Patents by Inventor Xin-Yi Wu
Xin-Yi Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250216445Abstract: A chip cooling module and a chip testing apparatus having the same are provided. The chip cooling module includes a socket and a fluid supply device. The socket includes a chip slot and at least one fluid channel, and the chip slot is configured to accommodate a chip. The fluid supply device is in communication with the at least one fluid channel of the socket. The at least one fluid channel includes a divergent opening, and the divergent opening is provided on a sidewall of the socket and faces the chip slot. In response to the fluid supply device supplying a cooling fluid to the at least one fluid channel, the cooling fluid forms a jet stream toward the chip slot through the divergent opening.Type: ApplicationFiled: November 22, 2024Publication date: July 3, 2025Applicant: CHROMA ATE INC.Inventors: Yu-Wei Chuang, Xin-Yi Wu, Jui-Che Chou
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Publication number: 20250216444Abstract: An anti-condensation low-temperature testing module and a chip testing apparatus having the same are provided. The low-temperature testing module includes a low-temperature dry-gas supplying device, a low-temperature chamber, a low-temperature generating device, and a communicating pipe. The low-temperature dry-gas supplying device is configured to provide a low-temperature dry-gas to a chip socket of a testing base. The low-temperature generating device is arranged in the low-temperature chamber and coupled to the testing base. The low-temperature generating device is configured to cool down the testing base. One of two ends of the communicating pipe is in communication with the chip socket of the testing base, and the other end of the communicating pipe is in communication with the low-temperature chamber.Type: ApplicationFiled: September 11, 2024Publication date: July 3, 2025Applicant: CHROMA ATE INC.Inventors: Yu-Wei Chuang, Xin-Yi Wu, Jui-Che Chou
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Patent number: 12253541Abstract: The present invention relates to a pogo pin cooling system and a pogo pin cooling method and an electronic device testing apparatus having the system. The system mainly comprises a coolant circulation module, which includes a coolant supply channel communicated with an inlet of a chip socket and a coolant recovery channel communicated with an outlet of the chip socket. When an electronic device is accommodated in the chip socket, the coolant circulation module supplies a coolant into the chip socket through the coolant supply channel and the inlet, and the coolant passes through the pogo pins and then flows into the coolant recovery channel through the outlet.Type: GrantFiled: October 28, 2022Date of Patent: March 18, 2025Assignee: CHROMA ATE INC.Inventors: I-Shih Tseng, Xin-Yi Wu, I-Ching Tsai, Chin-Yi Ouyang
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Publication number: 20250040095Abstract: A phase-change temperature regulating system and an electronic device testing apparatus and method are described. In an embodiment, the system uses a temperature regulating fluid chamber containing a temperature regulating fluid to allow the temperature regulating fluid to cover at least a part of at least one surface of an electronic component. When a temperature of the electronic component reaches a boiling point of the temperature regulating fluid, the temperature regulating fluid becomes steam through a phase change to transfer heat energy outward from the electronic component, and condenses on an inner surface of the fluid chamber to further transfer heat energy of the steam to a temperature-regulating apparatus. The condensed temperature regulating fluid flows back to the temperature regulating fluid, thereby continuously circulating.Type: ApplicationFiled: May 10, 2024Publication date: January 30, 2025Applicant: CHROMA ATE INC.Inventors: Xin-Yi Wu, Yu-Wei Chuang, I-Ching Tsai
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Publication number: 20250027987Abstract: An inspection system with a thermal interface, and an electronic component inspection device and method are provided. First, a temperature regulator contacts an electronic component to be tested, where there is a thermal interface between the temperature regulator and the electronic component to be tested, and the electronic component to be tested includes a plurality of temperature sensing units. Then, the temperature regulator heats or cools the electronic component to be tested to a specific temperature, and the plurality of temperature sensing units of the electronic component to be tested detect temperatures at locations of the temperature sensing units. In this way, a contact condition between the temperature regulator and the electronic component to be tested, and quality or an aging status of the thermal interface can be determined.Type: ApplicationFiled: May 13, 2024Publication date: January 23, 2025Applicant: CHROMA ATE INC.Inventors: I-Shih Tseng, Chin-Yi Ou Yang, I-Ching Tsai, Xin-Yi Wu
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Patent number: 12196806Abstract: The present invention relates to an aging test system and an aging test method for a thermal interface material and an electronic device testing apparatus having the system, wherein a controller controls a movable carrier to move to a high temperature generating device so that the thermal interface material on the movable carrier is brought into contact with the high temperature generating device; the controller further controls a temperature sensor to detect the temperature of the thermal interface material; the controller compares an output temperature datum of the high temperature generating device with a temperature measurement datum detected by the temperature sensor. Accordingly, the thermal conductivity of the thermal interface material can be obtained for immediately determining the quality and the performance degradation of the thermal interface material, which can be used as a reference for selection or replacement of the thermal interface material.Type: GrantFiled: November 10, 2022Date of Patent: January 14, 2025Assignee: CHROMA ATE INC.Inventors: I-Shih Tseng, Xin-Yi Wu, Chin-Yi Ouyang
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Patent number: 12093014Abstract: A position calibration system and method are disclosed, in which a control unit is provided to control a positioner sensing module to scan a circular positioner provided on a positioning substrate in a first direction and a second direction so as to acquire midpoints of two scanned line segments and acquire an intersection of lines extending from the two center points in a direction perpendicular to the first and the second directions as a calibration reference point, which correspond to a centroid (a center) of the circular positioner. The calibration reference point functions as a reference point for positioning the positioning substrate with respect to the positioner sensing module and is stored in a memory unit. The calibration reference point can be used as a positioning point during installation of a machine and can also be used for calibration of a position of the machine.Type: GrantFiled: January 21, 2022Date of Patent: September 17, 2024Assignee: CHROMA ATE INC.Inventors: Chin-Yi Ouyang, Wei-Cheng Kuo, Chien-Ming Chen, Xin-Yi Wu
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Publication number: 20240192268Abstract: A multiphase thermal interface component, a method of forming the same, and an electronic device testing apparatus provided with the same are provided. The multiphase thermal interface component includes a thermal interface solid element and a thermal interface fluid material. The thermal conductive surface of the thermal interface solid element has an accommodation space, and the thermal interface fluid material is accommodated in the accommodation space. Therefore, the multiphase thermal interface component combines solid-phase and fluid-phase thermal interface materials. Since fluids have the properties of changing shape, flowing, and splitting arbitrarily, the thermal interface fluid material can completely fill up the air gaps between the thermal interface solid element and the thermal control device/the temperature-controlled component, so that the full surface temperature control of the contact interface can be achieved, thereby effectively improving the thermal conduction performance.Type: ApplicationFiled: November 16, 2023Publication date: June 13, 2024Applicant: CHROMA ATE INC.Inventors: Yu-Wei Chuang, Xin-Yi Wu, Jui-Che Chou
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Publication number: 20240151746Abstract: The present invention relates to a pogo pin cooling system and a pogo pin cooling method and an electronic device testing apparatus having the system. The system uses a cooling fluid supply module for the cooling of the pogo pin, and the cooling fluid may be either a coolant or a cooling gas. When an electronic device is accommodated in the chip socket, the cooling fluid supply module supplies a cooling fluid into the chip socket through the cooling fluid supply channel and the inlet, and the cooling fluid passes through the pogo pins and then flows into the cooling fluid discharge channel through the outlet. In the present invention, the cooling fluid is mainly used to cool not only the pogo pins in the chip socket but also the bottom surface of the electronic device and the solder ball contacts on the bottom surface.Type: ApplicationFiled: April 27, 2023Publication date: May 9, 2024Inventors: I-Shih TSENG, I-Ching TSAI, Xin-Yi WU, Chin-Yi OUYANG
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Publication number: 20240142492Abstract: The present invention relates to a pogo pin cooling system and a pogo pin cooling method and an electronic device testing apparatus having the system. The system mainly comprises a coolant circulation module, which includes a coolant supply channel communicated with an inlet of a chip socket and a coolant recovery channel communicated with an outlet of the chip socket. When an electronic device is accommodated in the chip socket, the coolant circulation module supplies a coolant into the chip socket through the coolant supply channel and the inlet, and the coolant passes through the pogo pins and then flows into the coolant recovery channel through the outlet.Type: ApplicationFiled: October 28, 2022Publication date: May 2, 2024Inventors: I-Shih TSENG, Xin-Yi WU, I-Ching TSAI, Chin-Yi OUYANG
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Publication number: 20230400478Abstract: A liquid cooling system, a liquid cooling method, and an electronic device-testing apparatus having the system are disclosed. When an electronic device is accommodated in a chip slot of a test socket, a cooling liquid supply device supplies a cooling liquid to the chip slot through a fluid inlet portion, and the cooling liquid at least flows over parts of the upper and lower surfaces of the electronic device and then flows out from a fluid outlet portion. The chip slot of the test socket serves as the flow space for the cooling liquid so that the cooling liquid can flow over the upper and lower surfaces of the electronic device, and the electronic device can be immersed in the continuously flowing cooling liquid. The flowing cooling liquid can also take away foreign matter, avoiding the influence of the foreign matter on the test.Type: ApplicationFiled: June 1, 2023Publication date: December 14, 2023Inventors: I-Shih TSENG, Chin-Yi OUYANG, I-Ching TSAI, Xin-Yi WU, Yan-Lin WU
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Publication number: 20230400506Abstract: The present invention relates to a temperature control system and a temperature control method for an electronic device-testing apparatus. The temperature control system mainly includes a test socket, a temperature-controlling fluid supply device and a temperature-controlling fluid recovery device. A temperature-controlling fluid is supplied to a chip slot of the test socket by the temperature-controlling fluid supply device and drawn from the chip slot by the temperature-controlling fluid recovery device. In the present invention, the temperature-controlling fluid is forced to flow through the chip slot loaded with an electronic device so as to forcibly exchange heat with the electronic device and components in the chip slot, thereby achieving the constant temperature test. After the test is completed, the temperature-controlling fluid can be effectively recovered so that the contamination of the electronic device or the testing apparatus can be avoided.Type: ApplicationFiled: May 12, 2023Publication date: December 14, 2023Inventors: Chin-Yi OUYANG, I-Ching TSAI, Xin-Yi WU, Yan-Lin WU
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Publication number: 20230375615Abstract: The present invention relates to an aging test system and an aging test method for a thermal interface material and an electronic device testing apparatus having the system, wherein a controller controls a movable carrier to move to a high temperature generating device so that the thermal interface material on the movable carrier is brought into contact with the high temperature generating device; the controller further controls a temperature sensor to detect the temperature of the thermal interface material; the controller compares an output temperature datum of the high temperature generating device with a temperature measurement datum detected by the temperature sensor. Accordingly, the thermal conductivity of the thermal interface material can be obtained for immediately determining the quality and the performance degradation of the thermal interface material, which can be used as a reference for selection or replacement of the thermal interface material.Type: ApplicationFiled: November 10, 2022Publication date: November 23, 2023Inventors: I-Shih TSENG, Xin-Yi WU, Chin-Yi OUYANG
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Publication number: 20230349968Abstract: The present invention relates to an apparatus for testing a package-on-package semiconductor device, mainly comprising a pick-and-place device, a test socket, an upper chip holder, and a main controller. When a first package device is to be tested, the main controller controls the pick-and-place device to load the first package device into the test socket and then controls the pick-and-place device to transfer the upper chip holder and bring the upper chip holder into electrical contact with the first package device on the test socket so that a second package device in the upper chip holder is electrically connected to the first package device for testing. Accordingly, the upper chip holder is an independent component. Only when a test is executed, the pick-and-place device transfers the upper chip holder onto the test socket so that the second package device is electrically connected to the first package device.Type: ApplicationFiled: April 12, 2023Publication date: November 2, 2023Inventors: Chin-Yi OUYANG, Xin-Yi WU, Chien-Ming CHEN, Meng-Kung LU, Chia-Hung CHIEN
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Patent number: 11740283Abstract: The present invention relates to a multistory electronic device testing apparatus, which mainly comprises a feeding and binning device, a multi-axis transfer device, a chip-testing device and a main controller. The feeding and binning device includes an upper module and a lower module. The chip-testing device includes a plurality of testing units arranged vertically. The main controller not only controls the feeding, binning and testing operations, but also controls the multi-axis transfer device to transfer an electronic device to be tested or a tested electronic device between the feeding and binning device and the chip-testing device. Accordingly, the three-dimensional arrangement of the feeding and binning module and the testing device is realized, and the accommodating capacity and the testing capacity for the electronic devices to be tested and the tested electronic devices can be increased.Type: GrantFiled: June 7, 2022Date of Patent: August 29, 2023Assignee: CHROMA ATE INC.Inventors: Chin-Yi Ouyang, Chien-Ming Chen, Wei-Cheng Kuo, Xin-Yi Wu, Iching Tsai
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Publication number: 20230022501Abstract: The present invention relates to a multistory electronic device testing apparatus, which mainly comprises a feeding and binning device, a multi-axis transfer device, a chip-testing device and a main controller. The feeding and binning device includes an upper module and a lower module. The chip-testing device includes a plurality of testing units arranged vertically. The main controller not only controls the feeding, binning and testing operations, but also controls the multi-axis transfer device to transfer an electronic device to be tested or a tested electronic device between the feeding and binning device and the chip-testing device. Accordingly, the three-dimensional arrangement of the feeding and binning module and the testing device is realized, and the accommodating capacity and the testing capacity for the electronic devices to be tested and the tested electronic devices can be increased.Type: ApplicationFiled: June 7, 2022Publication date: January 26, 2023Inventors: Chin-Yi OUYANG, Chien-Ming CHEN, Wei-Cheng KUO, Xin-Yi WU, Iching TSAI
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Publication number: 20230023844Abstract: A position calibration system and method are disclosed, in which a control unit is provided to control a positioner sensing module to scan a circular positioner provided on a positioning substrate in a first direction and a second direction so as to acquire midpoints of two scanned line segments and acquire an intersection of lines extending from the two center points in a direction perpendicular to the first and the second directions as a calibration reference point, which correspond to a centroid (a center) of the circular positioner. The calibration reference point functions as a reference point for positioning the positioning substrate with respect to the positioner sensing module and is stored in a memory unit. The calibration reference point can be used as a positioning point during installation of a machine and can also be used for calibration of a position of the machine.Type: ApplicationFiled: January 21, 2022Publication date: January 26, 2023Inventors: Chin-Yi Ouyang, Wei-Cheng Kuo, Chien-Ming Chen, Xin-Yi Wu
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Patent number: 11061067Abstract: An apparatus and a method provide a high temperature test and a low temperature test. The apparatus mainly includes a depressing head and a test base, wherein the depressing head includes a cooling module, a heating module, and a heat dissipation module therein, the heat dissipation module includes a finned heat sink and a heat conduction member, and the heat conduction member is thermally coupled to the heating module and the finned heat sink. When the low temperature test is performed, an electronic component is cooled by filling liquid nitrogen into the cooling module of the depressing head. When the high temperature test is performed, the electronic component is heated by the heating module. If the temperature of the electronic device is higher than a predetermined high temperature, the electronic device is cooled by the heat dissipation module.Type: GrantFiled: July 12, 2019Date of Patent: July 13, 2021Assignee: CHROMA ATE INC.Inventor: Xin-Yi Wu
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Publication number: 20200033399Abstract: The present invention relates to an apparatus and a method for a high temperature test and a low temperature test. The apparatus mainly comprises a depressing head and a test base, wherein the depressing head comprises a cooling module, a heating module, and a heat dissipation module therein, the heat dissipation module comprises a finned heat sink and a heat conduction member, and the heat conduction member is thermally coupled to the heating module and the finned heat sink. When the low temperature test is performed, an electronic component is cooled by filling liquid nitrogen into the cooling module of the depressing head. When the high temperature test is performed, the electronic component is heated by the heating module. If the temperature of the electronic device is higher than a predetermined high temperature, the electronic device is cooled by the heat dissipation module.Type: ApplicationFiled: July 12, 2019Publication date: January 30, 2020Inventor: Xin-Yi WU
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Patent number: 10520528Abstract: A dew resistant module for a test socket, and an electronic component testing device having the same are provided. An enclosure body is provided to circumscribe the test socket; and a test socket base plate provided on top of the test socket and enclosure body. A cover is provided to cover the test socket, enclosure body and test socket base plate. With the provision of the enclosure body and the cover, the test socket, test socket base plate and a portion of the thermal head are prevented from coming into contact directly with the atmosphere, whereby condensation or dewing is prevented, thermal insulation achieved and energy consumption minimized.Type: GrantFiled: October 23, 2017Date of Patent: December 31, 2019Assignee: CHROMA ATE INC.Inventors: Xin-Yi Wu, Chien-Hung Lo, Jui-Chih Chou, Hao-Che Yang, Nan-Yi Kuo