Publication number: 20250112163
Abstract: An IC die package includes a substrate comprising glass and a plurality of holes extending through the glass. A via metallization is present within the holes. A liner is between the via metallization and the glass. The liner can comprise a beta-titanium alloy layer, polymer hydrogel layer and an MXene seed layer, an organic material layer and a metal layer, or an organic material layer between first and second metal layers. A polymer layer may be formed by electrodeposition of charged nanoparticles.
Type:
Application
Filed:
September 29, 2023
Publication date:
April 3, 2025
Applicant:
Intel Corporation
Inventors:
Pratyush Mishra, Pratyasha Mohapatra, Srinivas Pietambaram, Whitney Bryks, Mahdi Mohammadighaleni, Joshua Stacey, Travis Palmer, Yosef Kornbluth, Kuang Liu, Astitva Tripathi, Yuqin Li, Rengarajan Shanmugam, Xing Sun, Brian Balch, Darko Grujicic, Jieying Kong, Nicholas Haehn, Jacob Vehonsky, Mitchell Page, Vincent Obiozo Eze, Daniel Wandera, Sameer Paital, Gang Duan