Abstract: An electronic device may include a conductive housing and an antenna. The antenna may include an arm formed from a first segment of the housing. A gap may separate the first segment from a second segment. Respective first and second slots may separate an antenna ground from the first and second segments. The antenna may have a first positive antenna feed terminal on the first segment and a second positive antenna feed terminal on the second segment. A transmission line may include a signal conductor having a first branch coupled to the first positive antenna feed terminal and a second branch coupled to the second positive antenna feed terminal. A switch may be interposed on the second branch for switching the antenna between a first mode in which the second slot is directly fed and a second mode in which the second segment is indirectly fed by the first segment.

Abstract: A system has a chip mounting board and a docking board. The chip mounting board can be loaded with test samples in a low voltage environment and can then be transported to a high voltage environment. The chip mounting board can be connected to the docking board and allows high voltage testing of multiple samples in parallel. The chip mounting board can then be disconnected from the docking board and transported back to a low voltage environment to unload the tested samples.

Abstract: An electronic device may include a peripheral conductive wall. A gap in the wall may divide the wall into first and second segments. The device may include a first antenna having a first resonating element arm formed from the first segment and a second antenna having a second resonating element arm formed from the second segment. A non-near-field communications transceiver may perform multiple-input and multiple-output (MIMO) operations using the first and second antennas. The gap may provide satisfactory isolation between the first and second antennas while the first and second antennas perform MIMO operations. Near-field communications circuitry may convey near-field communications signals over a conductive loop path that includes portions of the first and second segments and the antenna ground. The volume of the conductive loop path may extend across substantially all of a width of the electronic device.

Abstract: An electronic device may be provided with wireless circuitry. The wireless circuitry may include one or more antennas. The antennas may include cellular telephone antennas, wireless local area network antennas, antenna structures for receiving satellite navigation system signals, and other antennas. An antenna may have an antenna resonating element such as an inverted-F antenna resonating element. The inverted-F antenna resonating element may have an inverted-F antenna resonating element arm formed from metal traces on a flexible printed circuit. The flexible printed circuit may be soldered to an antenna grounding clip. A screw may attach the clip, a speaker tab, a connector bracket, and other metal structures to a metal device housing that serves as ground for the antenna. The screw may be isolated from the antenna grounding clip and the other metal structures by an insulating structure such as an insulating gasket.

Abstract: An electronic device may be provided with wireless circuitry. The wireless circuitry may include multiple antennas and transceiver circuitry. The antennas may include antenna structures at opposing first and second ends of the electronic device. The antenna structures at a given end of the device may include antenna structures that are shared between multiple antennas. The electronic device may include a first antenna with an inverted-F antenna resonating element formed from portions of a peripheral conductive housing structure and may have an antenna ground that is separated from the antenna resonating element by a gap. A return path may bridge the gap. The electronic device may also include a second antenna that includes the antenna ground and an additional antenna resonating element. The antenna resonating element of the second antenna may be parasitically coupled to the return path of the inverted-F antenna at given frequencies.

Abstract: Provided are an air conditioner outdoor unit and an outdoor unit division plate (1) of the air conditioner outdoor unit. The outdoor unit division plate (1) of the air conditioner outdoor unit has a first side edge connected with a side folded edge of a C-type condenser (2) near a compressor, and a second side edge aligning with an edge of a base (4) of the air conditioner outdoor unit.

Abstract: An electronic device may include a peripheral conductive wall. A gap in the wall may divide the wall into first and second segments. The device may include a first antenna having a first resonating element arm formed from the first segment and a second antenna having a second resonating element arm formed from the second segment. A non-near-field communications transceiver may perform multiple-input and multiple-output (MIMO) operations using the first and second antennas. The gap may provide satisfactory isolation between the first and second antennas while the first and second antennas perform MIMO operations. Near-field communications circuitry may convey near-field communications signals over a conductive loop path that includes portions of the first and second segments and the antenna ground. The volume of the conductive loop path may extend across substantially all of a width of the electronic device.

Abstract: A contactor having the top ends of its pogo pins contacting the leads of a semiconductor device package positioned in a handler at controlled temperature, and the bottom ends of the pogo pins contacting the pads of electrically conducting vias extending vertically through a heatable interposer. The heatable interposer has a first and a second surface and includes alternating horizontal layers of thermally conductive material and thermally insulating material, and further one or more heating layers operable to control a temperature profile from the first to the second surface, including a temperature control at the first surface. The via pads at the second interposer surface are in contact with the printed circuit board of a tester.

Abstract: An electronic device may be provided with wireless circuitry and control circuitry. The wireless circuitry may include multiple antennas and transceiver circuitry. An antenna in the electronic device may have an inverted-F antenna resonating element formed from portions of a peripheral conductive electronic device housing structure and may have an antenna ground that is separated from the antenna resonating element by a gap. The antenna may also include an indirectly-fed antenna resonating element that is indirectly fed by a harmonic mode of the inverted-F antenna resonating element via near field electromagnetic coupling. The indirectly-fed antenna resonating element may be a slot. The antenna ground may define at least three edges of the slot and the slot may be aligned with a dielectric-filled gap in the peripheral conductive housing structures. An adjustable circuit may be coupled across the slot to tune the indirectly-fed antenna resonating element.

Abstract: Provided are a panel driving assembly and an air conditioner having the same. The panel driving assembly is used for driving a panel part (10), and the panel driving assembly includes: a first connecting piece (20), is provided with a first rack (21), a first end of the first connecting piece (20) is movably connected with the panel part (10); and a driving part (30), a first end of the driving part (30) is movably connected with the panel part (10), a second end of the driving part (30) is engaged with the first rack (21), and the driving part (30) driving the panel part (10) to be opened or closed. The panel driving assembly effectively solves a problem of high heat exchange efficiency loss of an air conditioner in the prior art.

Abstract: A contactor having the top ends of its pogo pins contacting the leads of a semiconductor device package positioned in a handler at controlled temperature, and the bottom ends of the pogo pins contacting the pads of electrically conducting vias extending vertically through a heatable interposer. The heatable interposer has a first and a second surface and includes alternating horizontal layers of thermally conductive material and thermally insulating material, and further one or more heating layers operable to control a temperature profile from the first to the second surface, including a temperature control at the first surface. The via pads at the second interposer surface are in contact with the printed circuit board of a tester.

Abstract: An electronic device may be provided with wireless circuitry. The wireless circuitry may include one or more antennas. The antennas may include cellular telephone antennas, wireless local area network antennas, antenna structures for receiving satellite navigation system signals, and other antennas. An antenna may have an antenna resonating element such as an inverted-F antenna resonating element. The inverted-F antenna resonating element may have an inverted-F antenna resonating element arm formed from metal traces on a flexible printed circuit. The flexible printed circuit may be soldered to an antenna grounding clip. A screw may attach the clip, a speaker tab, a connector bracket, and other metal structures to a metal device housing that serves as ground for the antenna. The screw may be isolated from the antenna grounding clip and the other metal structures by an insulating structure such as an insulating gasket.

Abstract: A system has a chip mounting board and a docking board. The chip mounting board can be loaded with test samples in a low voltage environment and can then be transported to a high voltage environment. The chip mounting board can be connected to the docking board and allows high voltage testing of multiple samples in parallel. The chip mounting board can then be disconnected from the docking board and transported back to a low voltage environment to unload the tested samples.

Abstract: The invention discloses an air outlet protection structure, an outdoor unit of an air conditioner and a method for designing an air outlet protection structure. The air outlet protection structure comprises: a central circular disk (10); and a radiating rib (20), extending from an outer edge of the central circular disk (10) to a direction away from the central circular disk (10). An included angle between a first side surface (21) of the radiating rib (20) and a central axis of the central circular disk (10) is a, as formula (I). The invention is determined according to the characteristics of a flow field of an air duct, and can reduce the hindering effect of an air outlet protection apparatus on a fluid as far as possible, thereby improving the air output volume of a fan and reducing the noise of the entire outdoor unit of the air conditioner.

Abstract: A method of preparing a polyester/polyolefin hot-melt adhesive for use in a solar cell bus bar is disclosed, in which 2,6-naphthalenedicarboxylic acid and ethylene glycol are first sequentially subjected in a predetermined ratio to esterification and polycondensation in the presence of a certain amount of a titanium-based catalyst to result in a polyethylene naphthalate (PNT) with a weight-average molecular weight of 16,000˜20,000. The PNT is then melt-blended with a low-density polyethylene (LDPE) in the presence of a compatibilizer to produce the hot-melt adhesive that can be shaped into films having a high light transmittance, good mechanical properties, high heat and yellowing resistance and thus particularly suitable for use in solar cell bus bars.

Abstract: A method of preparing a polyester/polyolefin hot-melt adhesive for use in a solar cell bus bar is disclosed, in which 2,6-naphthalenedicarboxylic acid and ethylene glycol are first sequentially subjected in a predetermined ratio to esterification and polycondensation in the presence of a certain amount of a titanium-based catalyst to result in a polyethylene naphthalate (PNT) with a weight-average molecular weight of 16,000˜20,000. The PNT is then melt-blended with a low-density polyethylene (LDPE) in the presence of a compatibilizer to produce the hot-melt adhesive that can be shaped into films having a high light transmittance, good mechanical properties, high heat and yellowing resistance and thus particularly suitable for use in solar cell bus bars.

Abstract: A high-impedance line includes a plurality of windings successively arranged. Each of the windings includes an upper portion and a lower portion parallel to the upper portion. The upper portions of each of the windings are electrically connected to the lower portions of adjacent windings. A resistance unit electrically connected between every two adjacent windings.

Abstract: A probe includes a circuit board, an electric field detecting probe, and a magnetic field detecting probe. The electric field detecting probe and the magnetic field detecting probe are located on the circuit board. An anti-jamming distance between the two detecting probes is a multiple of 5 millimeters and is greater than or equal to 10 millimeters.

Abstract: The present invention discloses a docbase management system, including a first module, adapted to parse a received invocation from an application and generate an execution plan which comprises operations on physical storage; a second module, adapted to execute the execution plan to schedule a third module to execute the operations on physical storage in the execution plan; and the third module, adapted to execute the operations on physical storage in the execution plan under the scheduling of the second module. Since the implementation of the docbase management system is divided into hierarchies, and the hierarchies are independent of each other, the docbase management system is well extendable, scalable and maintainable.

Abstract: A method for measuring hearing aid compatibility (HAC) includes providing a probe and scanning testing points of a testing region obtained by the probe. The probe includes a circuit board, an electric field detecting probe, and a magnetic field detecting probe. The electric field detecting probe and the magnetic field detecting probe are located on the circuit board.