Abstract: The invention relates to a method and an apparatus for applying flat punched elements in the desired position to the surface of a carrier material, the elements being present in multiple copies on a sheet. The multiple copies are fed to an applying device and positioned therein. At the same time as individual elements are separated out or punched, these elements are fixed in position with respect to the carrier material.

Abstract: An integrated circuit includes electrically conductive terminals arranged to be connected to external leads for communication between the leads and the circuitry of the integrated circuit device. The terminals of the circuit device are disposed at a surface away from the perimeter of the integrated circuit device so that the terminals are arranged in a specified area that is small compared to the overall area of the integrated circuit device, preferably in the center of a surface of the integrated circuit device.

Abstract: A carrier element is described that has one or more ICs to be incorporated into an identity card or credit card. The carrier element comprises a substrate having on its surface a plurality of contact areas which are connected via connector paths to corresponding terminals of the IC disposed on the substrate. The IC, including the connections to the conductor paths, is protected from mechanical stresses by a cured casting compound. In order to prevent the casting compound from flowing off uncontrollably during its application, an opening is provided in the heat-set adhesive layer applied to one side of the substrate, said opening holding back the liquid resin during its application and acting as a limiting frame. The opening in the adhesive layer is located at least where the IC is to be disposed.

Abstract: A method of making a laminated multi-layer data carrier includes laminating a core layer, an intermediate substrate carrying an IC module, electrical contact pads, and electrical leads connecting the IC module to the contact pads, and a cover layer having contact apertures therein together under heat and pressure so that the IC module is pressed into the core layer and protected within the central core of the carrier while the contact pads are pressed outwardly into the apertures of the cover layer so that the contact pads are flush with the surface of the cover layer. Alternative embodiments are described wherein the core layer supports the contact pads in the apertures of the cover layer and where the laminating process is carried out such that the substrate is anchored between the core and cover layers.

Abstract: The present invention relates to a data carrier having an integrated circuit and to a method for making the same. During production a carrier element equipped with an integrated circuit and contact surfaces is inserted into a recess in the data carrier blank. To allow for the carrier element to be fixed in the recess, said element is underlaid with a melt adhesive film. To protect the integrated circuit from mechanical stresses, a film strip made of a material with high elastic deformability is provided additionally between the circuit and the melt adhesive film.

Abstract: A carrier element suitable for production in large numbers, e.g. for incorporation in identification cards, having an integrated circuit and the connection leads and contacts necessary for the operation of the circuit. The carrier consists of a single or multilayer insulating material, e.g. a film, carrying the circuit contacted with the connection leads in punched out windows. To protect the circuit from mechanical stress the thickness of the film is greater than or at least equal to the thickness of the integrated circuit plus the thickness of the contacted connection leads.

Abstract: A carrier element for an IC-module for incorporation into an identification card. The element includes a flexible carrier film supporting conductive leads and contact pads. A semi-conductor chip is electrically connected to the leads and pads. Cast resin surrounds the chip and carrier film, including the carrier pads, to form a solid carrier element capable of resisting mechanical stresses.

Abstract: A multilayer data carrier into which a carrier element supporting an IC module is incorporated comprises a flexible substrate on which contact surfaces are formed which are connected to the IC module via leads. The carrier element is deformed in such a way, when being incorporated into the data carrier, that the IC module, in the finished data carrier, is located in the center of the card protected by cover layers of the card and the contact surfaces are flush with the surface of the card. A method for producing the data carrier comprises laminating a substrate layer carrying an IC-module with its leads and contact pad surfaces on one surface thereof between outer protective layers and with a central core layer such that the IC-module is disposed centrally within the data carrier with the contact surfaces disposed in apertures in one of the outer protective layers flush with the surface of said one layer.

Abstract: The multilayer identification card comprises several synthetic layers compounded by the effects of heat and pressure. An inside interface of at least one of these layers exhibits depressions which are filled with the material of the adjacent layer during the laminating process. The adjacent layers are selected in such a way that they are of different transparency. Thus a light and shadow effect is produced in incident light which is reversed in transmitted light.

Abstract: A carrier element for an IC-module for incorporation into an identification card. The element includes a flexible carrier film supporting conductive leads and contact pads. A semi-conductor chip is electrically connected to the leads and pads. Cast resin surrounds the chip and carrier film, including the carrier pads, to form a solid carrier element capable of resisting mechanical stresses.

Abstract: The integrated circuit embedded in a data carrier and the contact surfaces connected with this circuit are to be protected against bending of the data carrier. For this purpose, the data carrier is divided into two areas, the first one, which bears the circuit and is generally small compared to the second area, being connected to the second area via a predetermined breaking point. Stress which occurs when the data carrier is bent is kept away from the circuit, or transmitted only weakly to it, by the predetermined breaking point.

Abstract: An identification card equipped with an integrated circuit, in which the circuit along with its connection leads is arranged on a carrier element which is embeddedly enclosed by the card on all sides by use of the hot lamination technique. In order to protect the sensitive arrangement, the carrier element is subjected to the full laminating pressure only when one or more layers in the card construction have softened.This is achieved, for example, by providing buffer zones in the card laminate at least in the area of the arrangement in the form of cavities or layers that are easy to deform elastically. The buffer zones protect the arrangement from local pressure peaks in the initial phase of the laminating process. It is also possible to control the laminating pressure as a function of the temperature or the degree of softening of the card layers.

Abstract: A carrier element for an IC module for incorporation into data carriers, in which the IC module is connectd with contact surfaces by means of leads, and the contact surfaces are designed for direct contacting.In order to protect the Integrated Circuit against destruction due to static charges, measures are provided to dissipate outside the circuit any portions of charge that may occur. In one embodiment, all terminals of the circuit have a low resistance connection with each other. The connection is suspended during each operational phase and is then restored. In a further embodiment, the terminals are bridged by spark gaps. This protective step is advantageous in that it is not necessary to remove and then restore the bridging.

Abstract: A multilayer identification card is equipped with an IC module. The module is arranged on a carrier element which is located in a recess in the multilayer card. The card layers bordering the recess bear supporting layers which are thermoresistant in the range of hot lamination temperatures. This prevents the recess from becoming filled with fluid card material during the hot laminating process, during which the card layers will soften and eventually become fluid. Thus, the IC module can advantageously give way within the recess when the card is bent. Further, the supporting layers have a stabilizing effect on the adjacent card layers and thereby prevent irregularities caused by incorporation of the carrier element from being passed onto the card surface.

Abstract: An identification card having an IC module for the processing of electrical signals. The IC module (9) and the leads (6) and contact surfaces (5, 20) necessary for the operation of the module are attached to a separate carrier (7, 17) and embedded in the identification card in such a way that the IC module is located in an area (4) of the card having the maximally permitted thickness, whereas the contact surfaces are arranged outside this area. The placement of the IC module in the elevated card area (e.g. the impressing area) allows for a thicker encapsulation of the module and correspondingly better protection against mechanical stress. On the other hand, the area of the carrier element with the contact surfaces is arranged outside the elevated area of the card, for example in the magnetic stripe area (2).

Abstract: An identification card having an embedded IC module which is protected against external electric fields and electrostatic charges by means of measures of card technology or measures applied to the IC module itself. The IC module, along with the coupling means necessary for the operation of the module, is completely encased in an electrically conductive layer. The electrically conductive casings can be provided in the form of layers in the construction of the card, or on the IC module itself. The conductive casing according to the invention is well-suited both for opto-electronic and for galvanic data transmission.

Abstract: A multilayer identification card is equipped with an IC module. The module is arranged on a carrier element which is located in a recess in the multilayer card. The card layers bordering the recess bear supporting layers which are thermoresistant in the range of hot laminating temperatures. This prevents the recess from becomming filled up with fluid card material during the hot laminating process, during which the card layers will soften and eventually become fluid. Thus, the IC module can advantageously give way within the recess when the card is bent. Further, the supporting layers have a stabilizing effect on the adjacent card layers and thereby prevent irregularities caused by incorporation of the carrier element from being passed onto the card surface.

Abstract: An identification card having an IC module for the processing of electrical signals. The IC module (9) and the leads (6) and contact surfaces (5,20) necessary for the operation of the module are attached to a separate carrier (7,17) and embedded in the identification card in such a way that the IC module is located in an area (4) of the card having the maximally permitted thickness, whereas the contact surfaces are arranged outside this area. The placement of the IC module in the elevated card area (e.g. the impressing area) allows for a thicker encapsulation of the module and correspondingly better protection against mechanical stress. On the other hand, the area of the carrier element with the contact surfaces is arranged outside the elevated area of the card, for example in the magnetic stripe area (2).

Abstract: A carrier element for IC modules, whereby several leads are arranged on a carrier film, which leads are each connected at one end with a terminal of the module and run into a contact surface at the other end. Whereas the contact surfaces are arranged on the side of the film not touching the module within the periphery of the module, the outer leads are connected with the corresponding terminals of the module through punched out windows in the film. The carrier element thus has a very compact form, the area of which is adapted to the size of the IC module.

Abstract: Disclosed is a multilayer identification card with a transparent protective cover film made of plastic. The film is provided with a steel gravure print relief and affixed by cold adhesion to the basic unit of the identification card so that the steel gravure print remains manually fixable.