Abstract: A circuit unit having a circuit unit comprising an insulating substrate (1) on which a conductive, flat coil (3) is located. The coil (3) can consist of a plurality of coil layers (9, 17) separated by insulating layers (11). To inter-connect the individual coil layer section (9, 17) into a coil, at least one opening (13) is provided in each of the insulating layers (11). The connection between the first coil ends (15, 19) of the coil (3) and an integrated circuit (7) or a module (23) containing the integrated circuit (7) can be formed solely by the coil ends (15, 19) and the connection points (27) of the integrated circuit (7) or the contacts (25) of the module (23) touching. The individual turns of the coil (3) can be disposed and dimensioned so as to permit embossing of the circuit unit without restriction within an area (37, 38) conforming with the standard.

Abstract: The invention relates to different methods for distortion-free production of data carriers having at least in partial areas a transparent plastic layer with a surface structure in the form of a lens structure. The surface structure can be produced by cutting method or embossed by applying heat and pressure. Alternatively the surface structure can be produced as a separate element which is connected after its production with the data carrier.

Abstract: The invention relates to different methods for distortion-free production of data carriers having at least in partial areas a transparent plastic layer with a surface structure in the form of a lens structure. The surface structure can be produced by cutting methods or embossed by applying heat and pressure. Alternatively the surface structure can be produced as a separate element which is connected after its production with the data carrier.

Abstract: The invention relates to a card-shaped data carrier comprising a card body (1) having an antenna (3), and a chip module (2) containing an integrated circuit (10) and inserted into a gap (5) in the card body (1). The electric connection between the antenna (3) and the chip module (2) is effected via depressions (11) in the terminals (4) of the antenna (3). For producing the inventive data carrier one provides the card body (1), in which the antenna (3) is at least partly embedded, with a gap (5). The terminals (4) of the antenna (3) are exposed by removing the superjacent card material whereby part of the material forming the terminals (4) is also removed. The chip module (2) is inserted into the gap (5) and for example glued to the card body (1) with a thermally activable adhesive (6), an electric connection being formed between the chip module (2) and the antenna (3) for example by means of a conductive adhesive (7) previously applied to the exposed terminals (4) of the antenna (3).

Abstract: A circuit unit having an insulating substrate (1) on which a conductive, flat coil (3) is located. The coil (3) can consist of a plurality of coil layer sections (9, 17) separated by insulating layers (11). To interconnect the individual coil layer sections (9, 17) into a coil, at least one opening (13) is provided in each of the insulating layers (11). The connection between the first coil ends (15, 19) of the coil (3) and an integrated circuit (7) or a module (23) containing the integrated circuit (7) can be formed solely by the coil ends (15, 19) and the connection points (27) of the integrated circuit (7) or the contacts (25) of the module (23) touching. The individual turns of the coil (3) can be disposed and dimensioned so as to permit embossing of the circuit unit without restriction within an area (37, 38) conforming with the standard.

Abstract: An electronic module for data carriers having at least one integrated circuit includes an electrically conductive layer with contact surfaces for communication of the circuit with external devices and having an insulated layer which is connected to the conductive layer and has recesses for electrically connecting the contact surfaces with the circuit. Each recess protrudes partly into the contact surface adjacent the recess. The recesses may be formed in such a way that the area of insulating layer remaining in the center of the module takes up substantially only the integrated circuit surface.

Abstract: A data carrier is shown having at least two integrated circuits disposed one on the other in the carrier in a partial area, at least one of the circuits being able to communicate with external devices via coupling elements. To make communication between the integrated circuits as simple as possible, the integrated circuits have communication units permitting communication between the circuits via a nongalvanic, contactless coupling.

Abstract: A data carrier in which an electronic module comprising an integrated circuit and a coil electrically connected with the circuit is disposed in a channel in the data carrier. To permit simple manufacture of the data carrier, at least one opening for forming the channel is provided in at least one card layer, the opening being formed such that the layer is a cohesive layer.

Abstract: A method for making integrated circuits electrically connected to conductive coil elements includes placing integrated circuits in recesses provided at precise locations along a foil carrier web and positioning coils also at designated locations on the foil web so that a coil is associated with each integrated circuit. The web is then cut to produce a planar coil electrically connected to an integrated circuit on a foil element. The integrated circuit and coils may be coated with a casting compound and the coils may be formed using various procedures, including pressing coils into the surface of the foil, sewing the coils to the foil and electrostatically forming the coils on the foil with fusion of the coil material directly onto the foil. Apparatus for carrying out the aforesaid process, including winding of the coils, is described.

Abstract: The invention relates to a data carrier comprising a card body and an integrated circuit connected electroconductively via contact elements with at least one coil serving the purpose of power supply and/or data exchange of the integrated circuit with external devices. The invention is characterized in that the integrated circuit and the contact elements form a separate module known in the art and the coil is disposed on a card body constructed from one or more layers in known fashion. The coil is preferably formed as a flat coil.

Abstract: In a multilayer data carrier, an electronic module is provided in a corresponding opening or gap in at least one layer. For filling the remaining cavity after installation of the module in the gap, one provides on a layer adjacent the gap or on the layer containing the gap or directly on the electronic module a material preferably applied by printing technology and having a softening point lower than the softening point of the layer.

Abstract: A lead frame module to be incorporated in data carriers is presented which is divided into two areas, namely a central area receiving the sensitive components of the module, and an outer area protruding beyond the edge of the central area and serving to glue the lead frame module to the data carrier. To prevent forces from being transmitted from the outer area of the electronic module to the central area upon bending loads of the data carrier, the outer area is decoupled mechanically from the central area. This can be done for example by providing partial discontinuities including relieving punchings in the transition between the central and outer area.

Abstract: A method of making an electronic module with an integrated circuit includes beginning with a standardized starting product in the form of an insulating substance bearing a conductive coating. Contact surfaces are formed in the conductive coating by interruptions in the insulating substance. Using milling cutter one provides the insulating layer of the starting product with variable patterns of recesses through which conductive connections between the contact surfaces and the integrated circuit are later guided. The position of the recesses is varied in accordance with the size of the integrated circuit to be incorporated in the electronic module.

Abstract: The invention relates to a method for producing data carriers containing a positioned element on at least one of their surfaces from a multiple-copy sheet. As many method steps as possible are performed on the multiple-copy sheet which is subdivided, before the elements are positioned in the data carriers, into smaller units having positioning markings as position references. Using these markings the small units are brought in an exact position relative to various working stations, where several data carriers in the units are provided with a positioned element simultaneously.

Abstract: An apparatus and method for producing plastic chip cards and chip card blanks with a wall thickness considerably reduced in certain areas involves first injecting the plastic material into an initial mold space that has no reductions in wall thickness as yet. The distance between certain wall areas of the initial mold space is then reduced to the required reduced measure, displacing the plastic material into adjacent areas of the mold space.

Abstract: On a check card having a mini chip card disposed detachably in an adapted recess the mini chip card is fixed in position by at least one fastening element provided on the card surface. After a first punching operation in which the mini chip card is still connected with the card body by bridges the fastening element is preferably placed on the card in such a way that it bridges the areas between the mini chip card and the card body. In a second punching operation the bridges are removed, after which the mini chip card is held in its original position on the card body only by the fastening element.

Abstract: A method for producing a mini chip card out of a standard card having an embedded semiconductor chip uses a punching die with cutting edges defining the outer contour of the mini chip card. The punching die is adjusted relative to the standard card and with respect to contact surfaces of the embedded semiconductor chip so that the edges of the punching die are at a predetermined distance from the contact surfaces. The punching of the standard card is performed in this adjusted position so that the contact surfaces are in a reference position with respect to the outer contour of the mini chip card. The punching forms the mini chip card in the correct position in the standard card. The mini chip card may initially remain connected to the standard card by thin bars between the cards.

Abstract: The invention relates to a method and an apparatus for applying flat punched elements in the desired position to the surface of a carrier material, the elements being present in multiple copies on a sheet. The multiple copies are fed to an applying device and positioned therein. At the same time as individual elements are separated out or punched, these elements are fixed in position with respect to the carrier material.

Abstract: A check card has an embedded semiconductor chip and contact surfaces for communication and power supply. The position of the contact surfaces relative to at least three reference points (B) on the outer edges of the card is precisely defined or standardized within certain tolerances. The check card is connected with a standard card of greater surface area via at least two easily severable bar areas (30, 32) distributed on the periphery of the check card and not located in the area of the reference points.

Abstract: A process for manufacturing a carrier element is described that has one or more ICs to be incorporated into an identity card or credit card. The carrier element comprises a substrate having on its surface a plurality of contact areas which are connected via connector paths to corresponding terminals of the IC disposed on the substrate. The IC, including the connections to the conductor paths, is protected from mechanical stresses by a cured casting compound. In order to prevent the casting compound from flowing off uncontrollably during its application, an opening is provided in the heat-set adhesive layer applied to one side of the substrate, said opening holding back the liquid resin during its application and acting as a limiting frame. The opening in the adhesive layer is located at least where the IC is to be disposed.