Patents by Inventor Xiaoxiong Gu

Xiaoxiong Gu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11764468
    Abstract: A phased array antenna includes an antenna array substrate having a plurality of antenna elements. At least two beamformers are coupled to the plurality of antenna elements. At least two filters support different frequency bands and are respectively coupled to the at least two beamformers. A frequency converter is coupled to the at least two filters, the frequency converter including one intermediate frequency (IF) port and at least two radio frequency (RF) ports. The one IF port of the frequency converter is configured to support the at least two beamformers via the at least two RF ports. A first beamformer of the at least two beamformers is coupled to a first filter of the at least two filters to form a first beam in a direction different than a second beamformer of the first two beamformers coupled to a second filter of the at least two filters.
    Type: Grant
    Filed: September 7, 2021
    Date of Patent: September 19, 2023
    Assignees: INTERNATIONAL BUSINESS MACHINES CORPORATION, FUJIKURA LTD
    Inventors: Alberto Valdes Garcia, Arun Paidimarri, Bodhisatwa Sadhu, Jean-Olivier Plouchart, Xiaoxiong Gu, Christian Wilhelmus Baks, Yo Yamaguchi, Kiyoshi Kobayashi, Yoshiharu Fujisaku, Ning Guan
  • Patent number: 11658390
    Abstract: Antenna package structures are provided to implement wireless communications packages. For example, an antenna package includes multilayer package substrate, a planar antenna array, antenna feed lines, and resistive transmission lines. The planar antenna array includes an array of active antenna elements and dummy antenna elements surrounding the array of active antenna elements. Each active antenna element is coupled to a corresponding one of the antenna feed lines, and each dummy antenna element is coupled to a corresponding one of the resistive transmission lines. Each resistive transmission line extends through the multilayer package substrate and is terminated in a same metallization layer of the multilayer package substrate.
    Type: Grant
    Filed: January 23, 2020
    Date of Patent: May 23, 2023
    Assignees: International Business Machines Corporation, Ericsson AB
    Inventors: Christian W. Baks, Daniel J. Friedman, Xiaoxiong Gu, Duixian Liu, Alberto Valdes Garcia, Joakim Hallin, Ola Ragnar Tageman
  • Publication number: 20230074376
    Abstract: A phased array antenna includes an antenna array substrate having a plurality of antenna elements. At least two beamformers are coupled to the plurality of antenna elements. At least two filters support different frequency bands and are respectively coupled to the at least two beamformers. A frequency converter is coupled to the at least two filters, the frequency converter including one intermediate frequency (IF) port and at least two radio frequency (RF) ports. The one IF port of the frequency converter is configured to support the at least two beamformers via the at least two RF ports. A first beamformer of the at least two beamformers is coupled to a first filter of the at least two filters to form a first beam in a direction different than a second beamformer of the first two beamformers coupled to a second filter of the at least two filters.
    Type: Application
    Filed: September 7, 2021
    Publication date: March 9, 2023
    Inventors: Alberto Valdes Garcia, Arun Paidimarri, Bodhisatwa Sadhu, Jean-Olivier Plouchart, Xiaoxiong Gu, Christian Wilhelmus Baks, Yo Yamaguchi, Kiyoshi Kobayashi, Yoshiharu Fujisaku, Ning Guan
  • Patent number: 11189905
    Abstract: An apparatus includes an antenna array package cover comprising a radiating surface, a mating surface disposed opposite the radiating surface, and an array of antenna array sub-patterns wherein each antenna array sub-pattern comprises at least one antenna element. The antenna array package also includes an array of sub-pattern interface packages mated to the mating surface of the antenna array package cover. Each sub-pattern interface package of the array of sub-pattern interface packages comprises a package carrier, a sub-pattern integrated circuit electrically and mechanically coupled to the package carrier, and a set of interface lines corresponding to the antenna elements of the antenna array sub-pattern that corresponds to the sub-pattern interface package. Methods for mounting the above apparatus into a host circuit are also disclosed herein.
    Type: Grant
    Filed: April 13, 2018
    Date of Patent: November 30, 2021
    Assignee: International Business Machines Corporation
    Inventors: Xiaoxiong Gu, Duixian Liu, Christian W. Baks, Alberto Valdes Garcia
  • Patent number: 10826194
    Abstract: Techniques regarding a scalable phased array are provided. For example, various embodiments described herein can comprise a plurality of integrated circuits having respective flip chip pads, and an antenna-in-package substrate having a ball grid array terminal and a plurality of transmission lines. The plurality of transmission lines can be embedded within the antenna-in-package substrate and can operatively couple the respective flip chip pads to the ball grid array terminal. In one or more embodiments, a die can comprise the plurality of integrated circuits. Further, in one or more embodiments a combiner can also be embedded in the antenna-in-package substrate. The combiner can join the plurality of transmission lines.
    Type: Grant
    Filed: February 21, 2018
    Date of Patent: November 3, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Xiaoxiong Gu, Wooram Lee, Duixian Liu, Christian Wilhelmus Baks, Alberto Valdes-Garcia
  • Patent number: 10784563
    Abstract: Techniques regarding a scalable phased array are provided. For example, various embodiments described herein can comprise a plurality of integrated circuits having respective flip chip pads, and an antenna-in-package substrate having a ball grid array terminal and a plurality of transmission lines. The plurality of transmission lines can be embedded within the antenna-in-package substrate and can operatively couple the respective flip chip pads to the ball grid array terminal. In one or more embodiments, a die can comprise the plurality of integrated circuits. Further, in one or more embodiments a combiner can also be embedded in the antenna-in-package substrate. The combiner can join the plurality of transmission lines.
    Type: Grant
    Filed: February 21, 2018
    Date of Patent: September 22, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Xiaoxiong Gu, Wooram Lee, Duixian Liu, Christian Wilhelmus Baks, Alberto Valdes-Garcia
  • Publication number: 20200161744
    Abstract: Antenna package structures are provided to implement wireless communications packages. For example, an antenna package includes multilayer package substrate, a planar antenna array, antenna feed lines, and resistive transmission lines. The planar antenna array includes an array of active antenna elements and dummy antenna elements surrounding the array of active antenna elements. Each active antenna element is coupled to a corresponding one of the antenna feed lines, and each dummy antenna element is coupled to a corresponding one of the resistive transmission lines. Each resistive transmission line extends through the multilayer package substrate and is terminated in a same metallization layer of the multilayer package substrate.
    Type: Application
    Filed: January 23, 2020
    Publication date: May 21, 2020
    Inventors: Christian W. Baks, Daniel J. Friedman, Xiaoxiong Gu, Duixian Liu, Alberto Valdes Garcia, Joakim Hallin, Ola Ragnar Tageman
  • Patent number: 10594019
    Abstract: Antenna package structures are provided to implement wireless communications packages. For example, an antenna package includes multilayer package substrate, a planar antenna array, antenna feed lines, and resistive transmission lines. The planar antenna array includes an array of active antenna elements and dummy antenna elements surrounding the array of active antenna elements. Each active antenna element is coupled to a corresponding one of the antenna feed lines, and each dummy antenna element is coupled to a corresponding one of the resistive transmission lines. Each resistive transmission line extends through the multilayer package substrate and is terminated in a same metallization layer of the multilayer package substrate.
    Type: Grant
    Filed: December 3, 2016
    Date of Patent: March 17, 2020
    Assignees: International Business Machines Corporation, Ericsson AB
    Inventors: Christian W. Baks, Daniel J. Friedman, Xiaoxiong Gu, Duixian Liu, Alberto Valdes Garcia, Joakim Hallin, Ola Ragnar Tageman
  • Publication number: 20190319338
    Abstract: An apparatus includes an antenna array package cover comprising a radiating surface, a mating surface disposed opposite the radiating surface, and an array of antenna array sub-patterns wherein each antenna array sub-pattern comprises at least one antenna element. The antenna array package also includes an array of sub-pattern interface packages mated to the mating surface of the antenna array package cover. Each sub-pattern interface package of the array of sub-pattern interface packages comprises a package carrier, a sub-pattern integrated circuit electrically and mechanically coupled to the package carrier, and a set of interface lines corresponding to the antenna elements of the antenna array sub-pattern that corresponds to the sub-pattern interface package. Methods for mounting the above apparatus into a host circuit are also disclosed herein.
    Type: Application
    Filed: April 13, 2018
    Publication date: October 17, 2019
    Inventors: Xiaoxiong Gu, Duixian Liu, Christian W. Baks, Alberto Valdes Garcia
  • Patent number: 10431892
    Abstract: Package structures are provided having antenna-in-packages that are integrated with semiconductor RFIC (radio frequency integrated circuit) chips to form compact integrated radio/wireless communications systems that operate in the millimeter wave (mmWave) frequency range with radiation in broadside and end-fire directions.
    Type: Grant
    Filed: July 12, 2017
    Date of Patent: October 1, 2019
    Assignee: International Business Machines Corporation
    Inventors: Alberto V. Garcia, Xiaoxiong Gu, Duixian Liu
  • Publication number: 20190260109
    Abstract: Techniques regarding a scalable phased array are provided. For example, various embodiments described herein can comprise a plurality of integrated circuits having respective flip chip pads, and an antenna-in-package substrate having a ball grid array terminal and a plurality of transmission lines. The plurality of transmission lines can be embedded within the antenna-in-package substrate and can operatively couple the respective flip chip pads to the ball grid array terminal. In one or more embodiments, a die can comprise the plurality of integrated circuits. Further, in one or more embodiments a combiner can also be embedded in the antenna-in-package substrate. The combiner can join the plurality of transmission lines.
    Type: Application
    Filed: February 21, 2018
    Publication date: August 22, 2019
    Inventors: Xiaoxiong Gu, Wooram Lee, Duixian Liu, Christian Wilhelmus Baks, Alberto Valdes-Garcia
  • Publication number: 20190260138
    Abstract: Techniques regarding a scalable phased array are provided. For example, various embodiments described herein can comprise a plurality of integrated circuits having respective flip chip pads, and an antenna-in-package substrate having a ball grid array terminal and a plurality of transmission lines. The plurality of transmission lines can be embedded within the antenna-in-package substrate and can operatively couple the respective flip chip pads to the ball grid array terminal. In one or more embodiments, a die can comprise the plurality of integrated circuits. Further, in one or more embodiments a combiner can also be embedded in the antenna-in-package substrate. The combiner can join the plurality of transmission lines.
    Type: Application
    Filed: February 21, 2018
    Publication date: August 22, 2019
    Inventors: Xiaoxiong Gu, Wooram Lee, Duixian Liu, Christian Wilhelmus Baks, Alberto Valdes-Garcia
  • Patent number: 10381730
    Abstract: A millimeter-wave (MMW) communication system may include an antenna array structure operating within a MMW band, having both a first antenna coupling point and a second antenna coupling point, whereby the first and the second location of the antenna coupling points are within a coplanar surface on which the antenna array structure is formed. The system may further include a first MMW transmitter that couples a first data modulated MMW signal to the first antenna coupling point and a second MMW transmitter that couples a second data modulated MMW signal to the second antenna coupling point. Coupling the first data modulated MMW signal to the first antenna coupling point generates a first MMW radio signal transmitted at a first propagation direction and coupling the second data modulated MMW signal to the second antenna coupling point generates a second MMW radio signal transmitted at a second propagation direction.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: August 13, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Xiaoxiong Gu, Duixian Liu, Bodhisatwa Sadhu, Alberto Valdes Garcia
  • Patent number: 10170838
    Abstract: Package structures are provided having antenna-in-packages that are integrated with semiconductor RFIC (radio frequency integrated circuit) chips to form compact integrated radio/wireless communications systems that operate in the millimeter wave (mmWave) frequency range with radiation in broadside and end-fire directions.
    Type: Grant
    Filed: July 10, 2015
    Date of Patent: January 1, 2019
    Assignee: International Business Machines Corporation
    Inventors: Alberto V. Garcia, Xiaoxiong Gu, Duixian Liu
  • Publication number: 20180159203
    Abstract: Antenna package structures are provided to implement wireless communications packages. For example, an antenna package includes multilayer package substrate, a planar antenna array, antenna feed lines, and resistive transmission lines. The planar antenna array includes an array of active antenna elements and dummy antenna elements surrounding the array of active antenna elements. Each active antenna element is coupled to a corresponding one of the antenna feed lines, and each dummy antenna element is coupled to a corresponding one of the resistive transmission lines. Each resistive transmission line extends through the multilayer package substrate and is terminated in a same metallization layer of the multilayer package substrate.
    Type: Application
    Filed: December 3, 2016
    Publication date: June 7, 2018
    Inventors: Christian W. Baks, Daniel J. Friedman, Xiaoxiong Gu, Duixian Liu, Alberto Valdes Garcia, Joakim Hallin, Ola Ragnar Tageman
  • Patent number: 9985346
    Abstract: Antenna package structures are provided to implement wireless communications packages. For example, an antenna package includes a package carrier and a package cover. The package carrier includes an antenna ground plane and an antenna feed line. The package cover includes a planar lid having a planar antenna element formed on a first surface of the planar lid. The package cover is bonded to a first surface of the package carrier with the first surface of the planar lid facing the first surface of the package carrier, and with the planar antenna element aligned to the antenna ground plane and the antenna feed line of the package carrier, wherein the first surface of the planar lid is disposed at a distance from the first surface of the package carrier to provide an air space between the planar antenna element and the package carrier.
    Type: Grant
    Filed: January 11, 2017
    Date of Patent: May 29, 2018
    Assignee: International Business Machines Corporation
    Inventors: Christian Wilhelmus Baks, Xiaoxiong Gu, Duixian Liu, Alberto Valdes-Garcia
  • Publication number: 20180108995
    Abstract: A millimeter-wave (MMW) communication system may include an antenna array structure operating within a MMW band, having both a first antenna coupling point and a second antenna coupling point, whereby the first and the second location of the antenna coupling points are within a coplanar surface on which the antenna array structure is formed. The system may further include a first MMW transmitter that couples a first data modulated MMW signal to the first antenna coupling point and a second MMW transmitter that couples a second data modulated MMW signal to the second antenna coupling point. Coupling the first data modulated MMW signal to the first antenna coupling point generates a first MMW radio signal transmitted at a first propagation direction and coupling the second data modulated MMW signal to the second antenna coupling point generates a second MMW radio signal transmitted at a second propagation direction.
    Type: Application
    Filed: November 17, 2017
    Publication date: April 19, 2018
    Inventors: Xiaoxiong Gu, Duixian Liu, Bodhisatwa Sadhu, Alberto Valdes Garcia
  • Publication number: 20180076526
    Abstract: Package structures are provided having antenna-in-packages that are integrated with semiconductor RFIC (radio frequency integrated circuit) chips to form compact integrated radio/wireless communications systems that operate in the millimeter wave (mmWave) frequency range with radiation in broadside and end-fire directions.
    Type: Application
    Filed: July 10, 2015
    Publication date: March 15, 2018
    Inventors: Alberto V. Garcia, Xiaoxiong Gu, Duixian Liu
  • Patent number: 9917368
    Abstract: Package structures are provided having antenna-in-packages that are integrated with semiconductor RFIC (radio frequency integrated circuit) chips to form compact integrated radio/wireless communications systems that operate in the millimeter wave (mmWave) frequency range with radiation in broadside and end-fire directions.
    Type: Grant
    Filed: July 10, 2015
    Date of Patent: March 13, 2018
    Assignee: International Business Machines Corporation
    Inventors: Alberto V. Garcia, Xiaoxiong Gu, Duixian Liu
  • Patent number: 9912061
    Abstract: A millimeter-wave (MMW) communication system may include an antenna array structure operating within a MMW band, having both a first antenna coupling point and a second antenna coupling point, whereby the first and the second location of the antenna coupling points are within a coplanar surface on which the antenna array structure is formed. The system may further include a first MMW transmitter that couples a first data modulated MMW signal to the first antenna coupling point and a second MMW transmitter that couples a second data modulated MMW signal to the second antenna coupling point. Coupling the first data modulated MMW signal to the first antenna coupling point generates a first MMW radio signal transmitted at a first propagation direction and coupling the second data modulated MMW signal to the second antenna coupling point generates a second MMW radio signal transmitted at a second propagation direction.
    Type: Grant
    Filed: May 18, 2016
    Date of Patent: March 6, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Xiaoxiong Gu, Duixian Liu, Bodhisatwa Sadhu, Alberto Valdes Garcia