Patents by Inventor Xin Min

Xin Min has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7988281
    Abstract: Disclosed are: a structural member for use in an eyeglass which has a super elastic property and shape memory property while retaining an excellent biocompatibility in addition to the fact that it is N-free, and which also has an excellent cold workability; an eyeglass frame containing the structural member; and a process for producing the structural member or eyeglass frame. A structural member for an eyeglass containing a Ti—Nb—Zr alloy which comprises (A) 40 to 75% by weight of Ti, (B) 18 to 30% by weight of Nb, (C) 10 to 30% by weight of Zr and (D) 0.2 to 3.7% by weight of at least one additive metal element selected from the group consisting of Al, In and Ga.
    Type: Grant
    Filed: June 12, 2006
    Date of Patent: August 2, 2011
    Assignees: Charmant Co., Ltd., Japan Basic Material Col., Ltd.
    Inventors: Wang Xin Min, Hiroyuki Tada
  • Patent number: 7976848
    Abstract: Synthetic DNA molecules encoding the HPV58 L1 protein are provided. Specifically, the present invention provides polynucleotides encoding HPV58 L1 protein, wherein said polynucleotides are codon-optimized for high level expression in a yeast cell. The synthetic molecules may be used to produce HPV58 virus-like particles (VLPs), and to produce vaccines and pharmaceutical compositions comprising the HPV58 VLPs. The vaccines of the present invention provide effective immunoprophylaxis against papillomavirus infection through neutralizing antibody and cell-mediated immunity and are also useful for treatment of existing HPV infections.
    Type: Grant
    Filed: January 26, 2009
    Date of Patent: July 12, 2011
    Assignee: Merck Sharp & Dohme Corp.
    Inventors: Janine T. Bryan, Michelle K. Brownlow, Loren D. Schultz, Xin-Min Wang, Kathrin U. Jansen
  • Publication number: 20110025646
    Abstract: This invention provides an extended infrared-sourced multi-touch screen, comprising: a display module; at least an infrared (IR) source set in adjacent to a display module as the light source of the multi-touch screen; at least a beam expander optical apparatus being responsive to the at least an IR source to form an IR flat-field line pattern; at least an IR receiver set corresponding to said at least a beam expander optical apparatus to receive IR light emitted by the at least an IR source and to receive IR light from an object when said display module being touched; and a positioning module being responsive to said at least an infrared receiver to process coordinate positioning after the touch action is detected by the at least an IR receiver.
    Type: Application
    Filed: July 31, 2009
    Publication date: February 3, 2011
    Inventors: Xin-Min WU, Jian-Guo Li, Xiao-Qiang Ma, Qing Guo
  • Publication number: 20100272749
    Abstract: Synthetic DNA molecules encoding the HPV58 L1 protein are provided. Specifically, the present invention provides polynucleotides encoding HPV58 L1 protein, wherein said polynucleotides are codon-optimized for high level expression in a yeast cell. The synthetic molecules may be used to produce HPV58 virus-like particles (VLPs), and to produce vaccines and pharmaceutical compositions comprising the HPV58 VLPs. The vaccines of the present invention provide effective immunoprophylaxis against papillomavirus infection through neutralizing antibody and cell-mediated immunity and are also useful for treatment of existing HPV infections.
    Type: Application
    Filed: January 26, 2009
    Publication date: October 28, 2010
    Inventors: Janine T. Bryan, Michelle K. Brownlow, Loren D. Schultz, Xin-Min Wang, Kathrin U. Jansen
  • Publication number: 20100259897
    Abstract: A heat dissipation device dissipates heat generated by a heat-generating electronic element mounted on a top surface printed circuit board. The printed circuit board defines a plurality of first through holes. The heat dissipation device comprises a heat spreader located at a top side of the printed circuit board. The heat spreader defines a plurality of second through holes corresponding to the first through holes, respectively. A first heat sink is located over the heat spreader, and a plurality of second heat sinks is located at a bottom side of the printed circuit board. A plurality of heat pipes extending through the second through holes of the heat spreader and the first through holes of the printed circuit board to thermally connect the first and second heat sinks to the heat spreader.
    Type: Application
    Filed: July 14, 2009
    Publication date: October 14, 2010
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: XU-XIN MIN, MENG FU, CHUN-CHI CHEN
  • Publication number: 20100216771
    Abstract: The present invention relates to a method of treating demyelination diseases, such as multiple sclerosis, comprising administration of an atypical antipsychotic drug, such as quetiapine or an analog thereof, to a subject in need thereof.
    Type: Application
    Filed: November 5, 2007
    Publication date: August 26, 2010
    Inventor: Xin-Min Li
  • Publication number: 20100203496
    Abstract: The present invention relates a fluorescent multiplex PCR assay for detecting the presence of a nucleic acid sequence of an HPV type in a sample using multiple fluorophores to simultaneously detect a plurality of HPV genes of the same HPV type, wherein the HPV type is selected from the group consisting of: HPV31, HPV45, HPV52, and HPV58. The present invention also relates to oligonucleotide primers and probes specific to said HPV types for use in the methods of the present invention.
    Type: Application
    Filed: April 24, 2006
    Publication date: August 12, 2010
    Inventors: Frank J. Taddeo, Deemarie Skulsky, Xin-Min Wang, Kathrin U. Jansen
  • Patent number: 7753109
    Abstract: A heat dissipation device adapted for dissipating heat from a heat-generating device includes a heat pipe assembly and a fin set. The heat pipe assembly is adapted for absorbing heat from the heat-generating device, and includes a plurality of bending heat pipes each having a top face and a bottom face. The fin set thermally engaged with the heat pipe assembly includes a plurality of fins and has a bottom surface cooperatively formed by bottom edges of the fins. The heat pipes of the heat pipe assembly are juxtaposed with each other; the top faces of the heat pipes are thermally attached to the bottom surface of the fin set; the bottom faces of the heat pipes are positioned level with each other to form a contacting surface for contacting with the heat generating device.
    Type: Grant
    Filed: May 23, 2007
    Date of Patent: July 13, 2010
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Xu-Xin Min, Meng Fu, Chun-Chi Chen
  • Publication number: 20100089761
    Abstract: There is provided a metallic glass component with its surface layer having both durability of a film and chromatic color properties, and a method for forming the surface layer. Surface active treatment is performed wherein the surface of the metallic glass component is reacted with a mixed aqueous solution of nitric acid and hydrofluoric acid to remove an oxide film and to provide an anchor bond shape on the surface of a metallic glass component, and electroplating or electroless plating is then performed, to form a plating film on the surface of the metallic glass component. It is thereby possible to form a surface layer of a metallic glass which has both durability and a chromatic color.
    Type: Application
    Filed: March 13, 2007
    Publication date: April 15, 2010
    Applicants: TOHOKU UNIVERSITY, EYETEC CO., LTD., NGK INSULATORS, LTD., MAKABE R&D CO., LTD.
    Inventors: Xin Min Wang, Naokuni Muramatsu, Junsuke Kiuchi, Hiroshi Suzuki, Tatsue Arakawa, Hisamichi Kimura, Akihisa Inoue, Eiichi Makabe
  • Publication number: 20100073624
    Abstract: Disclosed are: a structural member for use in an eyeglass which has a super elastic property and shape memory property while retaining an excellent biocompatibility in addition to the fact that it is N-free, and which also has an excellent cold workability; an eyeglass frame comprising the structural member; and a process for producing the structural member or eyeglass frame. A structural member for an eyeglass comprising a Ti—Nb—Zr alloy which comprises (A) 40 to 75% by weight of Ti, (B) 18 to 30% by weight of Nb, (C) 10 to 30% by weight of Zr and (D) 0.2 to 3.7% by weight of at least one additive metal element selected from the group consisting of Al, In and Ga.
    Type: Application
    Filed: June 12, 2006
    Publication date: March 25, 2010
    Inventors: Xin Min WANG, Hiroyuki TADA
  • Patent number: 7663884
    Abstract: A heat dissipation device attached to a top surface of an electronic device mounted on a printed circuit board, includes a heat sink and a retainer securing the heat sink onto the electronic device. The retainer includes a frame, a plurality of baffle walls and protrusion posts extending downwardly from the frame. Lower ends of the baffle walls of the retainer extend downwardly through the heat sink and engage with engaging edges of the electronic device. The heat dissipation device is further provided with a plurality of elastic members which respectively surround the protrusion posts of the retainer and are compressed between the retainer and the heat sink, thereby pushing the heat sink downwardly toward the electronic device.
    Type: Grant
    Filed: October 8, 2008
    Date of Patent: February 16, 2010
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Xu-Xin Min, Meng Fu, Chun-Chi Chen
  • Publication number: 20100002381
    Abstract: A heat dissipation device used for dissipating heat generated by an electronic device comprises a base defining two cutouts recessed from two opposite sides thereof, two fasteners mounted in through holes of the base via the two cutouts and two elastic members coiled around the two fasteners. Each of the two fasteners comprises a shaft, a head and a threaded pole located at two ends of the shaft, a latching portion interconnecting the shaft and the threaded pole and a mounting portion which is formed on the shaft and located a distance above the latching portion. The mounting portion extends through the cutout and makes the elastic member be sandwiched elastically between the head and a top face of the base. The latching portion abuts against a bottom face of the base, thereby the two fasteners being mounted on the base.
    Type: Application
    Filed: September 26, 2008
    Publication date: January 7, 2010
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: XU-XIN MIN, MENG FU, CHUN-CHI CHEN
  • Publication number: 20100003665
    Abstract: The present invention relates a fluorescent multiplex PCR assay for detecting the presence of an HPV type in a sample using multiple fluorophores to simultaneously detect a plurality of HPV genes of the same HPV type, wherein the HPV type is selected from the group consisting of: HPV33, HPV35, HPV39, HPV51, HPV56, and HPV59. The present invention also relates to oligonucleotide primers and probes specific to said HPV types for use in the methods of the present invention.
    Type: Application
    Filed: April 24, 2006
    Publication date: January 7, 2010
    Inventors: Frank J. Taddeo, DeeMarie Skulsky, Xin-Min Wang, Kathrin U. Jansen
  • Patent number: 7597134
    Abstract: A heat dissipation device comprises at least two heat pipes (10) and a plurality of fins (20) thermally connected with the heat pipes (10). Each of the heat pipes (10) comprises a flattened evaporating portion (12) and a condensing portion (14). The evaporating portions (12) are closely connected with each other. A flat bottom surface (125) of the evaporating portions (12) of the heat pipes (10) directly engages with an electronic component. A flat top surface (120) of the evaporating portions (12) of the heat pipes (10) directly engages with a bottom surface of the fins (20). The condensing portions (14) of the heat pipes (10) extend through the fins (20).
    Type: Grant
    Filed: March 7, 2007
    Date of Patent: October 6, 2009
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Xu-Xin Min, Meng Fu, Chun-Chi Chen
  • Publication number: 20090244849
    Abstract: A heat dissipation device attached to a top surface of an electronic device mounted on a printed circuit board, includes a heat sink and a retainer securing the heat sink onto the electronic device. The retainer includes a frame, a plurality of baffle walls and protrusion posts extending downwardly from the frame. Lower ends of the baffle walls of the retainer extend downwardly through the heat sink and engage with engaging edges of the electronic device. The heat dissipation device is further provided with a plurality of elastic members which respectively surround the protrusion posts of the retainer and are compressed between the retainer and the heat sink, thereby pushing the heat sink downwardly toward the electronic device.
    Type: Application
    Filed: October 8, 2008
    Publication date: October 1, 2009
    Applicants: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Xu-Xin Min, Meng Fu, Chun-Chi Chen
  • Publication number: 20090236076
    Abstract: A heat dissipation device includes a base, a fin group located on the base, a first heat pipe and a second heat pipe. The fin group includes a first fin group, a second fin group arranged on the first fin group and a third fin group arranged on the second fin group. The first heat pipe includes an evaporating portion sandwiched between the base and the first fin group, a condensing portion sandwiched between the first fin group and the second fin group, and a connecting portion interconnecting the evaporating portion and the condensing portion. The second heat pipe includes an evaporating portion sandwiched between the base and the first fin group, a condensing portion located between the second fin group and the third fin group, and a connecting portion interconnecting the evaporating portion and the condensing portion thereof.
    Type: Application
    Filed: March 20, 2008
    Publication date: September 24, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: XU-XIN MIN, MENG FU, CHUN-CHI CHEN
  • Patent number: 7498036
    Abstract: Synthetic DNA molecules encoding the HPV58 L1 protein are provided. Specifically, the present invention provides polynucleotides encoding HPV58 L1 protein, wherein said polynucleotides are codon-optimized for high level expression in a yeast cell. The synthetic molecules may be used to produce HPV58 virus-like particles (VLPs), and to produce vaccines and pharmaceutical compositions comprising the HPV58 VLPs. The vaccines of the present invention provide effective imnunoprophylaxis against papillomavirus infection through neutralizing antibody and cell-mediated immunity and are also useful for treatment of existing HPV infections.
    Type: Grant
    Filed: November 10, 2004
    Date of Patent: March 3, 2009
    Assignee: Merck & Co., Inc.
    Inventors: Janine T. Bryan, Michelle K. Brownlow, Loren D. Schultz, Xin-Min Wang, Kathrin U. Jansen
  • Publication number: 20090044924
    Abstract: A challenge of the present invention is to develop a method for repeatedly forming a reverse transferred pattern in a simple and efficient manner onto the surfaces of Zr based, Ti based, Cu based, Ni based and Fe based metallic glass that have supercooled liquid temperatures of not lower than 400° C. and are also required to be molded at not lower than 400° C. (a) An image pattern is converted into bitmap data being mirror reversed with respect to a real image, (b) high energy density light 15 is repeatedly flashed, and the surface of a mold 20 is scanned while one of dot holes 24 is formed by one-time irradiation, to form an image pattern as dots assembled pattern 21 onto the surface of the mold 20 in accordance with the bitmap data, and (c) the dots assembled pattern 21 is reverse-transfer molded onto a metallic glass 1 within a supercooled liquid temperature range Tg-Tx by means of the mold 20 which is for dots assembled pattern formation.
    Type: Application
    Filed: October 10, 2006
    Publication date: February 19, 2009
    Applicant: NGK INSULATORS, LTD.
    Inventors: Akihisa Inoue, Xin Min Wang, Naokuni Muramatsu, Yoshimasa Kondo, Kenji Kato
  • Publication number: 20080289798
    Abstract: A heat dissipation device adapted for dissipating heat from a heat-generating device includes a heat pipe assembly and a fin set. The heat pipe assembly is adapted for absorbing heat from the heat-generating device, and includes a plurality of bending heat pipes each having a top face and a bottom face. The fin set thermally engaged with the heat pipe assembly includes a plurality of fins and has a bottom surface cooperatively formed by bottom edges of the fins. The heat pipes of the heat pipe assembly are juxtaposed with each other; the top faces of the heat pipes are thermally attached to the bottom surface of the fin set; the bottom faces of the heat pipes are positioned level with each other to form a contacting surface for contacting with the heat generating device.
    Type: Application
    Filed: May 23, 2007
    Publication date: November 27, 2008
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: XU-XIN MIN, MENG FU, CHUN-CHI CHEN
  • Publication number: 20080216990
    Abstract: A heat dissipation device comprises at least two heat pipes (10) and a plurality of fins (20) thermally connected with the heat pipes (10). Each of the heat pipes (10) comprises a flattened evaporating portion (12) and a condensing portion (14). The evaporating portions (12) are closely connected with each other. A flat bottom surface (125) of the evaporating portions (12) of the heat pipes (10) directly engages with an electronic component. A flat top surface (120) of the evaporating portions (12) of the heat pipes (10) directly engages with a bottom surface of the fins (20). The condensing portions (14) of the heat pipes (10) extend through the fins (20).
    Type: Application
    Filed: March 7, 2007
    Publication date: September 11, 2008
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: XU-XIN MIN, MENG FU, CHUN-CHI CHEN