Abstract: The present invention relates to a temperature control system and a temperature control method for an electronic device-testing apparatus. The temperature control system mainly includes a test socket, a temperature-controlling fluid supply device and a temperature-controlling fluid recovery device. A temperature-controlling fluid is supplied to a chip slot of the test socket by the temperature-controlling fluid supply device and drawn from the chip slot by the temperature-controlling fluid recovery device. In the present invention, the temperature-controlling fluid is forced to flow through the chip slot loaded with an electronic device so as to forcibly exchange heat with the electronic device and components in the chip slot, thereby achieving the constant temperature test. After the test is completed, the temperature-controlling fluid can be effectively recovered so that the contamination of the electronic device or the testing apparatus can be avoided.

Abstract: A liquid cooling system, a liquid cooling method, and an electronic device-testing apparatus having the system are disclosed. When an electronic device is accommodated in a chip slot of a test socket, a cooling liquid supply device supplies a cooling liquid to the chip slot through a fluid inlet portion, and the cooling liquid at least flows over parts of the upper and lower surfaces of the electronic device and then flows out from a fluid outlet portion. The chip slot of the test socket serves as the flow space for the cooling liquid so that the cooling liquid can flow over the upper and lower surfaces of the electronic device, and the electronic device can be immersed in the continuously flowing cooling liquid. The flowing cooling liquid can also take away foreign matter, avoiding the influence of the foreign matter on the test.

Abstract: The present invention relates to an aging test system and an aging test method for a thermal interface material and an electronic device testing apparatus having the system, wherein a controller controls a movable carrier to move to a high temperature generating device so that the thermal interface material on the movable carrier is brought into contact with the high temperature generating device; the controller further controls a temperature sensor to detect the temperature of the thermal interface material; the controller compares an output temperature datum of the high temperature generating device with a temperature measurement datum detected by the temperature sensor. Accordingly, the thermal conductivity of the thermal interface material can be obtained for immediately determining the quality and the performance degradation of the thermal interface material, which can be used as a reference for selection or replacement of the thermal interface material.

Abstract: The present invention relates to an apparatus for testing a package-on-package semiconductor device, mainly comprising a pick-and-place device, a test socket, an upper chip holder, and a main controller. When a first package device is to be tested, the main controller controls the pick-and-place device to load the first package device into the test socket and then controls the pick-and-place device to transfer the upper chip holder and bring the upper chip holder into electrical contact with the first package device on the test socket so that a second package device in the upper chip holder is electrically connected to the first package device for testing. Accordingly, the upper chip holder is an independent component. Only when a test is executed, the pick-and-place device transfers the upper chip holder onto the test socket so that the second package device is electrically connected to the first package device.

Abstract: The present invention relates to a multistory electronic device testing apparatus, which mainly comprises a feeding and binning device, a multi-axis transfer device, a chip-testing device and a main controller. The feeding and binning device includes an upper module and a lower module. The chip-testing device includes a plurality of testing units arranged vertically. The main controller not only controls the feeding, binning and testing operations, but also controls the multi-axis transfer device to transfer an electronic device to be tested or a tested electronic device between the feeding and binning device and the chip-testing device. Accordingly, the three-dimensional arrangement of the feeding and binning module and the testing device is realized, and the accommodating capacity and the testing capacity for the electronic devices to be tested and the tested electronic devices can be increased.

Abstract: The present invention relates to a multistory electronic device testing apparatus, which mainly comprises a feeding and binning device, a multi-axis transfer device, a chip-testing device and a main controller. The feeding and binning device includes an upper module and a lower module. The chip-testing device includes a plurality of testing units arranged vertically. The main controller not only controls the feeding, binning and testing operations, but also controls the multi-axis transfer device to transfer an electronic device to be tested or a tested electronic device between the feeding and binning device and the chip-testing device. Accordingly, the three-dimensional arrangement of the feeding and binning module and the testing device is realized, and the accommodating capacity and the testing capacity for the electronic devices to be tested and the tested electronic devices can be increased.

Abstract: A position calibration system and method are disclosed, in which a control unit is provided to control a positioner sensing module to scan a circular positioner provided on a positioning substrate in a first direction and a second direction so as to acquire midpoints of two scanned line segments and acquire an intersection of lines extending from the two center points in a direction perpendicular to the first and the second directions as a calibration reference point, which correspond to a centroid (a center) of the circular positioner. The calibration reference point functions as a reference point for positioning the positioning substrate with respect to the positioner sensing module and is stored in a memory unit. The calibration reference point can be used as a positioning point during installation of a machine and can also be used for calibration of a position of the machine.

Abstract: An apparatus and a method provide a high temperature test and a low temperature test. The apparatus mainly includes a depressing head and a test base, wherein the depressing head includes a cooling module, a heating module, and a heat dissipation module therein, the heat dissipation module includes a finned heat sink and a heat conduction member, and the heat conduction member is thermally coupled to the heating module and the finned heat sink. When the low temperature test is performed, an electronic component is cooled by filling liquid nitrogen into the cooling module of the depressing head. When the high temperature test is performed, the electronic component is heated by the heating module. If the temperature of the electronic device is higher than a predetermined high temperature, the electronic device is cooled by the heat dissipation module.

Abstract: The present invention relates to an apparatus and a method for a high temperature test and a low temperature test. The apparatus mainly comprises a depressing head and a test base, wherein the depressing head comprises a cooling module, a heating module, and a heat dissipation module therein, the heat dissipation module comprises a finned heat sink and a heat conduction member, and the heat conduction member is thermally coupled to the heating module and the finned heat sink. When the low temperature test is performed, an electronic component is cooled by filling liquid nitrogen into the cooling module of the depressing head. When the high temperature test is performed, the electronic component is heated by the heating module. If the temperature of the electronic device is higher than a predetermined high temperature, the electronic device is cooled by the heat dissipation module.

Abstract: A dew resistant module for a test socket, and an electronic component testing device having the same are provided. An enclosure body is provided to circumscribe the test socket; and a test socket base plate provided on top of the test socket and enclosure body. A cover is provided to cover the test socket, enclosure body and test socket base plate. With the provision of the enclosure body and the cover, the test socket, test socket base plate and a portion of the thermal head are prevented from coming into contact directly with the atmosphere, whereby condensation or dewing is prevented, thermal insulation achieved and energy consumption minimized.

Abstract: A temperature-controlled module for electronic devices and a testing apparatus provided with the same mainly include a temperature-controlled tray, an upper board and a dry-air supply device. The temperature-controlled tray includes holding cavities for accommodating electronic devices and a fluid chamber for cooling fluid. The upper board is furnished with through holes, while the upper board and the temperature-controlled tray are spaced by a predetermined distance. The dry-air supply device provides dry air to a space between the temperature-controlled tray and the upper board. Thereupon, by having cooling fluid to flow inside the temperature-controlled tray, the temperature-controlled tray can be kept in a lower predetermined temperature so as to rapidly cool down the electronic device. In addition, by providing the upper board and the dry-air supply device to allow dry air to flow through the surface of the electronic device, then the water-condensation phenomenon and air leakage can avoided.

Abstract: A dual loop type temperature control module and an electronic device testing apparatus having the same are provided. The temperature control module comprises a first loop through which a first working fluid of a first temperature flows, a second loop through which a second working fluid of a second temperature flows, a controller for controlling a first switching valve such that the first or second working fluid flows through a temperature regulating device, and a second switching valve such that the working fluid flowing through the temperature regulating device returns to the first or second loop. The temperature regulating device adjusts a thermoelectric cooling device to reach two different reference temperatures based on the rise/fall of its temperature dependent on the working fluid.

Abstract: A dew resistant module for a test socket, and an electronic component testing device having the same are provided. An enclosure body is provided to circumscribe the test socket; and a test socket base plate provided on top of the test socket and enclosure body. A cover is provided to cover the test socket, enclosure body and test socket base plate. With the provision of the enclosure body and the cover, the test socket, test socket base plate and a portion of the thermal head are prevented from coming into contact directly with the atmosphere, whereby condensation or dewing is prevented, thermal insulation achieved and energy consumption minimized.

Abstract: A temperature-controlled module for electronic devices and a testing apparatus provided with the same mainly include a temperature-controlled tray, an upper board and a dry-air supply device. The temperature-controlled tray includes holding cavities for accommodating electronic devices and a fluid chamber for cooling fluid. The upper board is furnished with through holes, while the upper board and the temperature-controlled tray are spaced by a predetermined distance. The dry-air supply device provides dry air to a space between the temperature-controlled tray and the upper board. Thereupon, by having cooling fluid to flow inside the temperature-controlled tray, the temperature-controlled tray can be kept in a lower predetermined temperature so as to rapidly cool down the electronic device. In addition, by providing the upper board and the dry-air supply device to allow dry air to flow through the surface of the electronic device, then the water-condensation phenomenon and air leakage can avoided.

Abstract: A dual loop type temperature control module and an electronic device testing apparatus having the same are provided. The temperature control module comprises a first loop through which a first working fluid of a first temperature flows, a second loop through which a second working fluid of a second temperature flows, a controller for controlling a first switching valve such that the first or second working fluid flows through a temperature regulating device, and a second switching valve such that the working fluid flowing through the temperature regulating device returns to the first or second loop. The temperature regulating device adjusts a thermoelectric cooling device to reach two different reference temperatures based on the rise/fall of its temperature dependent on the working fluid.

Abstract: A radiator module system for automatic test equipment, including a test arm and a closed-loop circulating cooling device disposed on the test arm. The test arm includes a test head, and an internal channel is formed within and passing through the test head. The closed-loop circulating cooling device includes an inlet and an outlet, respectively connected to the internal channel; a conduit connecting the inlet and the outlet, such that the conduit and the internal channel form a closed-loop circulating channel in which a working fluid flows; a cooling device in contact with the conduit, configured to perform heat dissipation to the working fluid flowing within the conduit; and a driving source configured to drive the working fluid to flow within the closed-loop circulating channel. The working fluid is driven by the driving source to flow within the closed-loop circulating channel to perform heat dissipation.

Abstract: The disclosure discloses a heating furnace including a housing, a first rack, a chamber, and at least one fan. The first rack is disposed in the housing. The chamber is disposed in the housing and located at a side of the first rack. The chamber includes an inlet, a first sidewall, and a second sidewall. The first sidewall is adjacent to the first rack. The first sidewall has a plurality of vents. The first sidewall and the second sidewall are disposed to face each other. A width is spaced between the first sidewall and the second sidewall, and the width is larger than or equal to 200 mm. The fan is disposed in the housing for generating an airflow to the inlet.

Abstract: A temperature control equipment is capable of controlling a tested object to a predetermined temperature. The temperature control equipment includes a thermal conducting plate, a temperature regulating module, a carrier plate, and a thermoelectric cooling module. The temperature regulating module is thermally connected to the thermal conducting plate for regulating the thermal conducting plate to a reference temperature. The carrier plate is used to accommodate the tested object. The thermoelectric cooling module is thermally connected between the thermal conducting plate and the carrier plate for controlling the tested object to the predetermined temperature via the carrier plate based on the reference temperature.

Abstract: A test apparatus includes a test site, a buffer carrying device, a transport carrying device, a handling mechanism and a dry air flow guide mechanism. The test site performs a test procedure on the objects. The buffer carrying device is disposed close to a side of the test site, holds the objects and performs a temperature conditioning process. The transport carrying device is disposed close to another side of the test site, moves back and forth along a transporting direction, transports the objects into and out of the test site, and heats up the objects. The handling mechanism carries the objects among the buffer carrying device, the test site and the transport carrying device. The dry air flow guide mechanism guides a dry air to surround the test site, the buffer carrying device, the transport carrying device and the handling mechanism and generates a dry environment to prevent dew condensation.

Abstract: A temperature control module for a socket is provided with of an upper docking plate and a lower docking plate. The upper docking plate has a recess for accommodating a socket and two temperature-controlling fluid passages. One end of the passages communicates with the recess, and the other end thereof is connected to a temperature-controlling fluid source. The lower docking plate is disposed under the upper docking plate and covers the recess. A fluid chamber is formed of the recess of the docking plate, the lower docking plate and the socket. The temperature-controlling fluid source outputs a temperature-controlling fluid to the fluid chamber via the temperature-controlling fluid passages for maintaining the socket at a specific temperature.