Abstract: A heat dissipating device includes a heat sink (50) and two clips (10) for mounting the heat sink to a retention module (60) which surrounds an electronic component (65). The heat sink provides two shoulders (72). Each clip includes a strap (21) supported on one shoulder, a lever (40) having a cam pivotally connected to the strap, two legs (30) pivotally connected to opposite end portions of the strap, and two spring fingers (26) integrally extending from opposite ends of the strap. In assembly, the straps are downwardly pressed and the retention module push the legs to pivot away from the feet from original states toward forced states. When the legs arrive openings of the retention module the fingers urge the legs to enter the openings. The levers are then pivoted to push the straps to move upwardly to thereby cause the legs to firmly engage in the openings.

Abstract: A heat sink assembly includes a heat sink (10) deposited on a circuit board (100), a pair of bolts (30), and a clip (20) attached to the circuit board. The clip includes a pressing portion (22) engaging the circuit board, a first locking portion (26) and a second locking portion (28). The first locking portion defines an opening (42) and a slot (40) and the second locking portion defines a positioning groove (50). The clip further includes a clamping portion (70) linearly movably and rotatable mounted on the second locking portion. One bolt has a head engaging with the heat sink and a bead engaging with the first locking portion. The other bolt has a head engaging with the heat sink and a bead engaging with the clamping portion.

Abstract: A heat dissipation device includes a first heat sink (10) mounted on one side of a video graphics adapter (VGA) card (70) on which a heat generating componnent (74) is mounted to dissipate heat generated by the heat generating componnent, a second heat sink (30) mounted on an opposite side of the card, a first heat pipe (50, 50?) thermally connected to the first heat sink, a second heat pipe (60, 60?) discrete from the first heat pipe thermally connected to the second heat sink, and a connecting member (80, 80?) connected between the first and second heat pipes for transferring heat from the first heat pipe to the second heat pipe.

Abstract: A heat dissipation device includes a first heat sink (10) mounted on one side of a video graphics adapter (VGA) card (70) on which a heat generating componnent (74) is mounted to dissipate heat generated by the heat generating componnent, a second heat sink (30) mounted on an opposite side of the card, a first heat pipe (50, 50?) thermally connected to the first heat sink, a second heat pipe (60, 60?) discrete from the first heat pipe thermally connected to the second heat sink, and a connecting member (80, 80?) connected between the first and second heat pipes for transferring heat from the first heat pipe to the second heat pipe.

Abstract: An apparatus, method, and medium for detecting an impact sound and an apparatus, method, and medium for discriminating the impact sound using the same. The impact sound detecting apparatus includes: an onset detector separating an input signal of a frame unit into a low frequency signal and a high frequency signal, measuring powers of the separated signals, and detecting onsets by detecting changes in the measured powers; an event buffer buffering the powers measured by the onset detector and spectral data of the input signal; and an impact sound verifier determining whether each of the detected onsets is an impulse onset, and if each of the detected onsets is the impulse onset, detecting events starting from the impulse onsets by checking the powers stored in the event buffer and determining each of the detected events to be an impulse event if each of the detected onsets satisfies a predetermined condition.

Abstract: A fastener (10) for mounting a heat-radiator (20) to an electronic device (30) on a circuit board (40) is disclosed. The heat-radiator and the circuit board have aligned holes (22, 44). The fastener includes a head (11) having an upper portion (112) with a large diameter and a lower portion (113) with a smaller diameter, a cylindrical spring (14) captured around the lower portion of the head for exerting a spring force against the heat-radiator, and a metallic wire (15) having a first end portion fixed on said head and a second end portion bent to form an engaging portion (152). The engaging portion of the metallic wire compressively passes through the aligned holes of the heat-radiator and the circuit board and is engaged with an underside of the circuit board.

Abstract: A heat dissipating device includes a heat sink (50) and two clips (10) for mounting the heat sink to a retention module (60) which surrounds an electronic component (65). The heat sink provides two shoulders (72). Each clip includes a strap (21) supported on one shoulder, a lever (40) having a cam pivotally connected to the strap, two legs (30) pivotally connected to opposite end portions of the strap, and two spring fingers (26) integrally extending from opposite ends of the strap. In assembly, the straps are downwardly pressed and the retention module push the legs to pivot away from the feet from original states toward forced states. When the legs arrive openings of the retention module the fingers urge the legs to enter the openings. The levers are then pivoted to push the straps to move upwardly to thereby cause the legs to firmly engage in the openings.

Abstract: A collapsible and reusable container that easily collapses to a completely flat stackable package with no small or loose parts The collapsible and reusable container can be securely locked with a single lock.