Abstract: A test apparatus includes a test site, a buffer carrying device, a transport carrying device, a handling mechanism and a dry air flow guide mechanism. The test site performs a test procedure on the objects. The buffer carrying device is disposed close to a side of the test site, holds the objects and performs a temperature conditioning process. The transport carrying device is disposed close to another side of the test site, moves back and forth along a transporting direction, transports the objects into and out of the test site, and heats up the objects. The handling mechanism carries the objects among the buffer carrying device, the test site and the transport carrying device. The dry air flow guide mechanism guides a dry air to surround the test site, the buffer carrying device, the transport carrying device and the handling mechanism and generates a dry environment to prevent dew condensation.

Abstract: A temperature control module for a socket is provided with of an upper docking plate and a lower docking plate. The upper docking plate has a recess for accommodating a socket and two temperature-controlling fluid passages. One end of the passages communicates with the recess, and the other end thereof is connected to a temperature-controlling fluid source. The lower docking plate is disposed under the upper docking plate and covers the recess. A fluid chamber is formed of the recess of the docking plate, the lower docking plate and the socket. The temperature-controlling fluid source outputs a temperature-controlling fluid to the fluid chamber via the temperature-controlling fluid passages for maintaining the socket at a specific temperature.

Abstract: The disclosure discloses a heating furnace including a housing, a first rack, a chamber, and at least one fan. The first rack is disposed in the housing. The chamber is disposed in the housing and located at a side of the first rack. The chamber includes an inlet, a first sidewall, and a second sidewall. The first sidewall is adjacent to the first rack. The first sidewall has a plurality of vents. The first sidewall and the second sidewall are disposed to face each other. A width is spaced between the first sidewall and the second sidewall, and the width is larger than or equal to 200 mm. The fan is disposed in the housing for generating an airflow to the inlet.

Abstract: A radiator module system for automatic test equipment, wherein the automatic test equipment comprises at least one test arm, with the front end of the test arm being configured with a test head, and a closed-loop circulating cooling device is installed on the test arm. The closed-loop circulating cooling device includes a conduit which is in contact with the cooling device, internally contains an working fluid and is connected to the test head, a cooling device, a set of fans and a driving source for driving the working fluid. The closed-loop circulating cooling device can operate to circulate and exchange heat energy generated by a device under test (DUT) tightly stressed by downward pressure applied with the test arm, and brings up airflows by means of the fans to perform heat exchange on the cooling device thereby dissipating the generated heat energy.

Abstract: A radiator module system for automatic test equipment, including a test arm and a closed-loop circulating cooling device disposed on the test arm. The test arm includes a test head, and an internal channel is formed within and passing through the test head. The closed-loop circulating cooling device includes an inlet and an outlet, respectively connected to the internal channel; a conduit connecting the inlet and the outlet, such that the conduit and the internal channel form a closed-loop circulating channel in which a working fluid flows; a cooling device in contact with the conduit, configured to perform heat dissipation to the working fluid flowing within the conduit; and a driving source configured to drive the working fluid to flow within the closed-loop circulating channel. The working fluid is driven by the driving source to flow within the closed-loop circulating channel to perform heat dissipation.

Abstract: A test apparatus includes a sector conveyance device provided with a plurality of soaking buffers, the soaking buffers being used to carry electronic components, the sector conveyance device being mounted pivotably by a pivot and moved between a test location and a transferring location; a transferring device arranged in correspondence to the transferring location, used to transfer a plurality of electronic components into or out of the sector conveyance device; and a test device arranged in correspondence to the test location for testing electronic components, the electronic components being transferred into the sector conveyance device after test.

Abstract: A wide range of temperature control equipment for controlling a tested object to a predetermined temperature is provided. The wide range of temperature control equipment includes a thermal conducting plate, a temperature regulating module, a carrier plate, and a thermoelectric cooling module. The temperature regulating module is thermally connected to the thermal conducting plate for regulating the thermal conducting plate to a reference temperature. The carrier plate is used to accommodate the tested object. The thermoelectric cooling module is thermally connected between the thermal conducting plate and the carrier plate for controlling the tested object to the predetermined temperature via the carrier plate based on the reference temperature.

Abstract: A temperature control module for a socket is provided with of an upper docking plate and a lower docking plate. The upper docking plate has a recess for accommodating a socket and two temperature-controlling fluid passages. One end of the passages communicates with the recess, and the other end thereof is connected to a temperature-controlling fluid source. The lower docking plate is disposed under the upper docking plate and covers the recess. A fluid chamber is formed of the recess of the docking plate, the lower docking plate and the socket. The temperature-controlling fluid source outputs a temperature-controlling fluid to the fluid chamber via the temperature-controlling fluid passages for maintaining the socket at a specific temperature.

Abstract: A test apparatus includes a test site, a buffer carrying device, a transport carrying device, a handling mechanism and a dry air flow guide mechanism. The test site performs a test procedure on the objects. The buffer carrying device is disposed close to a side of the test site, holds the objects and performs a temperature conditioning process. The transport carrying device is disposed close to another side of the test site, moves back and forth along a transporting direction, transports the objects into and out of the test site, and heats up the objects. The handling mechanism carries the objects among the buffer carrying device, the test site and the transport carrying device. The dry air flow guide mechanism guides a dry air to surround the test site, the buffer carrying device, the transport carrying device and the handling mechanism and generates a dry environment to prevent dew condensation.

Abstract: A test table including a chuck base, a flow guide mechanism and a dry air generator is provided. The chuck base includes a test area. The flow guide mechanism is disposed around the chuck base. The dry air generator connects to the flow guide mechanism for generating a dry air. The flow guide mechanism guides the dry air to flow toward the test area to cover the test area and the object to be tested and to create a dry environment to prevent dew condensation.

Abstract: A radiator module system for automatic test equipment, wherein the automatic test equipment comprises at least one test arm, with the front end of the test arm being configured with a test head, and a closed-loop circulating cooling device is installed on the test arm. The closed-loop circulating cooling device includes a conduit which is in contact with the cooling device, internally contains an working fluid and is connected to the test head, a cooling device, a set of fans and a driving source for driving the working fluid. The closed-loop circulating cooling device can operate to circulate and exchange heat energy generated by a device under test (DUT) tightly stressed by downward pressure applied with the test arm, and brings up airflows by means of the fans to perform heat exchange on the cooling device thereby dissipating the generated heat energy.

Abstract: A temperature control system for IC tester, comprising: a test socket; a compressing device including a heat exchanger and a thermoelectric cooler (TEC); and a test head having a temperature sensor. The test head is configured at the front end of the compressing device such that, upon placing at least one device under test (DUT) onto the test socket, the test head coerces tightly one of the DUTs through downward pressure from the compressing device thereby allowing the temperature sensor to detect the surface temperature of the DUT to obtain a temperature signal, and then feed such a temperature signal back to a control processing unit for operations to generate a linear control signal thus that, through the control of the linear control signal, the heat absorption and heat discharge functions of the TEC are enabled to further control the temperature of the DUT within a determined range.

Abstract: An electric motor includes a stator fixed in a motor housing, disposed around a motor shaft rotatable relative to the motor housing and formed with a radially extending through hole that is in spatial communication with an air-flow space defined between the stator and a tube body of the motor housing. The tube body is formed with an annular fluid-flow channel for receiving cooling fluid therein. A rotor is sleeved fixedly on the motor shaft. The motor shaft co-rotates with the rotor. The rotor is formed with angularly spaced apart slots extending inwardly and radially from an outer annular surface thereof, and air holes extending from an end surface thereof in an axial direction. Each air hole in the rotor is in spatial communication with corresponding slots. When the rotor rotates, the through hole in the stator is successively in spatial communication with the slots in the rotor.

Abstract: The unitized cooling module for a laser diode array of the invention has at least one cooling unit. The cooling unit has an inlet main channel, an outlet main channel, an inlet subchannel, an outlet subchannel and a chamber. The inlet subchannel connects the inlet main channel and the chamber, and the outlet subchannel connects the outlet main channel and the chamber. A heatsink element carrying a laser diode seals the chamber. With a cooling source flowing through the interior of the cooling unit, the heat produced by the laser diode is removed. Thus, the unitized cooling module of the invention is easily assembled, repaired and expanded, and has the effect of pressing fit. Furthermore, the unitized cooling module of the invention can be arranged and designed according to the heat produced by the laser diode to remove the heat from the laser diode, so that the performance of the unitized cooling module is ensured.

Abstract: An ultra-thin miniature pump applied to transport a fluid includes a main body, a rotor, and a stator. The main body includes a cover part and a bottom part. A joint surface between the cover part and the bottom part possesses an anti-leakage device, and a chamber including a suction port and a discharge port is formed inside the main body. The rotor disposed in the chamber includes a magnet set, an impeller, and a central shaft. The magnet set is connected on the surface of the impeller, and the impeller with the magnet set is aligned by the central shaft and rotates in coaxial. The stator disposed in the chamber includes a plurality of coils corresponding to the magnet set axially. The coils and the magnet set generate an axial magnetic flux to make the impeller rotate for transporting the fluid from the suction port to the discharge port.