Patents by Inventor Xue Wen
Xue Wen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20100211835Abstract: A method for testing a random-access memory (RAM) includes six tests. The first test is performed by performing a write and read test to storage locations of the RAM. The second test is performed by testing walking 1's across each data bus of the RAM. The third test is performed by testing walking 0's across the data bus of the RAM. The fourth test is performed by testing walking 1's across each address bus of the RAM. The fifth test is performed by testing walking 0's across the address bus bit of the RAM. The sixth test is performed by performing a write and read test to random blocks in the storage locations of the RAM.Type: ApplicationFiled: July 17, 2009Publication date: August 19, 2010Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.Inventors: MO-YING TONG, XUE-WEN HONG, CHIANG-CHUNG TANG
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Patent number: 7755902Abstract: A heat dissipation device to be mounted on a heat-generating component of a graphics card includes a base in contact with the heat-generating component, a heat dissipating member placed on the base, a fan mounted on the base adjacent to an end of the base, and a covering body. The fan is located closely to the heat dissipating member and generates airflow to the heat dissipating member. The dissipating member has a cellular structure integrally formed therein. The covering body includes a top wall in contact with a top of the dissipating member and a sidewall extending downwardly from an edge of the top wall and surrounding the dissipating member and the fan. The cellular structure comprises a plurality of elongated passages extending from the fan to another end of the base away from the fan.Type: GrantFiled: August 28, 2008Date of Patent: July 13, 2010Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Xue-Wen Peng, Rui-Hua Chen
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Publication number: 20100165566Abstract: A heat dissipation device for dissipating heat generated from an add-on card. The heat dissipating device includes two heat sinks and two heat pipes connecting with the two heat sinks. Each of the heat sinks includes a base and a fin group mounted on a top surface of the base. Each of the heat pipes includes a connecting section and two heat-conductive sections extending from opposite ends of the connecting section. One of the two heat-conductive sections of each of the heat pipes is sandwiched between the base and the fin group of one heat sink, and another of the two heat-conductive sections is sandwiched between the base and the fin group of another heat sink.Type: ApplicationFiled: April 15, 2009Publication date: July 1, 2010Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.Inventors: Jun-Hai Li, Xue-Wen Peng
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Publication number: 20100136993Abstract: The present invention relates to radio telecommunication, and discloses a method for releasing reserved resources. The method includes: utilizing the control signaling or control signaling format 1A with minimum overhead in the downlink scheduling control signalings supported by the user in a Long Term Evolution (LTE) system as the control signaling for releasing reserved resources. An apparatus and a base station for releasing reserved resources are disclosed in an embodiment of the present invention. Through the method, the apparatus, and the base station for releasing reserved resources disclosed herein, the Physical Downlink Control Channel (PDCCH) resources are saved, and transmission performance of the control signaling for releasing reserved resources is improved.Type: ApplicationFiled: November 25, 2009Publication date: June 3, 2010Applicant: HUAWEI TECHNOLOGIES CO., LTD.Inventor: Xue WEN
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Patent number: 7699094Abstract: A vapor chamber heat sink attached to a heat-generating electronic component includes a base (10) defining an opening therein. A plurality of fins (20) is mounted on the base. A heat pipe (30) thermally connects the electronic component and the fins. The heat pipe comprises a plate-type lower portion (32) contacting a bottom surface of the base and a bottom surface (22) of the fins and overlaying a top surface of the electronic component, a plate-type upper portion (34) parallel to the lower portion contacting a top surface (24) of the fins, and a connecting portion (36) interconnecting opposite two ends of the lower and upper portions. The heat pipe is configured in such a manner so as to enhance contact area and thermal conductivity between the heat pipe and the electronic component and between the heat pipe and the fins.Type: GrantFiled: April 28, 2006Date of Patent: April 20, 2010Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Xue-Wen Peng, Bing Chen, Jun-Hai Li
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Patent number: 7697293Abstract: A heat dissipation device includes a first heat sink, a second heat sink juxtaposed with the first heat sink and a plurality of heat pipes thermally connecting the first heat sink and the second heat sink. The first heat sink includes a plate-like spreader used for contacting with a first electric component and a honeycomb-like first fin unit thermally attached on the spreader. The spreader is a flat heat pipe. The heat pipes each include a flat plate-shaped evaporating section sandwiched between the spreader and the first fin unit of the first heat sink and a condensing section extending in the second heat sink. Due to a provision of the honeycomb-like first fin unit, the heat dissipation area of the first heat sink greatly increases.Type: GrantFiled: September 26, 2008Date of Patent: April 13, 2010Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Xue-Wen Peng, Rui-Hua Chen
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Publication number: 20100079941Abstract: A heat dissipation device includes a first heat sink, a second heat sink juxtaposed with the first heat sink and a plurality of heat pipes thermally connecting the first heat sink and the second heat sink. The first heat sink includes a plate-like spreader used for contacting with a first electric component and a honeycomb-like first fin unit thermally attached on the spreader. The spreader is a flat heat pipe. The heat pipes each include a flat plate-shaped evaporating section sandwiched between the spreader and the first fin unit of the first heat sink and a condensing section extending in the second heat sink. Due to a provision of the honeycomb-like first fin unit, the heat dissipation area of the first heat sink greatly increases.Type: ApplicationFiled: September 26, 2008Publication date: April 1, 2010Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.Inventors: XUE-WEN PENG, RUI-HUA CHEN
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Patent number: 7647960Abstract: A heat dissipation device includes a base, a first and second fin sets on the base, and a fan located atop the first and second fin sets. The base has a first face for contacting with an electronic device, and two sloped faces extending from the first face and toward each other. The first fin set defined a channel receiving the base therein. A plat extends from an end of the first face of the base. The second fin set is arranged on the plat of the base. The first face of the base has two grooves defined therein. A retaining member is attached to the first face of the base and has two retaining bars thereof fitted in the two grooves of the first face, respectively.Type: GrantFiled: February 8, 2006Date of Patent: January 19, 2010Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Xue-Wen Peng, Bing Chen
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Patent number: 7640968Abstract: A heat dissipation device includes a base (10), a heat radiator (40) mounted on the base (10), and two heat pipes (20) connecting the base (10) and the heat radiator (40). The base (10) has a bottom face adapted for contacting with a heat-generating electronic component. The heat pipes (20) each comprise an evaporating portion (22) embedded in the base (10) and a condensing portion (24) extending from an end of the evaporating portion (22). The heat radiator (40) comprises first and second fin assemblies (42, 44) each having two contacting faces (43, 45), the condensing portions (24) of the heat pipes (20) are sandwiched between the contacting faces (43, 45) by the first and second fin assemblies (42, 44), and an opening is enclosed by the first and second fin assemblies (42, 44) and receives an electric fan (50) therein.Type: GrantFiled: April 2, 2007Date of Patent: January 5, 2010Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Xue-Wen Peng, Rui-Hua Chen
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Publication number: 20090310296Abstract: A heat dissipation device to be mounted on a heat-generating component of a graphics card includes a base in contact with the heat-generating component, a heat dissipating member placed on the base, a fan mounted on the base adjacent to an end of the base, and a covering body. The fan is located closely to the heat dissipating member and generates airflow to the heat dissipating member. The dissipating member has a cellular structure integrally formed therein. The covering body includes a top wall in contact with a top of the dissipating member and a sidewall extending downwardly from an edge of the top wall and surrounding the dissipating member and the fan. The cellular structure comprises a plurality of elongated passages extending from the fan to another end of the base away from the fan.Type: ApplicationFiled: August 28, 2008Publication date: December 17, 2009Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.Inventors: XUE-WEN PENG, RUI-HUA CHEN
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Publication number: 20090233013Abstract: An electronic device (100) employs a viewing window (10), which includes a transparent substrate (11), an ink layer (12) and a metal layer (14). The ink layer is made of semitransparent ink or transparent matte ink. The ink layer is formed on the substrate and partially covers the substrate; and the metal layer is formed on the ink layer.Type: ApplicationFiled: June 5, 2008Publication date: September 17, 2009Applicants: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., FIH (HONG KONG) LIMITEDInventors: TAO FU, AN-CHUN ZHANG, XUE-WEN XIE
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Publication number: 20090133188Abstract: A jet assembly has internals rotatably and releaseably fit to a jet body, such as that for a spa. The internals have a barrel housing, a rotor and a barrel inlet. The internals as screwed into the jet body. A first threaded portion outside the barrel threadably engages second threaded portion inside the jet body wherein the internals have delimited rotation therein to align and misalign the barrel inlet from a body inlet on the jet body to control flow on and off respectively. The threaded portion within the jet body can be a locking ring affixed therein by fasteners or integral with the jet body. Rotation can be delimited by a projection on the barrel and a cooperating annular delimiting surface on the locking ring, such as circumferentially-spaced detents.Type: ApplicationFiled: November 7, 2008Publication date: May 28, 2009Applicant: Zhongshan Rising Dragon Plastics Manufactuting Co. Ltd.Inventors: Xue Wen PENG, John KEIRSTEAD, Kerry HARBARENKO, Joe HOOVER, Xue Wen LIU
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Publication number: 20090132857Abstract: A testing system for an embedded system is provided. The testing system includes a plurality of devices and one or more host computers. Each device, which includes the embedded system to be tested, is connected to the host computer via a network based on the network file system protocol. The host computers are further connected with a control server, and each of the host computers comprises a root file system. The control server is configured for providing an interface for a user to set test parameters, controlling each of the host computers to invoke a test program, thereby testing the embedded system according to the test parameters, and receiving test results of the embedded system from the host computer. A related testing method is also provided.Type: ApplicationFiled: August 25, 2008Publication date: May 21, 2009Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD, HON HAI PRECISION INDUSTRY CO., LTD.Inventors: MO-YING TONG, HUA DONG, XUE-WEN HONG, CHIANG-CHUNG TANG, HONG-BO ZHAO
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Patent number: 7529090Abstract: A heat dissipation device includes a heat sink and two conductor bases. The heat sink includes two base plates attached to a graphics card and thermally connecting with two graphics processing units (GPUs) mounted on the graphics card, and a plurality of fins soldered on tops of the base plates. The conductor bases connect with the base plates of the heat sink and thermally connect with other electronic components mounted around the GPUs thereby to dissipate heat generated by the other electronic components. The GPUs and the other electronic components have different heights.Type: GrantFiled: August 29, 2007Date of Patent: May 5, 2009Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Xue-Wen Peng, Rui-Hua Chen
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Patent number: 7515423Abstract: A heat dissipation device cooling a power adapter (50) includes first and second heat dissipation units (10), (20), at least one heat pipe (30) connecting the first and second heat dissipation units and a plurality of positioning elements (60) securing the first and second heat dissipation units on the power adapter. The positioning elements extend through the first heat dissipation unit and bottom ends of the positioning elements are screwed into the second heat dissipation unit. Top ends of the positioning elements are secured to the first heat dissipation unit. Therefore, the power adapter is tightly sandwiched between the first heat dissipation unit and the second heat dissipation unit by the positioning elements. Spring forces are exerted by the positioning elements on the first heat dissipation unit toward the second heat dissipation unit.Type: GrantFiled: September 22, 2006Date of Patent: April 7, 2009Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Xue-Wen Peng, Bing Chen
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Patent number: 7509996Abstract: A heat dissipation device includes a heat spreader (100), a fin assembly (300) located above the heat spreader and a heat pipe (400). The heat spreader has a bottom (110) for contacting a heat-generating component (500) and an upper surface (120) with a groove (122) defined therein. The fin assembly includes a plurality of horizontal fins stacked on each other. The heat pipe includes a first section (410) accommodated in the groove of the heat spreader, a pair of first legs (422) extending from opposite ends of the first section, respectively, and away from the heat spreader, and a second leg (424) bent from each of the first legs towards the heat spreader. The first and second legs pass through the horizontal fins and are fixed to and thermally connected with the horizontal fins.Type: GrantFiled: December 27, 2005Date of Patent: March 31, 2009Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventor: Xue-Wen Peng
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Publication number: 20090080161Abstract: A heat dissipation device for dissipating heat generated by an electronic component mounted on an add-on card includes a first heat dissipation unit, a second heat dissipation unit, a third heat dissipation unit and a heat pipe. The heat pipe has an evaporating portion thermally connecting with the electronic component via the first dissipation unit, and two oppositely extending condensing portions extending through and thermally connecting with the second and third heat dissipation units. The second and third heat dissipation units are positioned at a common lengthwise side of the graphics card and separated from each other. The second and third heat dissipation units each have an L-shaped configuration. The heat pipe has two connection portions connecting the evaporating portion with the condensing portions, respectively. The connecting portions together with the evaporating portion form a U-shaped configuration.Type: ApplicationFiled: September 26, 2007Publication date: March 26, 2009Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.Inventors: XUE-WEN PENG, RUI-HUA CHEN
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Publication number: 20090059525Abstract: A heat dissipation device mounted on a heat-generating component of a graphics card, includes a base, a fin unit and a fan. The base is kept in intimate contact with the heat-generating component. The fin unit includes a plurality of fins arranged on the base and forming a plurality of air passages between each fin and its neighboring fins. The fan is mounted on the base, close to the fin unit and producing airflow in the air passages. The base comprises a spreader inlayed in the base. The spreader is a flattened heat pipe. A bottom surface of the spreader is in contact with the heat-generating component. The fin unit is thermally attached to a top surface of the spreader.Type: ApplicationFiled: September 5, 2007Publication date: March 5, 2009Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.Inventors: XUE-WEN PENG, JUN-HAI LI
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Publication number: 20090059538Abstract: A heat dissipation device includes a heat sink and two conductor bases. The heat sink includes two base plates attached to a graphics card and thermally connecting with two graphics processing units (GPUs) mounted on the graphics card, and a plurality of fins soldered on tops of the base plates. The conductor bases connect with the base plates of the heat sink and thermally connect with other electronic components mounted around the GPUs thereby to dissipate heat generated by the other electronic components. The GPUs and the other electronic components have different heights.Type: ApplicationFiled: August 29, 2007Publication date: March 5, 2009Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.Inventors: XUE-WEN PENG, RUI-HUA CHEN
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Publication number: 20090059524Abstract: A heat dissipation device (100) includes a vapor chamber (20), a heat sink (10) and a heat pipe (30). The heat sink (10) includes a plurality of fins (12). The heat pipe (30) includes an evaporating portion (32) sandwiched between the vapor chamber (20) and the fins (12) of the heat sink (10), and a condensing portion (34) extending through the fins (12). The vapor chamber (20) is attached to an electronic component (42) mounted on an add-on card (40). The fins (12) of the heat sink (10) directly contact with the vapor chamber (20) and define a recess (127) at a bottom thereof to receive the vapor chamber (20) therein.Type: ApplicationFiled: August 27, 2007Publication date: March 5, 2009Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.Inventors: XUE-WEN PENG, JUN-HAI LI