Abstract: An optical sensing module and an electronic device are provided. The optical sensing module comprises: a substrate, a light shielding layer, one or more optical sensing chips, a light-transmitting layer, and a transparent conducting layer; the one or more optical sensing chips are arranged above the substrate; the light shielding layer clads a portion of the one or more optical sensing chips without contacting the substrate and the light-transmitting layer, and clads a portion of the light-transmitting layer that excludes a second surface of the light-transmitting layer and an area not in contact with the one or more optical sensing chips; the transparent conducting layer is in contact with the second surface of the light-transmitting layer, and is electrically connected to a ground wire in the substrate; and the transparent conducting layer is configured to shield an interference signal from the one or more optical sensing chips.

Abstract: A chip for an ultrasonic transducer, an ultrasonic transducer, an electronic device, and a method for preparing a chip are provided. The chip is arranged below an acoustic layer, and the chip comprises: a substrate; a circuit module arranged in the substrate; and a conductive shielding layer arranged between the circuit module and the acoustic layer, wherein a projection of the conductive shielding layer on the substrate at least covers a projection of the circuit module on the substrate, and the conductive shielding layer is grounded.

Abstract: A pavement condition determining method, a collection box, a computer device, a storage medium, and a computer program product. The pavement condition determining method comprises: acquiring acceleration data and working condition data, the acceleration data being collected by a plurality of acceleration sensors arranged inside the pavement; performing a feature extraction on the acceleration data according to a convolutional neural network of a pavement condition recognition model to obtain acceleration features; splicing each of the acceleration features with corresponding working condition data to determine a target feature vector; and determining a pavement damage identification result based on target feature vectors and a multi-layer perceptron of the pavement condition recognition model.

Abstract: An optical sensing apparatus, a method for manufacturing an optical sensing apparatus, and an electronic device can improve the optical detection accuracy and user experience. The optical sensing apparatus includes: a sensor chip configured to receive an incident light signal for optical detection; and a transparent conductive layer provided above the sensor chip and connected to a grounding terminal of the sensor chip, where the transparent conductive layer is configured to be coupled with an electromagnetic wave in an environment, and transmit the electromagnetic wave to the grounding terminal of the sensor chip.

Abstract: The present disclosure provides a two-stage co-liquefaction mixing-reaction-filtration-heat recovery integrated apparatus, realizing the implementation of a two-stage HTL process; secondly, a nozzle, a receiving chamber, a mixing chamber and a diffusion chamber are disposed at different material feed ports and medium feed ports, and high-speed fluids are fully collided and mixed in these structures; heat of HTL in a first stage is from heat of an HTL product in a second stage, which achieves the recycling of the heat of the HTL product in the second stage, improving economic efficiency; in a first-stage HTL process, through the setting of high-temperature and high-pressure needle valves, so that different first-stage HTL reaction times are selected for different material characteristics; and each first-stage HTL reaction tube is provided with an inclination of 1-3°, and a second-stage HTL generation chamber is provided with a residue scraping device and a salt scraping device.

Abstract: A biological information identification apparatus is provided, including: a fingerprint identification module and a packaging layer disposed on a surface of the fingerprint identification module facing a user, and configured to package the fingerprint identification module to insulate the fingerprint identification module from an outside environment, a top surface of the packaging layer being an arc surface. The fingerprint identification module includes: a fingerprint identification chip configured to identify fingerprint information of the user, where a plurality of capacitive pixel units are disposed on an upper surface of the fingerprint identification chip, and the capacitive pixel units are configured to form capacitance with a finger of the user; and a plurality of conductive elements disposed above the capacitive pixel units. An electronic device including the aforementioned biological information identification apparatus is provided.

Abstract: A biological information identification apparatus is provided, including: a fingerprint identification module and a packaging layer disposed on a surface of the fingerprint identification module facing a user, and configured to package the fingerprint identification module to insulate the fingerprint identification module from an outside environment, a top surface of the packaging layer being an arc surface. The fingerprint identification module includes: a fingerprint identification chip configured to identify fingerprint information of the user, where a plurality of capacitive pixel units are disposed on an upper surface of the fingerprint identification chip, and the capacitive pixel units are configured to form capacitance with a finger of the user; and a plurality of conductive elements disposed above the capacitive pixel units. An electronic device including the aforementioned biological information identification apparatus is provided.

Abstract: Embodiments of the present application provide a chip package structure, a chip package method and a terminal device. The chip package structure includes: an optical sensing chip, including a first surface and a second surface, where the first surface is provided with a first pad, the second surface is provided with a connecting end, the first pad is electrically connected to the connecting end, and the connecting end is configured to implement an electrical connection between the chip package structure and the exterior; and an optical path modulating structure, disposed above the first surface, and configured to perform an optical path modulation on an optical signal reflected from a human finger and make the signal incident on the first surface, or perform the optical path modulation on an optical signal emitted from the first surface and make the signal exit to the human finger.

Abstract: Embodiments of the present application, pertaining to the technical field of optical devices, provide an optical module and a fabrication method thereof, and a terminal device using the same. The optical module includes a lens and a sensor package. The lens is positioned at an uppermost position of the optical module and attached to a lower position of a terminal screen, and is configured to transmit light passing through the screen; the sensor package includes an optical sensor, where a photosensitive region is arranged on an upper surface of the optical sensor, and the photosensitive region is configured to receive light passing through the lens; and the sensor package further includes an air gap, and the photosensitive region of the optical sensor is configured to receive the light passing through the screen via the air gap.

Abstract: Embodiments of the present application, pertaining to the technical field of optical devices, provide an optical module and a fabrication method thereof, and a terminal device using the same. The optical module includes a lens and a sensor package. The lens is positioned at an uppermost position of the optical module and attached to a lower position of a terminal screen, and is configured to transmit light passing through the screen; the sensor package includes an optical sensor, where a photosensitive region is arranged on an upper surface of the optical sensor, and the photosensitive region is configured to receive light passing through the lens; and the sensor package further includes an air gap, and the photosensitive region of the optical sensor is configured to receive the light passing through the screen via the air gap.

Abstract: Embodiments of the present application provide a chip package structure, a chip package method and a terminal device. The chip package structure includes: an optical sensing chip, including a first surface and a second surface, where the first surface is provided with a first pad, the second surface is provided with a connecting end, the first pad is electrically connected to the connecting end, and the connecting end is configured to implement an electrical connection between the chip package structure and the exterior; and an optical path modulating structure, disposed above the first surface, and configured to perform an optical path modulation on an optical signal reflected from a human finger and make the signal incident on the first surface, or perform the optical path modulation on an optical signal emitted from the first surface and make the signal exit to the human finger.