Abstract: Systems and methods for reducing electrical noise generated during bus turnaround in signal transfer systems are provided. These systems include differential drivers having current sources continuously coupled to a signal bus during all operating modes of the drivers. A first transistor of the driver couples a first signal line of the bus to the driver current source and a second transistor of the driver couples a second(signal line of the bus to the driver current source. Each transistor receives control signals in accordance with the operating mode of the driver. These control signals continuously and selectively couple the current source to the bus lines in a manner which provides uniform current distribution across the bus during all driver operating modes. The uniform current distribution across the bus minimizes interruptions in driver current dissipation and any effects from self-induced supply noise during signal transfers.

Abstract: A technique for determining performance characteristics of electronic devices and systems is disclosed. In one embodiment, the technique is realized by measuring a first response on a first transmission line from a single pulse transmitted on the first transmission line, and then measuring a second response on the first transmission line from a single pulse transmitted on at least one second transmission line, wherein the at least one second transmission line is substantially adjacent to the first transmission line. The worst case bit sequences for transmission on the first transmission line and the at least one second transmission line are then determined based upon the first response, and the second response for determining performance characteristics associated with the first transmission line.

Abstract: A multilayer substrate includes a plurality layers. Located within the plurality of layers are a number of vias. Conductive traces connect the vias to form trace/via paths having various topologies, geometries, and/or properties.

Abstract: The semiconductor module is provided that includes a semiconductor housing and a plurality of integrated circuit dice positioned within the housing. The semiconductor module also includes a programmable memory device positioned within the housing and electrically coupled to the plurality of integrated circuit dice. The programmable memory device is programmable to identify the integrated circuit dice that meet a predetermined standard, such as an operating frequency requirement, or a core timing grade. Further, a method is provided for accessing a semiconductor module. The above mentioned housing is provided to enclose the plurality of integrated circuit dice and the programmable memory device. The integrated circuit dice of the plurality of integrated circuit dice that meet a predetermined standard are then identified. The programmable memory device is subsequently programmed to identify the selected integrated circuit dice.

Abstract: The semiconductor module is provided that includes a semiconductor housing and a plurality of integrated circuit dies positioned within the housing. The semiconductor module also includes a programmable memory device positioned within the housing and electrically coupled to the plurality of integrated circuit dies. The programmable memory device is programmable to identify the integrated circuit dies that meet a predetermined standard, such as an operating frequency requirement, or a core timing grade. Further, a method is provided for accessing a semiconductor module. The above mentioned housing is provided to enclose the plurality of integrated circuit dies and the programmable memory device. The integrated circuit dies of the plurality of integrated circuit dies that meet a predetermined standard are then identified. The programmable memory device is subsequently programmed to identify the selected integrated circuit dies.