Abstract: Quad Flat No-Lead packaged devices are manufactured using two singulation operations with two different saw blades of varying widths with the first singulation operation using a wider saw blade than the second singulation operation. Between singulation operations, the exposed portions of the leads are plated with a solderable metal. By performing the second singulation operation within the first cut made by the first singulation, at least half of the exposed metal of the leads remains plated. Thus, better solder joints may be formed, which allows for simpler visual inspection.

Abstract: A high-impedance line includes a plurality of windings successively arranged. Each of the windings includes an upper portion and a lower portion parallel to the upper portion. The upper portions of each of the windings are electrically connected to the lower portions of adjacent windings. A resistance unit electrically connected between every two adjacent windings.

Abstract: A method for measuring hearing aid compatibility (HAC) includes providing a probe and scanning testing points of a testing region obtained by the probe. The probe includes a circuit board, an electric field detecting probe, and a magnetic field detecting probe. The electric field detecting probe and the magnetic field detecting probe are located on the circuit board.

Abstract: A probe includes a circuit board, an electric field detecting probe, and a magnetic field detecting probe. The electric field detecting probe and the magnetic field detecting probe are located on the circuit board. An anti-jamming distance between the two detecting probes is a multiple of 5 millimeters and is greater than or equal to 10 millimeters.

Abstract: A lead frame and a method of making a lead frame for a semiconductor package. The lead frame is formed by stamping a lead frame material into a desire configuration. The stamped lead frame is then affixed to a support material. When assembling a semiconductor package using the lead frame, during saw singuation, the saw does not have to cut through much lead frame material. Thus, the saw blade does not wear quickly.

Abstract: A water adhesive, being a hybrid solution containing gelatin, a water-soluble polymer and water, or comprising gelatin, a water-soluble polymer and water, is disclosed. The preparation method of the water adhesive and application of the water adhesive in manufacture of a positive plate of a lithium ion battery are also disclosed. The present invention has the following beneficial technical effects: The water adhesive with the above formulation can achieve a good coating effect; each ingredient is easily available, with a lower cost; the water adhesive can be prepared through simple steps, making the manufacture easy to implement, with broad prospects for industrial application.