with the planar antenna element aligned to the antenna ground plane and the antenna feed line of the package carrier, wherein the first surface of the planar lid is disposed at a distance from the first surface of the package carrier to provide an air space between the planar antenna element and the package carrier.
    Type: Grant
    Filed: January 11, 2017
    Date of Patent: May 29, 2018
    Assignee: International Business Machines Corporation
    Inventors: Christian Wilhelmus Baks, Xiaoxiong Gu, Duixian Liu, Alberto Valdes-Garcia
  • Publication number: 20180108995
    Abstract: A millimeter-wave (MMW) communication system may include an antenna array structure operating within a MMW band, having both a first antenna coupling point and a second antenna coupling point, whereby the first and the second location of the antenna coupling points are within a coplanar surface on which the antenna array structure is formed. The system may further include a first MMW transmitter that couples a first data modulated MMW signal to the first antenna coupling point and a second MMW transmitter that couples a second data modulated MMW signal to the second antenna coupling point. Coupling the first data modulated MMW signal to the first antenna coupling point generates a first MMW radio signal transmitted at a first propagation direction and coupling the second data modulated MMW signal to the second antenna coupling point generates a second MMW radio signal transmitted at a second propagation direction.
    Type: Application
    Filed: November 17, 2017
    Publication date: April 19, 2018
    Inventors: Xiaoxiong Gu, Duixian Liu, Bodhisatwa Sadhu, Alberto Valdes Garcia
  • Publication number: 20180076526
    Abstract: Package structures are provided having antenna-in-packages that are integrated with semiconductor RFIC (radio frequency integrated circuit) chips to form compact integrated radio/wireless communications systems that operate in the millimeter wave (mmWave) frequency range with radiation in broadside and end-fire directions.
    Type: Application
    Filed: July 10, 2015
    Publication date: March 15, 2018
    Inventors: Alberto V. Garcia, Xiaoxiong Gu, Duixian Liu
  • Patent number: 9917368
    Abstract: Package structures are provided having antenna-in-packages that are integrated with semiconductor RFIC (radio frequency integrated circuit) chips to form compact integrated radio/wireless communications systems that operate in the millimeter wave (mmWave) frequency range with radiation in broadside and end-fire directions.
    Type: Grant
    Filed: July 10, 2015
    Date of Patent: March 13, 2018
    Assignee: International Business Machines Corporation
    Inventors: Alberto V. Garcia, Xiaoxiong Gu, Duixian Liu
  • Patent number: 9912061
    Abstract: A millimeter-wave (MMW) communication system may include an antenna array structure operating within a MMW band, having both a first antenna coupling point and a second antenna coupling point, whereby the first and the second location of the antenna coupling points are within a coplanar surface on which the antenna array structure is formed. The system may further include a first MMW transmitter that couples a first data modulated MMW signal to the first antenna coupling point and a second MMW transmitter that couples a second data modulated MMW signal to the second antenna coupling point. Coupling the first data modulated MMW signal to the first antenna coupling point generates a first MMW radio signal transmitted at a first propagation direction and coupling the second data modulated MMW signal to the second antenna coupling point generates a second MMW radio signal transmitted at a second propagation direction.
    Type: Grant
    Filed: May 18, 2016
    Date of Patent: March 6, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Xiaoxiong Gu, Duixian Liu, Bodhisatwa Sadhu, Alberto Valdes Garcia
  • Patent number: 9831558
    Abstract: A millimeter-wave (MMW) communication system may include an antenna array structure operating within a MMW band, having both a first antenna coupling point and a second antenna coupling point, whereby the first and the second location of the antenna coupling points are within a coplanar surface on which the antenna array structure is formed. The system may further include a single MMW transmitter device having a power splitter that splits a data modulated MMW signal into a first MMW data modulated signal and a second MMW data modulated signal identical to the first MMW data modulated signal, such that the first data modulated MMW signal is coupled to the first antenna coupling point for radio propagation at a first direction, and the second data modulated MMW signal is coupled to the second antenna coupling point for radio propagation at a second direction.
    Type: Grant
    Filed: March 22, 2017
    Date of Patent: November 28, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Xiaoxiong Gu, Duixian Liu, Bodhisatwa Sadhu, Alberto Valdes Garcia
  • Publication number: 20170338564
    Abstract: A millimeter-wave (MMW) communication system may include an antenna array structure operating within a MMW band, having both a first antenna coupling point and a second antenna coupling point, whereby the first and the second location of the antenna coupling points are within a coplanar surface on which the antenna array structure is formed. The system may further include a single MMW transmitter device having a power splitter that splits a data modulated MMW signal into a first MMW data modulated signal and a second MMW data modulated signal identical to the first MMW data modulated signal, such that the first data modulated MMW signal is coupled to the first antenna coupling point for radio propagation at a first direction, and the second data modulated MMW signal is coupled to the second antenna coupling point for radio propagation at a second direction.
    Type: Application
    Filed: March 22, 2017
    Publication date: November 23, 2017
    Inventors: Xiaoxiong Gu, Duixian Liu, Bodhisatwa Sadhu, Alberto Valdes Garcia
  • Publication number: 20170338563
    Abstract: A millimeter-wave (MMW) communication system may include an antenna array structure operating within a MMW band, having both a first antenna coupling point and a second antenna coupling point, whereby the first and the second location of the antenna coupling points are within a coplanar surface on which the antenna array structure is formed. The system may further include a first MMW transmitter that couples a first data modulated MMW signal to the first antenna coupling point and a second MMW transmitter that couples a second data modulated MMW signal to the second antenna coupling point. Coupling the first data modulated MMW signal to the first antenna coupling point generates a first MMW radio signal transmitted at a first propagation direction and coupling the second data modulated MMW signal to the second antenna coupling point generates a second MMW radio signal transmitted at a second propagation direction.
    Type: Application
    Filed: May 18, 2016
    Publication date: November 23, 2017
    Inventors: Xiaoxiong Gu, Duixian Liu, Bodhisatwa Sadhu, Alberto Valdes Garcia
  • Patent number: 9819098
    Abstract: Package structures are provided having antenna-in-packages that are integrated with semiconductor RFIC (radio frequency integrated circuit) chips to form compact integrated radio/wireless communications systems that operate in the millimeter wave (mmWave) frequency range with radiation in broadside and end-fire directions.
    Type: Grant
    Filed: September 11, 2013
    Date of Patent: November 14, 2017
    Assignee: International Business Machines Corporation
    Inventors: Xiaoxiong Gu, Alberto V. Garcia, Duixian Liu, Scott K. Reynolds
  • Publication number: 20170317418
    Abstract: Package structures are provided having antenna-in-packages that are integrated with semiconductor RFIC (radio frequency integrated circuit) chips to form compact integrated radio/wireless communications systems that operate in the millimeter wave (mmWave) frequency range with radiation in broadside and end-fire directions.
    Type: Application
    Filed: July 12, 2017
    Publication date: November 2, 2017
    Inventors: Alberto V. Garcia, Xiaoxiong Gu, Duixian Liu
  • Patent number: 9806422
    Abstract: Package structures are provided having antenna-in-packages that are integrated with semiconductor RFIC (radio frequency integrated circuit) chips to form compact integrated radio/wireless communications systems that operate in the millimeter wave (mmWave) frequency range with radiation in broadside and end-fire directions.
    Type: Grant
    Filed: December 10, 2014
    Date of Patent: October 31, 2017
    Assignee: International Business Machines Corporation
    Inventors: Alberto V. Garcia, Xiaoxiong Gu, Duixian Liu
  • Patent number: 9660345
    Abstract: A millimeter-wave (MMW) communication system may include an antenna array structure operating within a MMW band, having both a first antenna coupling point and a second antenna coupling point, whereby the first and the second location of the antenna coupling points are within a coplanar surface on which the antenna array structure is formed. The system may further include a single MMW transmitter device having a power splitter that splits a data modulated MMW signal into a first MMW data modulated signal and a second MMW data modulated signal identical to the first MMW data modulated signal, such that the first data modulated MMW signal is coupled to the first antenna coupling point for radio propagation at a first direction, and the second data modulated MMW signal is coupled to the second antenna coupling point for radio propagation at a second direction.
    Type: Grant
    Filed: May 18, 2016
    Date of Patent: May 23, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Xiaoxiong Gu, Duixian Liu, Bodhisatwa Sadhu, Alberto Valdes Garcia
  • Publication number: 20170125895
    Abstract: Antenna package structures are provided to implement wireless communications packages. For example, an antenna package includes a package carrier and a package cover. The package carrier includes an antenna ground plane and an antenna feed line. The package cover includes a planar lid having a planar antenna element formed on a first surface of the planar lid. The package cover is bonded to a first surface of the package carrier with the first surface of the planar lid facing the first surface of the package carrier, and with the planar antenna element aligned to the antenna ground plane and the antenna feed line of the package carrier, wherein the first surface of the planar lid is disposed at a distance from the first surface of the package carrier to provide an air space between the planar antenna element and the package carrier.
    Type: Application
    Filed: January 11, 2017
    Publication date: May 4, 2017
    Inventors: Christian Wilhelmus Baks, Xiaoxiong Gu, Duixian Liu, Alberto Valdes-Garcia