Abstract: A temperature-sensitive hydrogel material combination, a preparation method thereof, and use thereof are provided. The temperature-sensitive gel material combination provided by the present invention includes an SDF-1-loaded chitosan-hyaluronic acid solution and an Apt19S-loaded chitosan-hyaluronic acid solution. The present invention aims to develop a temperature-sensitive injectable double-layer hydrogel loaded with biological factors capable of promoting cell migration, which is used for promoting the regeneration of periodontal tissues.

Abstract: Embodiments of the present invention relate to methods, systems, and computer program products for file management in a distributed file cache system. In some embodiments, a method is disclosed. According to the method, responsive to determining that at least one client node is obtaining a file of a first version stored at a storage node, one or more processors generate contact information indicating that the file of the first version is accessible from the storage node and the at least one client node and recorded the contact information into a distributed hash table. The storage node and the at least one client node are included in a plurality of nodes associated with the distributed hash table. Further, one or more processors generate first version information indicating that the file is of the first version and record the first version information into a blockchain associated with the plurality of nodes.

Abstract: A fingerprint recognition device including a light emitting layer, an image sensing layer and a micro-lens layer is provided. The image sensing layer has a plurality of pixels. The micro-lens layer is disposed between the light emitting layer and the image sensing layer and has a plurality of micro lenses respectively corresponding to the pixels. A distance between the micro-lens layer and the light emitting layer is less than or equal to 800 um and greater than or equal to h1, where h1=(x/2×tan ?), x is the minimum distance between two micro lenses respectively corresponding to different pixels on a plane where the micro-lens layer is disposed, and ? is an FWHM light receiving angle of each of the micro lenses.

Abstract: A biometric identification device is provided. Photosensitive devices are disposed on the substrate. The first dielectric layer is disposed on the photosensitive devices. The first light-shielding parts are disposed on the first dielectric layer. Each of the first light-shielding parts has a first light-transmitting area and a first light-shielding area surrounding the first light-transmitting area. The first light-transmitting area corresponds to and overlaps with the photosensitive device, and at least two of the first light-shielding parts are spaced apart by a spacer area. The second dielectric layer is disposed on the first light-shielding parts. The second light-shielding part is disposed on the second dielectric layer. An orthogonal projection of at least a part of the spacer area on the substrate is within an orthogonal projection of a second light-shielding area on the substrate.

Abstract: The present invention provides a human CD16+ natural killer cell line and a CAR-expressing human CD16+ natural killer cell line. These human CD16+ natural killer cell line and a CAR-expressing human CD16+ natural killer cell line does not include synthetic, genetically modified or purposely deliberately delivered polynucleotide encoding the CD16 receptor and are non-tumorigenic cell lines. Therefore, this human CD16+ natural killer cell line and a CAR-expressing human CD16+ natural killer cell line might provide considerable long-term safety for disease treatment.

Abstract: A control method and a time aware bridge device for a seamless Precision Time Protocol (PTP) are provided. The control method includes: utilizing the time aware bridge device to pre-configure a first control signal source as a master control signal source, and pre-configure a second control signal source as a backup control signal source; utilizing the time aware bridge device to determine whether one or more packets from the master control signal source conform to at least one predetermined rule to generate a determination result; and selectively configuring the second control signal source as the master control signal source according to the determination result.

Abstract: A consumer product composed of ?1% of a High-Performance fragrance composition and a consumer product active is provided. Use of reduced levels of the High-Performance fragrance composition provides for improved aesthetics such as improved clarity and viscosity, and reduced discoloration and caking.

Abstract: The present invention discloses an application of an endophytic fungi FO-R20 in prevention and treatment of rice neck or panicle blast, and belongs to the technical filed of microbial applications. The Falciphora oryzae FO-R20 with a deposit number of CCTCC M 2021505 is prepared into a seed coating agent or solid fungal fertilizer and applied to rice seeds; and in the culture process, the strain is colonized at the roots of rice, thus the disease resistance of rice to neck or panicle blast is remarkably enhanced, the prevention and treatment efficiency reaches 86.91%-90.85%, and the disease index is reduced by 64.92-72.07. The biological prevention and treatment effect of the endophytic fungi Falciphora oryzae FO-R20 against rice neck or panicle blast has great value by promotion and applications thereof in the field of agriculture.

Abstract: The present invention discloses a method for improving cadmium tolerance in rice and reducing cadmium content in rice grains, and belongs to the technical field of microbial applications. In the present invention, an endophytic fungi Falciphora oryzae FO-R20 with a deposit number of CCTCC M 2021505 is subjected to seedling co-raising with rice in a fungal fertilizer form, the endophytic fungi Falciphora oryzae FO-R20 is colonized in the root tissue of rice, and then the rice seedlings are transplanted to a field until harvest. Therefore, the tolerance of rice to cadmium is improved, the content of heavy metal cadmium in the grains of rice is reduced by 12.61%.

Abstract: A semiconductor device includes a semiconductor substrate having a well region and a gate structure formed over the well region of the semiconductor substrate. The semiconductor device also includes a gate spacer structure having a first spacer portion and a second spacer portion on opposite sidewalls of the gate structure. The semiconductor device also includes a source region and a drain region formed in the semiconductor substrate. The source region and a drain region are separated from the gate structure. The source region is adjacent to the first spacer portion of the gate spacer structure, and the drain region is adjacent to the second spacer portion of the gate spacer structure. The bottom width of the second spacer portion is greater than the bottom width of the first spacer portion.

Abstract: The present invention discloses an endophytic fungus FO-R20 and applications thereof, and belongs to the technical filed of microbial applications. The deposit number of the endophytic fungus FO-R20 is CCTCC M 2021505, and the scientific name thereof is Falciphora oryzae. The present invention provides a novel endophytic fungal strain in the genus Phialophora. Colonization of the endophytic fungus FO-R20 in the root tissues of rice can significantly improve the quality of rice seedlings and enhance the rice yields. The remarkable effect of symbiosis and interactions of the endophytic fungus FO-R20 on rice has huge value in the agricultural field by application and popularization thereof.

Abstract: A photosensitive device includes a first substrate, a second substrate, a supporting structure, multiple first microlenses, multiple second microlenses, a first photosensitive element, a second photosensitive element, and a collimating structure. The second substrate is opposite to the first substrate, and there is a gap between the first substrate and the second substrate. The supporting structure is located in the gap between the first substrate and the second substrate. The first microlenses and the second microlenses are respectively disposed on a first side and a second side of the gap. The first photosensitive element is overlapping with one of the first microlenses and one of the second microlenses. The second photosensitive element is overlapping with another one of the second microlenses. The collimating structure is located between the first substrate and the first microlenses.

Abstract: A fingerprint recognition device including a light emitting layer, an image sensing layer and a micro-lens layer is provided. The image sensing layer has a plurality of pixels. The micro-lens layer is disposed between the light emitting layer and the image sensing layer and has a plurality of micro lenses respectively corresponding to the pixels. A distance between the micro-lens layer and the light emitting layer is less than or equal to 800 um and greater than or equal to h1, where h1=x/(2×tan ?), x is the minimum distance between two micro lenses respectively corresponding to different pixels on a plane where the micro-lens layer is disposed, and ? is an FWHM light receiving angle of each of the micro lenses.

Abstract: The present invention discloses an endophytic fungal strain Pseudophialophora sp. P-B313 and an application thereof, and belongs to the technical filed of microbial applications. The deposit number of the endophytic fungal strain P-B313 is CCTCC M 2021504, and the scientific name thereof is Pseudophialophora sp. The endophytic fungal strain P-B313 can enhance the resistance of rice against seedling leaf blast with a control efficiency of 87.56% and a disease index reduced by 62.59. The biological control efficiency of the endophytic fungus P-B313 against seedling leaf blast in rice has great value by promotion and applications thereof in the field of agriculture.

Abstract: The present invention discloses an endophytic fungal strain Magnaporthaceae sp. M-B927 and an application thereof, and belongs to the technical filed of microbial applications. The deposit number of the endophytic fungal strain M-B927 is CCTCC M 2021503, and the scientific name thereof is Magnaporthaceae sp. The endophytic fungal strain M-B927 can enhance the resistance of rice against seedling leaf blast with a control efficiency of 73.06% and a disease index reduced by 52.22. Popularization and application of the biological control efficiency of the endophytic fungus M-B927 against seedling leaf blast in rice has great potential in the field of agriculture.

Abstract: Disclosed is preparation of a cocktail as a therapeutic agent for cow mastitis and use thereof. A compatibility of phages against the main pathogenic bacteria of cow mastitis is utilized in combination with a specific preparation method to prepare and obtain a therapeutic cocktail preparation. The therapeutic phage cocktail preparation for cow mastitis provided in the disclosure is easy to prepare, short in course of treatment and quick in effect. It has better therapeutic effect on both clinical cow mastitis and recessive mastitis than that of antibiotics and antimicrobial peptide and is expected to solve the problem of bacterial resistance in the treatment of cow mastitis, thereby reducing or getting rid of the troubles of diseases such as mastitis in cows, which is of potential development value in cow farming.

Abstract: A semiconductor package includes a substrate, a first insulation layer, a conductive via and a conductive trace. The substrate includes a conductive component. The first insulation layer is formed on the substrate and having a first through hole exposing the conductive component. The conductive via is formed within the first through hole. The conductive trace is directly connected to the conductive via which is located directly above the first through hole.

Abstract: A semiconductor package includes a substrate, a first insulation layer, a conductive pad, a second insulation layer and a conductive trace. The first insulation layer is formed on the substrate and having a first through hole. The conductive pad is formed on the substrate through the first through hole. The second insulation layer has a first surface and a second through hole, wherein the second through hole extends to the conductive pad from the first surface. The conductive trace has a second surface and is connected to the conductive pad through the second through hole. The entire of the first surface is in the same level, and the entire of the second surface is in the same level.

Abstract: A semiconductor device includes a semiconductor substrate having a well region and a gate structure formed over the well region of the semiconductor substrate. The gate structure has a first sidewall and a second sidewall. The second sidewall is opposite the first sidewall. The semiconductor device also includes a gate spacer structure having two asymmetrical portions. One of the asymmetrical portions is formed on the first sidewall of the gate structure, and the other asymmetrical portion is formed on the second sidewall of the gate structure. The semiconductor device includes a source region and a drain region formed in the semiconductor substrate and aligned with the outer edges of the asymmetrical portions of the gate spacer structure. In some embodiments, the lateral distance between the drain region and the gate structure is greater than the lateral distance between the source region and the gate structure.

Abstract: A semiconductor device includes a semiconductor die having an active surface, an opposite surface, a vertical sidewall extending between the active surface and the opposite surface, and input/output (I/O) connections disposed on the active surface. A redistribution layer (RDL) is disposed on the active surface of the semiconductor die. A plurality of first connecting elements is disposed on the RDL. A molding compound encapsulates the opposite surface and the vertical sidewall of the semiconductor die. The molding compound also covers the RDL and surrounds the plurality of first connecting elements. An interconnect substrate is mounted on the plurality of first connecting elements and on the molding compound.