Abstract: The present invention provides an end-side heat extraction light emitting diode or LED lamp. The LED lamp includes a lamp housing, a cooling module, and an LED lighting set. The cooling module is configured inside the housing space of the lamp housing, having a cooling fan and a cooling base. The LED lighting set is configured on the LED joint surface of the cooling base. The end-side heat extraction LED lamp also includes a circular frame and an end-side heat extraction airflow guidance passage. The circular frame forms a space extending and expanding to the end side. The end-side heat extraction airflow guidance passage forms an airflow guidance space extending and expanding to the end side, forming a heat radiating path where the heat extraction airflow generated by the running cooling fan of the LED lamp can be exhausted from the light projection end of the lamp housing.

Abstract: A system architecture for implementing a virtual disk service (VDS) equipment is applicable for implementing an overall management on multiple service request objects in a VDS system. The system architecture includes a VDS interface, a subsystem management module, an object management module, a virtual disk management module, and a specific management module. The VDS interface receives a service request, and renders the service request to the subsystem management module for judging a type of the service request. The virtual disk management module generates a plurality of virtual interfaces for being invoked by the subsystem management module, so as to execute the service request of a public operation type. When the service request requires for supporting an asynchronous processing, the specific management module is further invoked to process the service request, and generates a feedback result to respond the service request via the VDS interface.

Abstract: An output buffer circuit is provided. The output buffer circuit receives a control signal (OE) and a data signal (Dout) from a first core circuit (10) and operates in a transmitting mode according to the control signal. The output buffer circuit converts the data signal into an output signal at a first voltage level or a ground voltage level according to the data signal logic level and a supply voltage (VDDIO). The supply voltage is adjusted to pull up or pull down the first voltage level of the output signal.

Abstract: Methods and apparatus for negotiating bearer control parameters using property sets. A property set is a specific set of default parameters or “properties” to be used for a given bearer channel type in an integrated node. Property set information can be passed between integrated nodes (301, 302) in a multimedia packet network (305). In many cases, a parameter negotiation can be completed quickly after the originating node sends a setup message including a list of one or more property sets and one or more requested parameters. In all cases, the bearer type and bearer parameters are determined based on capabilities of the originating and terminating nodes. The invention provides a way for existing signaling links using bearer independent call control (BICC), or session initiation protocol (SIP), or H.245, or similar protocols with a way to negotiate more bearer types and parameters without significantly increasing the bandwidth needed for the negotiation, or requiring nodes to be provisioned.

Abstract: An input output device coupled between a core circuit and a pad and including an output cell, an input cell, and a pre-driver. The output cell includes an output stage and a voltage level converter. The output stage includes a first transistor and a second transistor connected to the first transistor in serial between a first supply voltage and a second voltage. The voltage level converter generates a first gate voltage to the first transistor according to the first voltage and a data signal. When the first supply voltage is increased, the first gate voltage is increased. When the data signal is at a high level, the first transistor is turned on. The input cell includes a pull unit and a first N-type transistor. The pre-driver turns off the first and the second transistors.

Abstract: An output buffer circuit is provided. The output buffer circuit receives a control signal (OE) and a data signal (Dout) from a first core circuit (10) and operates in a transmitting mode according to the control signal. The output buffer circuit converts the data signal into an output signal at a first voltage level or a ground voltage level according to the data signal logic level and a supply voltage (VDDIO). The supply voltage is adjusted to pull up or pull down the first voltage level of the output signal.

Abstract: The present invention provides an end-side heat extraction light emitting diode or LED lamp. The LED lamp includes a lamp housing, a cooling module, and an LED lighting set. The cooling module is configured inside the housing space of the lamp housing, having a cooling fan and a cooling base. The LED lighting set is configured on the LED joint surface of the cooling base. The end-side heat extraction LED lamp also includes a circular frame and an end-side heat extraction airflow guidance passage. The circular frame forms a space extending and expanding to the end side. The end-side heat extraction airflow guidance passage forms an airflow guidance space extending and expanding to the end side, forming a heat radiating path where the heat extraction airflow generated by the running cooling fan of the LED lamp can be exhausted from the light projection end of the lamp housing.

Abstract: A system architecture for implementing a virtual disk service (VDS) equipment is applicable for implementing an overall management on multiple service request objects in a VDS system. The system architecture includes a VDS interface, a subsystem management module, an object management module, a virtual disk management module, and a specific management module. The VDS interface receives a service request, and renders the service request to the subsystem management module for judging a type of the service request. The virtual disk management module generates a plurality of virtual interfaces for being invoked by the subsystem management module, so as to execute the service request of a public operation type. When the service request requires for supporting an asynchronous processing, the specific management module is further invoked to process the service request, and generates a feedback result to respond the service request via the VDS interface.

Abstract: A procedure for accomplishing surveillance within a managed VoP network when end-user encryption/decryption and NAT are in place. The procedure comprises first analyzing the network from call signaling and message standpoints, leading to the identification of suitable surveillance access points (SAPs) for packet interception. A Delivery Function (DF) facilitated by the network service provider provides the means to intercept (without alteration) and replicate packets transmitted across the SAPs. The packets are then transmitted via the DF for collection within a Collection Function (CF), which is managed by a Law Enforcement Agency (LEA), for analysis by the LEA. This analysis provides, among other benefits, the opportunity to decrypt the intercepted packets and to identify additional suitable SAPs. In demonstrating the procedure, several embodiments of network surveillance models are described. Each one identifies the location of SAPs for that model.

Abstract: An output buffer circuit is provided. The output buffer circuit receives a control signal (OE) and a data signal (Dout) from a first core circuit (10) and operates in a transmitting mode according to the control signal. The output buffer circuit converts the data signal into an output signal at a first voltage level or a ground voltage level according to the data signal logic level and a supply voltage (VDDIO). The supply voltage is adjusted to pull up or pull down the first voltage level of the output signal.

Abstract: The heat pipe structure includes a pipe body, hollow groove and capillary tissue. The pipe body contains a heat-conducting end and a radiating end. The capillary tissue of a predefined thickness is adapted to an inner wall of the pipe body. The inner surface of capillary tissue is located correspondingly to the section of the heat-conducting end, where a portion with greater thickness is shaped from another section of the capillary tissue. The portion is of single side, a plurality of sides or annular structure. Thus, the heat conduction efficiency of the heat-conducting end greatly improves. The non heat-conducting sections of the capillary tissue remain still with respect to thickness, and the guide space expands to facilitate guiding of gaseous working fluid to the radiating end, thus achieving an optimum heat radiation effect.

Abstract: An input output device coupled between a core circuit and a pad and including an output cell, an input cell, and a pre-driver. The output cell includes an output stage and a voltage level converter. The output stage includes a first transistor and a second transistor connected to the first transistor in serial between a first supply voltage and a second voltage. The voltage level converter generates a first gate voltage to the first transistor according to the first voltage and a data signal. When the first supply voltage is increased, the first gate voltage is increased. When the data signal is at a high level, the first transistor is turned on. The input cell includes a pull unit and a first N-type transistor. The pre-driver turns off the first and the second transistors.

Abstract: The panel-type heat sink module combines the heat-conducting panel, fin heat sink, diversion tank, fan and heat pipe into a single module. There is a heat-conducting surface and an assembly surface of the heat-conducting panel. The fin heat sink is assembled onto the assembly surface. The diversion tank is adapted onto the assembly surface and located nearby the fin heat sink. The diversion tank includes a fan container and a diversion channel. The fan is assembled into the fan container, and the heat pipe is assembled between the assembly surface and the fin heat sink. The heat pipe penetrates through the diversion tank; thus, the heat sources guided by the heat-conducting panel will be uniformly guided into the fin heat sink and diversion tank via the heat pipe. An air stream generated by the fan flows towards the fin heat sink, improving heat-radiation, and reducing assembly space.

Abstract: The present invention is directed to methods and compositions for augmenting treatment of cancers and other proliferative disorders. In particular embodiments, the invention combines the administration of an agent that inhibits the anti-apoptotic activity of galectin-3 (e.g., a “galectin-3 inhibitor”) so as to potentiate the toxicity of a chemotherapeutic agent. In certain preferred embodiments, the conjoint therapies of the present invention can be used to improve the efficacy of those chemotherapeutic agents whose cytotoxicity is influenced by the status of an anti-apoptotic Bcl-2 protein for the treated cell. For instance, galectin-3 inhibitors can be administered in combination with a chemotherapeutic agent that interferes with DNA replication fidelity or cell-cycle progression of cells undergoing unwanted proliferation.

Abstract: A method for forming a shallow trench isolation (STI) structure with improved electrical isolation performance including providing a semiconductor substrate including an overlying silicon oxide layer on the semiconductor substrate and a hardmask layer on the silicon oxide layer; dry etching in a first etching process to form a patterned hardmask opening for etching an STI opening; dry etching in a second etching process the semiconductor substrate to form an upper portion of an STI opening to form a polymer layer along sidewall portions of the STI opening; and, dry etching in a third etching process the STI opening to form rounded bottom corners and rounded top corners.

Abstract: The heat conductor with a micro detection element and a testing method thereof. The method includes injecting the micro detection element into the heat conductor after completion of vacuum pumping for the heat conductor. The micro detection element generally refers to inert gases of lighter atomic weight, such as helium and argon, etc. Next, the heat conductor is sealed. Secondly, a detector is used to detect if there is any leakage of micro detection element from exterior of heat conductor. The invention makes possible speeding up the test process and quickly identifying the vacuum state of heat conductor for a higher availability.

Abstract: The sealing method and construction of the sealing end for a heat conductor includes a heat conductor for vacuum pumping and sealing placed within an enclosed operating space, wherein an open end is preset for the heat conductor. Next, vacuum pumping is performed for entire enclosed operating space, thereby finishing the vacuum pumping procedure of heat pipe. Then, the open end of heat pipe is welded by fusing within enclosed operating space, wherein the sealing end of heat conductor forms a welded close end. A compression procedure can be neglected, thereby saving more manufacturing cost and offering a higher structural strength for the sealing part.

Abstract: The present invention is directed to methods and compositions for treatment of hyperproliferative diseases. The composition of the invention comprises a carbohydrate having a backbone comprising polygalacturonan and a ligand of peripheral benzodiazepine receptor. The present compositions and methods are used to treat various cancers and other diseases where cells undergo pathological and unwanted proliferation.

Abstract: A method for forming a shallow trench isolation (STI) structure with improved electrical isolation performance including providing a semiconductor substrate including an overlying silicon oxide layer on the semiconductor substrate and a hardmask layer on the silicon oxide layer; dry etching in a first etching process to form a patterned hardmask opening for etching an STI opening; dry etching in a second etching process the semiconductor substrate to form an upper portion of an STI opening to form a polymer layer along sidewall portions of the STI opening; and, dry etching in a third etching process the STI opening to form rounded bottom corners and rounded top corners.

Abstract: The present invention is directed to methods and compositions for treatment of neurodegenerative diseases. In particular embodiments, the invention is directed to the treatment of Alzheimer's disease, MS, ALS, Huntington's Disease. In other embodiments, the invention is directed to the treatment of multiple sclerosis.