Patents by Inventor Xinge ZHAO

Xinge ZHAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180341320
    Abstract: In an approach for controlling voltage, a computer obtains a magnitude of a current of a processing unit. The computer determines an optimized magnitude of a voltage based on the obtained magnitude of the current. The computer generates an updating instruction based on the determined optimized magnitude of the voltage. The computer supplies the generated updating instruction to the processing unit.
    Type: Application
    Filed: December 20, 2017
    Publication date: November 29, 2018
    Inventors: Mengze Liao, Yang Liu, Geng Tian, Xing Zhao
  • Publication number: 20180341319
    Abstract: In an approach for controlling voltage, a computer obtains a magnitude of a current of a processing unit. The computer determines an optimized magnitude of a voltage based on the obtained magnitude of the current. The computer generates an updating instruction based on the determined optimized magnitude of the voltage. The computer supplies the generated updating instruction to the processing unit.
    Type: Application
    Filed: November 21, 2017
    Publication date: November 29, 2018
    Inventors: Mengze Liao, Yang Liu, Geng Tian, Xing Zhao
  • Patent number: 10115701
    Abstract: A semiconductor device has a semiconductor wafer and a conductive via formed through the semiconductor wafer. A portion of the semiconductor wafer is removed such that a portion of the conductive via extends above the semiconductor wafer. A first insulating layer is formed over the conductive via and semiconductor wafer. A second insulating layer is formed over the first insulating layer. The first insulating layer includes an inorganic material and the second insulating layer includes an organic material. A portion of the first and second insulating layers is removed simultaneously from over the conductive via by chemical mechanical polishing (CMP). Alternatively, a first insulating layer including an organic material is formed over the conductive via and semiconductor wafer. A portion of the first insulating layer is removed by CMP. A conductive layer is formed over the conductive via and first insulating layer. The conductive layer is substantially planar.
    Type: Grant
    Filed: June 26, 2014
    Date of Patent: October 30, 2018
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: Xing Zhao, Duk Ju Na, Siew Joo Tan, Pandi C. Marimuthu
  • Publication number: 20180276291
    Abstract: Systems and methods for constructing a scoring model and evaluating user credit. An example method for constructing a scoring model may comprise: collecting a plurality of sample datasets, each sample dataset comprising at least one characteristic variable and a corresponding characteristic value; for each characteristic variable, acquiring an interaction index of the characteristic variable with each of one or more other characteristic variables, and determining a clustering index of the characteristic variable according to the interaction indices; selecting a target characteristic variable from the at least one characteristic variable according to the clustering indices of the characteristic variables; dividing the plurality of sample datasets into a plurality of sample dataset subgroups according to the target characteristic variable and the corresponding characteristic value; and constructing a corresponding sub-scoring model for each of the sample dataset subgroups.
    Type: Application
    Filed: March 22, 2018
    Publication date: September 27, 2018
    Inventor: XING ZHAO
  • Publication number: 20180232175
    Abstract: This application discloses a virtual machine (VM) hot migration method, an apparatus, and a storage medium. A method for virtual machine (VM) hot migration is described. Processing circuitry of a first host machine identifies that a memory block in a storage device of the first host machine is allocated to a virtual machine to migrate. Further, the processing circuitry determines whether the memory block is data-containing. When the memory block is data-containing, interface circuitry of the first host machine sends data in the memory block to a second host machine. When the memory block is not data-containing, the memory block is skipped for migration.
    Type: Application
    Filed: April 10, 2018
    Publication date: August 16, 2018
    Applicant: TECENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Lidong CHEN, Xing Zhao
  • Patent number: 10003925
    Abstract: Systems, methods, and other embodiments are described. In one embodiment, a system is provided that includes a first processor configured to, in response to a first request for a location of a device, determine a first location of the device, and provide the first location as the location of the device. The system includes a second processor with position update logic configured to, in response to a second request for a location of the device, determine whether the device has moved from the first location. When the device has not moved from the first location the second processor is configured to provide the first location. When the device has moved from the first location, the second processor is configured to determine a second location of the device using less power than the first processor in determining the first location and provide the second location as the location of the device.
    Type: Grant
    Filed: April 30, 2015
    Date of Patent: June 19, 2018
    Assignee: MARVELL INTERNATIONAL LTD.
    Inventors: Xing Zhao, Thandapani Venkataramani, Xin Zhang, Zhike Jia
  • Publication number: 20170365517
    Abstract: A semiconductor device has a semiconductor wafer and a conductive via formed partially through the semiconductor wafer. A portion of the semiconductor wafer and conductive via is removed by a chemical mechanical polishing process. The semiconductor wafer and conductive via are coplanar at first and second surfaces. A first insulating layer and a second insulating layer are formed over the conductive via and semiconductor wafer. The first insulating layer includes an inorganic material and the second insulating layer includes an organic material. An opening in the first and second insulating layers is formed over the conductive via while a second portion of the conductive via remains covered by the first and second insulating layers. A conductive layer is formed over the conductive via and first insulating layer. An interconnect structure is formed over the conductive layer. The semiconductor wafer is singulated into individual semiconductor die.
    Type: Application
    Filed: August 11, 2017
    Publication date: December 21, 2017
    Applicant: STATS ChipPAC Pte. Ltd.
    Inventors: Xing Zhao, Duk Ju Na, Lai Yee Chia
  • Publication number: 20170293137
    Abstract: An optical switch, including an input collimator array, an input micro-electro-mechanical system (MEMS) chip, an output MEMS chip, and an output collimator array. An included angle (?) exists between a surface of a micromirror array on the output MEMS chip and a surface of a lens array of the output collimator array, micromirrors of the micromirror array on the output MEMS chip are arranged at an equal spacing (L) both in a direction parallel to a first direction and in a direction perpendicular to the first direction, where the first direction is a direction of an intersection line of planes to which the surface of the lens array of the output collimator array and the surface of the micromirror array on the output MEMS chip belong, and lenses of the lens array of the output collimator array are arranged with the same arrangement of micromirrors of the output MEMS chip.
    Type: Application
    Filed: June 22, 2017
    Publication date: October 12, 2017
    Inventors: Xing Zhao, Chendi Jiang
  • Patent number: 9781572
    Abstract: Systems and methods are provided for positioning determination for mobile devices. A system includes: a database configured to store positioning data associated with one or more base stations in a network, and a data management component configured to compare the parameters with one or more parameter thresholds, and update the positioning data based at least in part on the comparison of the parameters and the parameter thresholds. The updated positioning data is used for positioning determination of a mobile device.
    Type: Grant
    Filed: January 6, 2016
    Date of Patent: October 3, 2017
    Assignee: MARVELL WORLD TRADE LTD.
    Inventors: BoChih Liu, Zhike Jia, Yuan Ren, Jing Yu, Jian Chen, Xing Zhao
  • Patent number: 9768066
    Abstract: A semiconductor device has a semiconductor wafer and a conductive via formed partially through the semiconductor wafer. A portion of the semiconductor wafer and conductive via is removed by a chemical mechanical polishing process. The semiconductor wafer and conductive via are coplanar at first and second surfaces. A first insulating layer and a second insulating layer are formed over the conductive via and semiconductor wafer. The first insulating layer includes an inorganic material and the second insulating layer includes an organic material. An opening in the first and second insulating layers is formed over the conductive via while a second portion of the conductive via remains covered by the first and second insulating layers. A conductive layer is formed over the conductive via and first insulating layer. An interconnect structure is formed over the conductive layer. The semiconductor wafer is singulated into individual semiconductor die.
    Type: Grant
    Filed: June 26, 2014
    Date of Patent: September 19, 2017
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: Xing Zhao, Duk Ju Na, Lai Yee Chia
  • Patent number: 9728415
    Abstract: A semiconductor device has a substrate including a plurality of conductive vias formed vertically and partially through the substrate. An encapsulant is deposited over a first surface of the substrate and around a peripheral region of the substrate. A portion of the encapsulant around the peripheral region is removed by a cutting or laser operation to form a notch extending laterally through the encapsulant to a second surface of the substrate opposite the first surface of the substrate. A first portion of the substrate outside the notch is removed by chemical mechanical polishing to expose the conductive vias. A second portion of the substrate is removed by backgrinding prior to or after forming the notch. The encapsulant is coplanar with the substrate after revealing the conductive vias. The absence of an encapsulant/base material interface and coplanarity of the molded substrate results in less over-etching or under-etching and fewer defects.
    Type: Grant
    Filed: December 19, 2013
    Date of Patent: August 8, 2017
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: Vinoth Kanna Chockanathan, Xing Zhao, Duk Ju Na, Chang Bum Yong
  • Publication number: 20170177996
    Abstract: As part of neural network sensitivity analyses, base outputs of hidden layer nodes of a neural network model for non-perturbed variables can be reused when perturbing the variables. Such an arrangement greatly reduces complexity of the calculations required to generate outputs of the model. Related apparatus, systems, techniques and articles are also described.
    Type: Application
    Filed: October 31, 2016
    Publication date: June 22, 2017
    Inventors: Xing Zhao, Peter Hamilton, Andrew K. Story
  • Patent number: 9642110
    Abstract: The present disclosure provides a method for determining a real-time position of a mobile device using a global positioning system (GPS) and wireless local area network (WLAN) hybrid positioning mode. The method includes determining, by a mobile device, the mobile device's environment area based on GPS satellite signals; determining an absolute position of the mobile device based on the GPS satellite signals while the mobile device is moving from an outdoor area to an indoor area; estimating a reference position of the mobile device based on the determined absolute position and WLAN access point signals while moving to a shadow area; and while moving to an indoor area, determining an estimated position of the mobile device based on calculated regressive coefficients and the WLAN access point signals, and updating the estimated position of the mobile device based on motion information and indoor floor map information.
    Type: Grant
    Filed: April 15, 2014
    Date of Patent: May 2, 2017
    Assignee: Marvell World Trade Ltd.
    Inventors: BoChih Liu, Zhike Jia, Fagen Zhou, Jian Chen, Jing Yu, Xing Zhao
  • Patent number: 9641973
    Abstract: The present disclosure describes systems and techniques relating to determining a real-time position of a mobile device. According to an aspect of the described systems and techniques, a data processing apparatus includes: one or more integrated circuit (IC) devices including a location processor configured to acquire and track measurements of location for a mobile wireless communication device; and a host processor programmed with a host software manager configured to obtain various positioning input signals from different device positioning technologies and assemble a selected set of the various positioning input signals into a unified format; wherein the data processing apparatus includes a hybrid fusion engine configured to receive data from the host software manager in the unified format and calculate a position of the mobile wireless communication device using the received data in accordance with input type information for the received data.
    Type: Grant
    Filed: December 9, 2014
    Date of Patent: May 2, 2017
    Assignee: Marvell World Trade Ltd.
    Inventors: Thandapani Venkataramani, Xing Zhao, Xin Zhang, Zhike Jia
  • Publication number: 20170045339
    Abstract: A laser electronic target system is disclosed herein, comprising a bullet trap and a first and second rectangular laser screens generated in front of the bullet trap, wherein each of the first and second rectangular laser screens is generated by a detachable laser transmitter and a laser receiver comprising a first sensor strip and a second sensor strip, wherein a first end of the first sensor strip is perpendicularly connected to a second end of the second sensor strip, wherein each sensor strip comprises 100 to 150 laser sensors, and wherein the laser transmitter and the first and second sensor strips are on a same plane. The disclosed system uses a method to determine positions of target-hit points using a laser array and angles, which can increase efficiency, reduce cost, and avoid interferences from other electromagnetic or ultrasonic sources, thus being suitable for shooting training and matches.
    Type: Application
    Filed: August 8, 2016
    Publication date: February 16, 2017
    Inventors: Xing Zhao, Yan Yan
  • Patent number: 9521645
    Abstract: Systems, methods, and other embodiments associated with determining a position of a device are described. According to one embodiment, a method for determining a position of a device is disclosed. The method includes detecting access points and classifying one or more of the access points as being either fixed or mobile. An access point classified as being mobile indicates that the access point is mobile. An access point classified as being fixed indicates that the access point is located at a fixed position. The method also includes determining a position of the device based, at least in part, on one or more channel powers of signals respectively received from one or more access points classified as being fixed. In this manner, the position of the device is not determined based on channel powers of signals received from access points classified as being mobile.
    Type: Grant
    Filed: May 30, 2014
    Date of Patent: December 13, 2016
    Assignee: MARVELL INTERNATIONAL LTD.
    Inventors: Xing Zhao, Thandapani Venkataramani, Jing Yu, Zhike Jia
  • Publication number: 20160353241
    Abstract: The present disclosure describes systems and techniques relating to determining a real-time position of a mobile device. According to an aspect of the described systems and techniques, a data processing apparatus includes: one or more integrated circuit (IC) devices including a location processor configured to acquire and track measurements of location for a mobile wireless communication device; and a host processor programmed with a host software manager configured to obtain various positioning input signals from different device positioning technologies and assemble a selected set of the various positioning input signals into a unified format; wherein the data processing apparatus includes a hybrid fusion engine configured to receive data from the host software manager in the unified format and calculate a position of the mobile wireless communication device using the received data in accordance with input type information for the received data.
    Type: Application
    Filed: December 9, 2014
    Publication date: December 1, 2016
    Inventors: Thandapani Venkataramani, Xing Zhao, Xin Zhang, Zhike Jia
  • Patent number: 9483727
    Abstract: As part of neural network sensitivity analysis, base outputs of hidden layer nodes of a neural network model for non-perturbed variables can be reused when perturbing the variables. Such an arrangement greatly reduces complexity of the calculations required to generate outputs of the model. Related apparatus, systems, techniques and articles are also described.
    Type: Grant
    Filed: September 18, 2013
    Date of Patent: November 1, 2016
    Assignee: FAIR ISAAC CORPORATION
    Inventors: Xing Zhao, Peter Hamilton, Andrew K. Story
  • Patent number: 9367520
    Abstract: Data is received that characterizes a transaction and includes a plurality of values corresponding to variables. Thereafter, a score is determined for the transaction based on the received data and using a scoring model. The scoring model only uses variables pairs having a divergence residual above a pre-defined threshold. Thereafter, data is provided that characterizes the determined score. Related apparatus, systems, techniques and computer program products are also described.
    Type: Grant
    Filed: December 20, 2012
    Date of Patent: June 14, 2016
    Assignee: FAIR ISAAC CORPORATION
    Inventors: Xing Zhao, Peter Hamilton, Andrew K. Story, Andrew Flint
  • Patent number: 9323314
    Abstract: A mobile communications device and a method for reducing energy usage in a mobile communications device are provided. An example mobile communications device includes an application processor. The application processor includes a first central processing unit (CPU), where the first CPU consumes a relatively high amount of power when operating in an active mode. The mobile communications device includes a microcontroller coupled to the application processor. The microcontroller includes a sensor subsystem configured to process, using a second CPU, first data received from one or more sensors. The second CPU consumes a relatively low amount of power when operating in an active mode. The microcontroller includes a location subsystem configured to receive satellite signals and process, using the second CPU, second data that is based on the received satellite signals. The first CPU operates in a sleep mode during the processing of the first and second data.
    Type: Grant
    Filed: May 5, 2015
    Date of Patent: April 26, 2016
    Assignee: MARVELL INTERNATIONAL LTD.
    Inventors: Zhike Jia, Xing Zhao, Thandapani Venkataramani, Mobo Qiu, Xin Zhang, Liujun Shao