Patents by Inventor Ya Wen Hsu
Ya Wen Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240136117Abstract: A multi-phase coupled inductor includes a first iron core, a second iron core, and a plurality of coil windings. The first iron core includes a first body and a plurality of first core posts. The plurality of first core posts are connected to the first body. The second iron core is opposite to the first iron core. The second iron core and the first body are spaced apart from each other by a gap. The plurality of coil windings wrap around the plurality of first core posts, respectively. Each of the coil windings has at least two coils.Type: ApplicationFiled: October 1, 2023Publication date: April 25, 2024Inventors: HUNG-CHIH LIANG, PIN-YU CHEN, HANG-CHUN LU, YA-WEN YANG, YU-TING HSU, WEI-ZHI HUANG
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Publication number: 20240107148Abstract: Camera modules and associated electronic devices and systems are described. A camera module may include a set of housing elements that at least partially defines an interior cavity, a set of lens elements, an image sensor positioned within the interior cavity to receive light through the set of lens elements, and a substrate assembly. The substrate assembly may include a set of rigid substrates, a first set of electrical contacts positioned on a first surface of the set of rigid substrates, and a second set of electrical contacts positioned on a second surface of the set of rigid substrates. The substrate assembly may be positioned such that a first portion of the substrate assembly is positioned inside the interior cavity and a second portion of the substrate assembly extends outside of the interior cavity.Type: ApplicationFiled: January 26, 2023Publication date: March 28, 2024Inventors: Angelo M. Alaimo, Wassim Ferose Habeeb Rakuman, Bohan Hao, Ya-Wen Hsu
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Patent number: 11750924Abstract: Various embodiments include a camera having a sensor-shifting mechanism. For example, the camera may include a voice coil motor (VCM) actuator to move an image sensor, relative to a lens group, to provide autofocus (AF) functionality. According to some embodiments, the VCM actuator may include one or more coils attached to a coil carrier, and one or more magnets attached to a stationary structure of the camera. The coil carrier may be attached to an image sensor package such that the image sensor is movable together with the coil carrier, in at least one direction parallel to an optical axis defined by the lens group. In some embodiments, the camera may include one or more suspension arrangements to suspend the coil carrier and/or the image sensor package from one or more stationary structures of the camera.Type: GrantFiled: September 23, 2021Date of Patent: September 5, 2023Assignee: Apple Inc.Inventors: Ya-Wen Hsu, Hua Deng, Raymond A. Quines, Yu Min Lee
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Publication number: 20220103744Abstract: Various embodiments include a camera having a sensor-shifting mechanism. For example, the camera may include a voice coil motor (VCM) actuator to move an image sensor, relative to a lens group, to provide autofocus (AF) functionality. According to some embodiments, the VCM actuator may include one or more coils attached to a coil carrier, and one or more magnets attached to a stationary structure of the camera. The coil carrier may be attached to an image sensor package such that the image sensor is movable together with the coil carrier, in at least one direction parallel to an optical axis defined by the lens group. In some embodiments, the camera may include one or more suspension arrangements to suspend the coil carrier and/or the image sensor package from one or more stationary structures of the camera.Type: ApplicationFiled: September 23, 2021Publication date: March 31, 2022Applicant: Apple Inc.Inventors: Ya-Wen Hsu, Hua Deng, Raymond A. Quines, Yu Min Lee
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Patent number: 11150438Abstract: A camera module includes a solid state lens that flexes, in response to electrical signals. A lens barrel holds the lens on the optical axis. A lens barrel holder holds the lens barrel above an image sensor. The lens barrel holder includes electrically conductive interconnects between a bottom and a top end of the lens barrel holder. The conductive interconnects are not exposed to an exterior of the lens barrel holder. The camera module includes two or more respective lower electrically conductive connections in proximity to the interconnects and connecting the electrically conductive interconnects to respective conductors for the one or more electrical signals. The camera module includes two or more upper conductive connections configured to electrically connect the solid state lens to respective ones of the two or more conductive interconnects.Type: GrantFiled: August 9, 2017Date of Patent: October 19, 2021Assignee: Apple Inc.Inventors: Ya Wen Hsu, Pierre-Jean Y. Parodi-Keravec, Steven Webster
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Patent number: 10373992Abstract: Compact camera modules that may be used in small form factor devices. The camera module may include a lens holder configured to receive one or more lens elements and a photosensor. In some embodiments, the lens holder may define a first recess for receiving the lens elements and a second recess for receiving one or more other components, such as the photosensor. In some embodiments, the photosensor may be configured to communicate with a flex circuit board without coupling the photosensor to a substrate to form a flip chip that communicates with the flex circuit board. The photosensor may be optically aligned with the lens elements and bonded to the lens holder such that the photosensor is fixed in an aligned position and at least partially enclosed by the lens holder.Type: GrantFiled: August 8, 2017Date of Patent: August 6, 2019Assignee: Apple Inc.Inventors: Ya Wen Hsu, Douglas S. Brodie, Steven Webster
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Publication number: 20190179107Abstract: A camera module includes a solid state lens that flexes, in response to electrical signals. A lens barrel holds the lens on the optical axis. A lens barrel holder holds the lens barrel above an image sensor. The lens barrel holder includes electrically conductive interconnects between a bottom and a top end of the lens barrel holder. The conductive interconnects are not exposed to an exterior of the lens barrel holder. The camera module includes two or more respective lower electrically conductive connections in proximity to the interconnects and connecting the electrically conductive interconnects to respective conductors for the one or more electrical signals. The camera module includes two or more upper conductive connections configured to electrically connect the solid state lens to respective ones of the two or more conductive interconnects.Type: ApplicationFiled: August 9, 2017Publication date: June 13, 2019Applicant: Apple Inc.Inventors: Ya Wen Hsu, Pierre-Jean Y. Parodi-Keravec, Steven Webster
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Patent number: 10298820Abstract: A camera module includes a lens barrel holder and a substrate. The substrate may include a circuit board embedded in the substrate. The circuit board may include multiple electrical components mounted to a first side of the circuit board, where the electrical components are not exposed outside. The circuit board may also include multiple electrical connections on another side of the circuit board, an image sensor mounted to the electrical connections, and an upper opening in the circuit board for light to pass through. The substrate may include an upper opening configured to receive, at least partially inside the substrate, a lower portion of the lens barrel holder. The substrate may include a lower opening connected to the upper opening and configured to receive the image sensor. The lens barrel holder may include extensions, such as a flange or tabs, and an adhesive bond between the extensions and the substrate.Type: GrantFiled: August 9, 2017Date of Patent: May 21, 2019Assignee: Apple Inc.Inventors: Ya Wen Hsu, Douglas S. Brodie, Steven Webster
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Patent number: 10143678Abstract: Disclosures of the present invention describe a method of treatment of preventing hyperglycemia complications using at least one pharmaceutical made from a red mold product, wherein the red mold product is a red mold rice or a red mold Dioscorea, and the pharmaceutical is an extract obtained from the red mold product. Particularly, the extract can be Monascin, Ankaflavin, or a combination of Monascin and Ankaflavin. Moreover, a variety of experiment data have proved that the extract indeed exhibits a prevention effect in hyperglycemia complications comprising non-alcoholic liver damage and kidney failure.Type: GrantFiled: July 27, 2018Date of Patent: December 4, 2018Assignee: SUNWAY BIOTECH CO., LTD.Inventors: Tzu-Ming Pan, Chun-Lin Lee, Ya-Wen Hsu
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Publication number: 20180338949Abstract: Disclosures of the present invention describe a method of treatment of preventing hyperglycemia complications using at least one pharmaceutical made from a red mold product, wherein the red mold product is a red mold rice or a red mold Dioscorea, and the pharmaceutical is an extract obtained from the red mold product. Particularly, the extract can be Monascin, Ankaflavin, or a combination of Monascin and Ankaflavin. Moreover, a variety of experiment data have proved that the extract indeed exhibits a prevention effect in hyperglycemia complications comprising non-alcoholic liver damage and kidney failure.Type: ApplicationFiled: July 27, 2018Publication date: November 29, 2018Inventors: Tzu-Ming PAN, Chun-Lin LEE, Ya-Wen HSU
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Patent number: 10070279Abstract: Network apparatuses and a message providing method are provided. A network apparatus includes a processor, network interface, and display screen. The processor executes a message transmission application. The network interface transceives at least one message of the message transmission application. The display screen displays a window of the message transmission application. The window includes at least one icon and the at least one message. The processor determines that a selected icon of the at least one icon corresponds to a selected message of the at least one message. The processor derives at least one keyword by analyzing the selected message according to a semantic analysis rule corresponding to the selected icon. The processor derives at least one recommended message by searching a database according to the at least one keyword. The display screen displays the at least one recommended message.Type: GrantFiled: October 10, 2016Date of Patent: September 4, 2018Assignee: Institute For Information IndustryInventors: Yu-Hao Chen, Bo-Jiun Hsu, Ya-Wen Hsu
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Publication number: 20180048796Abstract: A camera module includes a lens barrel holder and a substrate. The substrate may include a circuit board embedded in the substrate. The circuit board may include multiple electrical components mounted to a first side of the circuit board, where the electrical components are not exposed outside. The circuit board may also include multiple electrical connections on another side of the circuit board, an image sensor mounted to the electrical connections, and an upper opening in the circuit board for light to pass through. The substrate may include an upper opening configured to receive, at least partially inside the substrate, a lower portion of the lens barrel holder. The substrate may include a lower opening connected to the upper opening and configured to receive the image sensor. The lens barrel holder may include extensions, such as a flange or tabs, and an adhesive bond between the extensions and the substrate.Type: ApplicationFiled: August 9, 2017Publication date: February 15, 2018Applicant: Apple Inc.Inventors: Ya Wen Hsu, Douglas S. Brodie, Steven Webster
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Publication number: 20180041880Abstract: Network apparatuses and a message providing method are provided. A network apparatus includes a processor, network interface, and display screen. The processor executes a message transmission application. The network interface transceives at least one message of the message transmission application. The display screen displays a window of the message transmission application. The window includes at least one icon and the at least one message. The processor determines that a selected icon of the at least one icon corresponds to a selected message of the at least one message. The processor derives at least one keyword by analyzing the selected message according to a semantic analysis rule corresponding to the selected icon. The processor derives at least one recommended message by searching a database according to the at least one keyword. The display screen displays the at least one recommended message.Type: ApplicationFiled: October 10, 2016Publication date: February 8, 2018Inventors: Yu-Hao CHEN, Bo-Jiun HSU, Ya-Wen HSU
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Publication number: 20170135983Abstract: The present invention provides a composition for regulating blood sugar. The composition comprises at least one yellow pigment extracted from a red mold product, wherein the said yellow pigment is Monascin, Ankaflavin, or combination of Monascin and Ankaflavin. Moreover, results of a variety of animal experiments have proved that this blood sugar regulating composition indeed possess the functionalities of: lowering Hyperglycemia induced by high energy diet, alleviating ROS and inflammatory caused by the Hyperglycemia, reduce AST and ALT value of liver as well as sarcosine value of kidney.Type: ApplicationFiled: August 25, 2016Publication date: May 18, 2017Inventors: TZU-MING PAN, Chun-Lin LEE, Ya-Wen HSU
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Publication number: 20160331721Abstract: The present invention provides a composition for alleviating and preventing Alzheimer's disease. This composition comprises at least one yellow pigment extracted from a red mold product, and the said yellow pigment is Monascin or Ankaflavin. Moreover, after completing a variety of experiments, the composition has been proved possessing effects on alleviating and preventing AD by alleviating the symptoms of memory loss and learning disability resulted from the ?-amyloid accumulated in brain of rats as well as reducing the inflammation and the oxidative stress caused by the ?-amyloid in cerebral cortex and hippocampus tissue. Therefore, the experimental results have proved that this novel composition is indeed able to treat and prevent Alzheimer's disease.Type: ApplicationFiled: April 26, 2016Publication date: November 17, 2016Inventors: TZU-MING PAN, Chun-Lin LEE, Pei-Ying Lin, Ya-Wen HSU
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Publication number: 20160332091Abstract: The present invention provides a novel pure substance extracting method. Differing from conventional pure substance extracting method utilizing chromatography technique to treat a red mold product with an extracting and purifying process by using a plurality of organic extracting solution, the present invention merely utilizes water and ethanol solution to extract the pure substances of Monascin and Ankaflavin from the red mold product. Based on experimental results, the precipitate of the substances obtained through this novel extracting method is able to contain high extraction ratio of Monascin (˜97.35%) and Ankaflavin (˜95.16%). Moreover, experimental results also prove that the novel pure substance extracting method includes the advantages of high extraction speed, high extraction efficiency, high extraction percentage, and using single organic solution.Type: ApplicationFiled: March 29, 2016Publication date: November 17, 2016Inventors: TZU-MING PAN, YA-WEN HSU
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Publication number: 20120049338Abstract: In one embodiment, a semiconductor device package includes: (1) a substrate unit; (2) connecting elements disposed adjacent to a periphery of the substrate unit and extending upwardly from an upper surface of the substrate unit; (3) a semiconductor device disposed adjacent to the upper surface of the substrate unit and electrically connected to the substrate unit; and (4) a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit. The package body defines openings that at least partially expose respective ones of the connecting elements. At least one of the connecting elements has a width WC, and at least one of the openings has a width WU adjacent to an upper surface of the package body, such that WU>WC.Type: ApplicationFiled: November 7, 2011Publication date: March 1, 2012Inventors: Kuang-Hsiung Chen, Chi-Chih Shen, Jen-Chuan Chen, Wen-Hsiung Chang, Hui-Shan Chang, Pei-Yu Hsu, Fa-Hao Wu, Chen-Yu Chia, Chi-Chih Chu, Cheng-Yi Weng, Ya-Wen Hsu
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Patent number: 8076765Abstract: In one embodiment, a semiconductor device package includes: (1) a substrate unit; (2) connecting elements disposed adjacent to a periphery of the substrate unit and extending upwardly from an upper surface of the substrate unit; (3) a semiconductor device disposed adjacent to the upper surface of the substrate unit and electrically connected to the substrate unit; and (4) a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit. The package body defines openings that at least partially expose respective ones of the connecting elements. At least one of the connecting elements has a width WC, and at least one of the openings has a width WU adjacent to an upper surface of the package body, such that WU>WC.Type: GrantFiled: July 22, 2009Date of Patent: December 13, 2011Assignee: Advanced Semiconductor Engineering, Inc.Inventors: Kuang-Hsiung Chen, Chi-Chih Shen, Jen-Chuan Chen, Wen-Hsiung Chang, Hui-Shan Chang, Pei-Yu Hsu, Fa-Hao Wu, Chen-Yu Chia, Chi-Chih Chu, Cheng-Yi Weng, Ya-Wen Hsu
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Publication number: 20100171205Abstract: In one embodiment, a semiconductor device package includes: (1) a substrate unit; (2) connecting elements disposed adjacent to a periphery of the substrate unit and extending upwardly from an upper surface of the substrate unit; (3) a semiconductor device disposed adjacent to the upper surface of the substrate unit and electrically connected to the substrate unit; and (4) a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit. The package body defines openings that at least partially expose respective ones of the connecting elements. At least one of the connecting elements has a width WC, and at least one of the openings has a width WU adjacent to an upper surface of the package body, such that WU>WC.Type: ApplicationFiled: July 22, 2009Publication date: July 8, 2010Inventors: Kuang-Hsiung CHEN, Chi-Chih SHEN, Jen-Chuan CHEN, Wen-Hsiung CHANG, Hui-Shan CHANG, Pei-Yu HSU, Fa-Hao WU, Chen-Yu CHIA, Chi-Chih CHU, Cheng-Yi WENG, Ya-Wen HSU
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Patent number: D574702Type: GrantFiled: November 30, 2006Date of Patent: August 12, 2008Assignee: Logitech Europe S.A.Inventors: Brian Stephens, Laurence Massey, Mark Martinez, Andrew Heymann, Ladan Khamsepoor, Ya Wen Hsu