Abstract: A high-performance power supply module including at least one voltage regulating unit is provided. The voltage regulating unit comprises an SPS combination, a four-phase anti-coupling inductor, an output capacitor assembly, a first substrate and a second substrate, the SPS combination and the four-phase coupling inductor are respectively arranged on two opposite surfaces of the first substrate, the SPS combination comprises four smart power stages, the four smart power stages are arranged according to four-blade windmill shapes, and the four smart power stages are matched with the four-phase coupling inductor structure. The output capacitor assembly is arranged on one surface of the second substrate; and a groove is formed in the bottom surface of the four-phase coupling inductor.

Abstract: A thin coupling inductor, a manufacturing method thereof and a power supply module are provided. The thin coupling inductor comprises a first assembly, a first magnetic core and a second magnetic core; the first assembly comprises a first winding main body, a second winding main body and a third magnetic core combination; and the first magnetic core and the second magnetic core have a thin-layer composite structure. The manufacturing method comprises the steps that a third magnetic core combination and a winding main body are arranged in the frame, and the PP material is pressed to form a stack body. The power supply module comprises a thin coupling inductor, a first switching element, a second switching element, an input capacitor and an output capacitor. The control signals of the first switching element and the second switching element are 180 degrees out of phase.

Abstract: A heat dissipation structure of a high-power chip power supply module is provided. The heat dissipation structure comprises a first motherboard, a second motherboard, a high-power chip module, a power supply module and a top heat dissipation device. The power supply module comprises at least one heating power component. The power supply module is provided with a heat dissipation surface. The heating power component is arranged adjacent to the heat dissipation surface. The heat dissipation structure further comprises a vapor chamber and a longitudinal thermal conductor. The vapor chamber is in thermal conduction with the heat dissipation face, and the vapor chamber is in thermal conduction with the top heat dissipation device through the longitudinal thermal conductor.

Abstract: A power module comprises a first circuit board assembly and a magnetic core assembly. The first circuit board assembly comprises a first printed circuit board and at least two switch circuits disposed on the first printed circuit board. The magnetic core assembly is disposed near the first printed circuit board and comprises a magnetic core portion and at least a pair of first electrical conductors. The magnetic core portion comprises at least a core unit, the core unit comprises a pair of holes and a second magnetic overlapping region, and the pair of holes are separated by the second magnetic overlapping region. Each pair of the first electrical conductors is penetrated through the corresponding pair of holes of the magnetic core portion to define two output inductors. Each of the switch circuits is electrically connected with the corresponding output inductor to define a phase circuit of the power module.

Abstract: The application discloses a POL integrated power supply module and a production process thereof. The POL integrated power supply module comprises an inductor assembly, a substrate, a switch unit and an input capacitor. The substrate comprises a first surface and a second surface which are opposite, the inductor assembly is arranged on the second surface of the substrate, and the switch unit and the input capacitor are arranged on the first surface of the substrate. According to the POL integrated power supply module, a structural layout is provided, and the ultrathin thickness of the POL integrated power supply module is achieved. According to the POL integrated power supply module with the structure, a corresponding production process is provided, the production process is simplified, and the reliability of the POL integrated power supply module is improved.

Abstract: A power conversion circuit is provided. According to the topologies of power conversion circuits and the corresponding control manners of the present disclosure, the output voltage is greatly reduced relative to the input voltage, and thus the function of voltage reduction is achieved. Moreover, a voltage-second product of the time and the voltage across the first output inductor and a voltage-second product of the time and the voltage across the second output inductor are both greatly reduced. Accordingly, the inductance, volume and loss of the first output inductor and the second output inductor are greatly reduced. Therefore, the voltage regulation module may receive the low output voltage outputted by the power conversion circuit, thereby reducing the overall volume of the voltage regulation module and increasing the power conversion density and conversion efficiency of the voltage regulation module.

Abstract: A power system includes a power module, an electronic load and a system board. The power module includes a first surface, a second surface, a switch and a plurality of conductive parts, wherein the switch is disposed on the first surface of the power module and the plurality of conductive parts are disposed on the second surface of the power module. The electronic load includes a plurality of conductive parts. The power module and the electronic load are disposed on two opposite sides of the system board, the power module delivers power to the electronic load through the system board, and gaps and networks of the plurality of conductive parts of the power module correspond to those of the plurality of conductive parts of the electronic load.

Abstract: The present disclosure provides a power conversion module including a magnetic component and a power device layer. The magnetic component includes a main body layer, a first magnetic core, a second magnetic core and a conductor. The main body layer includes a first surface and a second surface opposite to each other. The first magnetic core is embedded in the main body layer and adjacent to the first surface. The second magnetic core is embedded in the main body layer and adjacent to the second surface. The first magnetic core and the second magnetic core are connected to form plural magnetic columns. The conductor is embedded between the first surface and the second surface. The conductor is partially disposed between the plural magnetic columns. The power device layer is disposed on the first surface. The power device layer includes a power device electrically connected to conductor.

Abstract: A magnetic device includes a magnetic core assembly, a primary winding, a first secondary winding, at least one second secondary winding and an auxiliary winding. The magnetic core assembly includes a first magnetic leg, a second magnetic leg and a third magnetic leg. The primary winding is wound around the second magnetic leg. The at least one secondary winding is wound around the second magnetic leg or the third magnetic leg. The auxiliary winding is electrically connected with an auxiliary inductor and wound around at least one magnetic leg. The primary winding is electrically connected with a first switch circuit, and the at least one secondary winding is electrically connected with a second switch circuit, wherein when switches of the first switch circuit turn off and switches of the second switch circuit turn on, an superposed AC voltage coupled by the auxiliary winding is applied on the auxiliary inductor.

Abstract: The present disclosure provides a power conversion module including a magnetic component and a power device layer. The magnetic component includes a main body layer, a first magnetic core, a second magnetic core and a conductor. The main body layer includes a first surface and a second surface opposite to each other. The first magnetic core is embedded in the main body layer and adjacent to the first surface. The second magnetic core is embedded in the main body layer and adjacent to the second surface. The first magnetic core and the second magnetic core are connected to form plural magnetic columns. The conductor is embedded between the first surface and the second surface. The conductor is partially disposed between the plural magnetic columns. The power device layer is disposed on the first surface. The power device layer includes a power device electrically connected to conductor.

Abstract: A magnetic device includes a magnetic core assembly, a primary winding, a first secondary winding and a second secondary winding. The magnetic core assembly includes a first magnetic cover, a second magnetic cover, a first magnetic leg, a second magnetic leg, a third magnetic leg and a fourth magnetic leg. The primary winding is wound around the first magnetic leg and the third magnetic leg. A first terminal of the first secondary winding is disposed between the first magnetic leg and the second magnetic leg. A second terminal of the first secondary winding is disposed between the third magnetic leg and the fourth magnetic leg. A first terminal of the second secondary winding is disposed between the first magnetic leg and the fourth magnetic leg. A second terminal of the second secondary winding is disposed between the second magnetic leg and the third magnetic leg.

Abstract: A stacking system is disclosed and includes a circuit board, an integrated circuit, a voltage regulation module and a heat dissipation module. The integrated circuit and the voltage regulation module are opposite disposed on a first side and a second side of the circuit board. The heat dissipation module includes a first heat dissipation component and a second heat dissipation component located at a top surface of the integrated circuit and the bottom surface of the voltage regulation module. The second heat dissipation component includes a base and an extended arm. The base is in thermal contact with bottom surface of the voltage regulation module. The extended arm is extended from the base to the first heat dissipation component and in thermal contact with the first heat dissipation component.

Abstract: An apparatus includes a heat-dissipating substrate, a power circuit and a magnetic assembly. The heat-dissipating substrate includes a thermal contact surface. The power circuit includes at least one switch element in contact with the thermal contact surface of the heat-dissipating substrate. The magnetic assembly includes at least one first electrical conductor and a magnetic core module comprising at least one hole, wherein the at least one first electrical conductor passes through the at least one hole, and a terminal of the at least one first electrical conductor is electrically connected to the at least one switch element. The heat-dissipating substrate, the power circuit and the magnetic assembly are arranged in sequence along a same direction. A projection of the power circuit on the thermal contact surface partially overlaps a projection of the magnetic assembly on the thermal contact surface.

Abstract: A magnetic device includes a magnetic core assembly, a first secondary winding, a second secondary winding and a primary winding. The magnetic core assembly includes a first magnetic leg, a second magnetic leg and a third magnetic leg. The first to third magnetic legs are arranged in sequence. The second magnetic leg is disposed between the first magnetic leg and the third magnetic leg. The first secondary winding is disposed between the first magnetic leg and the second magnetic leg, and the second secondary winding is disposed between the second magnetic leg and the third magnetic leg. A first terminal of the primary winding is disposed between the first magnetic leg and the second magnetic leg, and a second terminal of the primary winding is disposed between the second magnetic leg and the third magnetic leg.

Abstract: A voltage regulator module is provided. The voltage regulator module includes a circuit board unit, at least one switch circuit, a magnetic core assembly and at least one first conductive member. The circuit board unit includes a top layer, a plurality of inner layers and a bottom layer. The at least one switch circuit is disposed on the top layer. The magnetic core assembly is disposed on at least one of the plurality of inner layers and embedded in the circuit board unit. The magnetic core assembly forms at least one magnetic loop. The at least one first conductive member is electrically connected with the at least one switch circuit for passing through a current of the at least one switch circuit. The current passes through the at least one magnetic loop to form an inductor.

Abstract: A power module includes a power circuit and a magnetic assembly. The power circuit includes at least one switch element. The magnetic assembly includes at least one first electrical conductor and a magnetic core module comprising at least one hole, wherein the at least one first electrical conductor passes through the at least one hole, and a terminal of the at least one first electrical conductor is electrically connected to the at least one switch element. The power circuit and the magnetic assembly are arranged in sequence along a same direction.

Abstract: A power system includes a power module, an electronic load and a system board. The power module includes a first surface, a second surface, a switch and a plurality of conductive parts, wherein the switch is disposed on the first surface of the power module and the plurality of conductive parts are disposed on the second surface of the power module. The electronic load includes a plurality of conductive parts. The power module and the electronic load are disposed on two opposite sides of the system board, the power module delivers power to the electronic load through the system board, and gaps and networks of the plurality of conductive parts of the power module correspond to those of the plurality of conductive parts of the electronic load.

Abstract: A voltage regulator module is provided. The switch circuit assembly includes two switch circuits and an input capacitor. Respective input terminals of the two switch circuits are connected with each other in parallel. The input capacitor is electrically connected with the respective input terminals of the two switch circuits in parallel and disposed between the two switch circuits. The plurality of conductive members have a first conductive member, a second conductive member and a third conductive member. The first conductive member and the third conductive member are configured to deliver an electric energy. The second conductive member is configured to deliver a signal. One end of each conductive member is electrically connected with corresponding switch circuit, and the other end of the first conductive member and the third conductive member is electrically connected with the load. The switch circuit assembly and the magnetic assembly are stacked with each other.

Abstract: A power conversion circuit includes a first terminal, a second terminal, a first switching conversion unit, a second switching conversion unit, a flying capacitor and a magnetic element. The first switching conversion unit includes a first switch and a third switch. The second switching conversion unit includes a second switch and a fourth switch. The magnetic element includes two first windings and a second winding. A first one of the two first windings is serially connected between the flying capacitor and the second terminal. A second one of the two first windings is serially connected between the second switch and the second terminal. The second winding is serially connected with the flying capacitor and the first one of the two first windings. A turn ratio between the second winding, the first one of the two first windings and the second one of the two first windings is N:1:1.

Abstract: A power system includes a power module, an electronic load and a system board. The power module includes a first surface, a second surface, a switch and a plurality of conductive parts, wherein the switch is disposed on the first surface of the power module and the plurality of conductive parts are disposed on the second surface of the power module. The electronic load includes a plurality of conductive parts. The power module and the electronic load are disposed on two opposite sides of the system board, the power module delivers power to the electronic load through the system board, and gaps and networks of the plurality of conductive parts of the power module correspond to those of the plurality of conductive parts of the electronic load.