Patents by Inventor Ya Wen Hsu

Ya Wen Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060034774
    Abstract: The present invention provides a triaminetetraacetatesaccharide coordinating to metal ion to form bioactive metal complexes. The bioactive metal complexes of the present invention can be used as contrast agents for magnetic resonance imaging (MRI).
    Type: Application
    Filed: August 10, 2005
    Publication date: February 16, 2006
    Inventors: Yun-Ming Wang, Ya-Wen Hsu, Gin-Chung Liu
  • Publication number: 20050073822
    Abstract: An EMI shielding assembly having a surface plate formed as a single unit with one or more wall components is disclosed. The surface plate of the shielding assembly is divided into different zones by the wall component. When the shielding assembly is mounted onto a circuit board, not only the electromagnetic waves generated by the electronic components installed within the area of different zones are prevented by the shielding of the surface plate from leaking outside, but also the aforementioned waves are isolated by the wall components that cross components EMI effect is prevented from happening. Therefore, the goal that not only prevent the electromagnetic wave generated by the electronic components on the circuit board from leaking outside, but also prevent the cross components EMI effects between the different electronic components installed on the same circuit board by a single unit shielding assembly is achieved.
    Type: Application
    Filed: October 7, 2003
    Publication date: April 7, 2005
    Inventors: Ya-Wen Hsu, Shin-Ying Lin, Tai-Tung Lien
  • Publication number: 20040240190
    Abstract: A communication card has a bottom panel, a top cover and a top panel, which is able to accommodate an electronic device. The electronic device has a circuit board and a RF transceiver coupling to the circuit board. The circuit board further comprises at least a metallic ground layer extending along the whole area of the circuit board, such that the dissipation of EMI from the backside of the circuit board can be prevented. The bottom panel and the top panel are both made of an electromagnetic wave penetrable material, and the top cover is made of an electromagnetic wave impenetrable material. The connecting means that can inter-engage with each other are respectively applied on the bottom panel and the top cover, and between the bottom panel and the top panel. After assembling, the circuit board is substantially positioned between the top cover and the bottom panel, and the RF transceiver is substantially positioned between the top panel and the bottom panel.
    Type: Application
    Filed: January 6, 2004
    Publication date: December 2, 2004
    Inventors: Ya-Wen Hsu, Pao-Chien Kuo, Shih-Ying Lin, Chung-Yi Lee, Chi-Chang Wang
  • Patent number: D534939
    Type: Grant
    Filed: May 17, 2005
    Date of Patent: January 9, 2007
    Assignee: Logitech Europe S.A.
    Inventors: Peter Sheehan, David Maher, Laurence Massey, Andrew Heyman, Mark Martinez, Ya Wen Hsu
  • Patent number: D552659
    Type: Grant
    Filed: March 27, 2006
    Date of Patent: October 9, 2007
    Assignee: Logitech Europe S.A.
    Inventors: Brian Stephens, Laurence Massey, Mark Martinez, Ya Wen Hsu
  • Patent number: D563446
    Type: Grant
    Filed: December 27, 2006
    Date of Patent: March 4, 2008
    Assignee: Logitech Europe S.A.
    Inventors: Brian Stephens, Laurence Massey, Mark Martinez, Andrew Heymann, Ladan Khamsepoor, Ya Wen Hsu
  • Patent number: D564006
    Type: Grant
    Filed: December 27, 2006
    Date of Patent: March 11, 2008
    Assignee: Logitech Europe S.A.
    Inventors: Brian Stephens, Laurence Massey, Mark Martinez, Andrew Heymann, Ladan Khamsepoor, Ya Wen Hsu
  • Patent number: D564559
    Type: Grant
    Filed: December 27, 2006
    Date of Patent: March 18, 2008
    Assignee: Logitech Europe S.A.
    Inventors: Brian Stephens, Laurence Massey, Mark Martinez, Andrew Heymann, Ladan Khamsepoor, Ya Wen Hsu