Patents by Inventor Yan Wen

Yan Wen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220005771
    Abstract: A semiconductor device and a method of manufacturing the same are provided. The semiconductor device includes an antenna zone and a routing zone. The routing zone is disposed on the antenna zone, where the antenna zone includes a first insulation layer and two or more second insulation layer and a thickness of the first insulation layer is different from that of the second insulation layer.
    Type: Application
    Filed: September 20, 2021
    Publication date: January 6, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Wen Hung HUANG, Yan Wen CHUNG, Wei Chu SUN
  • Publication number: 20220002160
    Abstract: The present application discloses a composite graphite material and a method for preparing the same, a secondary battery, and an apparatus. The composite graphite material includes a core material and a coating layer that coats at least a portion of the surface of the core material, the core material including graphite, and the coating layer including a coating material containing a cyclic structure moiety, wherein the composite graphite material has a weight-loss rate of from 0.1% to 0.55% when the composite graphite material is heated in an atmosphere of an inert non-oxidative gas at a temperature rising from 40° C. to 800° C. The composite graphite material can enhance the gram capability and reduce the expansion rate of an electrode plate, and more preferably, can improve the cycle performance and kinetic performance of a battery as well.
    Type: Application
    Filed: September 15, 2021
    Publication date: January 6, 2022
    Applicant: Contemporary Amperex Technology Co., Limited
    Inventors: Chengdu LIANG, Yuzhen ZHAO, Yan WEN, Qisen HUANG
  • Patent number: 11211325
    Abstract: A semiconductor package may include a first substrate and a second substrate, a redistribution layer (RDL), a first conductive via and a second conductive via. The first substrate has a first surface and a second surface opposite to the first surface. The second substrate has a first surface and a second surface opposite to the first surface. The RDL is disposed on the first surface of the first substrate and the first surface of the second substrate. The first conductive via passes through the RDL and is electrically connected to the first substrate. The second conductive via passes through the RDL and is electrically connected to the second substrate.
    Type: Grant
    Filed: November 26, 2019
    Date of Patent: December 28, 2021
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Wen Hung Huang, Yan Wen Chung, Min Lung Huang
  • Publication number: 20210361654
    Abstract: The present disclosure relates generally to treatment and diagnosis of diseases, disorders or conditions characterized by vascular leakage. More particularly, the present disclosure relates to methods for treating a vascular leakage-associated disease or disorder in a subject; for reducing vascular leakage in a subject; for reducing reactive oxygen species production in a subject; for inducing apoptosis of neutrophils in a subject; and for increasing survival of a subject having a vascular leakage-associated disease or disorder. The methods comprise administering a G9a and/or G9a-like protein (GLP) methyltransferase inhibitor to the subject. The present disclosure further relates to methods for developing a treatment plan for a subject with a vascular leakage-associated disease, disorder or condition, and for identifying a subject as a candidate for treatment of a vascular leakage-associated disease or disorder.
    Type: Application
    Filed: January 29, 2020
    Publication date: November 25, 2021
    Inventors: Xiao-Yan Wen, Anju Philip, Claudia Dossantos, John Marshall
  • Publication number: 20210308351
    Abstract: Disclosed are a method and system for enriching and detecting microorganisms in a biological sample. The method allows the biological sample to be filtered through a polymer-modified substrate. The polymer-modified substrate is highly specific in capturing or separating human-derived nucleated cells, and allows the microorganisms to penetrate through it. During the process, a high level of microorganisms (bacteria, mycoplasmas, fungi, viruses, spores etc.) can be enriched in the sample and thus the interference from nucleated cells such as leukocytes can be reduced.
    Type: Application
    Filed: March 15, 2021
    Publication date: October 7, 2021
    Applicant: Micronbrane Medical Co., Ltd.
    Inventors: Yung Chang, Mengchu Wu, Jheng-Fong Jhong, Yan-Wen Chen, Hau Hung
  • Publication number: 20210301257
    Abstract: The present disclosure describes methods of differentiating cardiomyocyte progenitor cells and mature cardiomyocyte cells from pluripotent stem cells. The methods may include differentiating pluripotent stems cells on a substrate including (i) laminin-511 or 521 and (ii) laminin 221. The mature cardiomyocyte cells produced by the method may form a human heart muscle cell line for use in regenerative cardiology.
    Type: Application
    Filed: April 9, 2021
    Publication date: September 30, 2021
    Inventors: Karl Tryggvason, Yan Wen Yap, Sun Yi, Kristian Tryggvason
  • Patent number: 11127697
    Abstract: A semiconductor device and a method of manufacturing the same are provided. The semiconductor device includes an antenna zone and a routing zone. The routing zone is disposed on the antenna zone, where the antenna zone includes a first insulation layer and two or more second insulation layer and a thickness of the first insulation layer is different from that of the second insulation layer.
    Type: Grant
    Filed: July 10, 2019
    Date of Patent: September 21, 2021
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Wen Hung Huang, Yan Wen Chung, Wei Chu Sun
  • Publication number: 20210280857
    Abstract: The present application discloses a composite graphite material, a secondary battery, an apparatus and a preparation method thereof. The composite graphite material includes a core material and a coating layer coating at least a part of the surface of the core material, the core material including graphite; wherein the absolute value K of zeta potential of the composite graphite material in deionized water with a pH of 7 is at least 20 mV. The use of the composite graphite material provided by the present application can improve the cohesion and bonding force of the negative electrode plate, thereby reducing the cyclic expansion of the secondary battery.
    Type: Application
    Filed: May 25, 2021
    Publication date: September 9, 2021
    Applicant: Contemporary Amperex Technology Co., Limited
    Inventors: Chengdu LIANG, Yuzhen ZHAO, Yan WEN, Qisen HUANG
  • Publication number: 20210175499
    Abstract: The present application provide a silicon-oxygen compound, a preparation method thereof and related secondary battery, battery module, battery pack, and device. The silicon-oxygen compound provided by the present application has a formula of SiOx, in which x satisfies 0<x<2. The silicon-oxygen compound contains both sulfur and manganese element, and the sulfur element is present in an amount of 20 ppm˜300 ppm. The mass ratio of sulfur element to manganese element is from 1.5 to 10.
    Type: Application
    Filed: January 3, 2021
    Publication date: June 10, 2021
    Applicant: Contemporary Amperex Technology Co., Limited
    Inventors: Chengdu LIANG, Yingjie GUAN, Yuzhen ZHAO, Yan WEN, Qisen HUANG
  • Patent number: 11031326
    Abstract: A wiring structure includes an insulating layer and a conductive structure. The insulating layer has an upper surface and a lower surface opposite to the upper surface, and defines an opening extending through the insulating layer. The conductive structure is disposed in the opening of the insulating layer, and includes a first barrier layer and a wetting layer. The first barrier layer is disposed on a sidewall of the opening of the insulating layer, and defines a through hole extending through the first barrier layer. The wetting layer is disposed on the first barrier layer. A portion of the wetting layer is exposed from the through hole of the first barrier layer and the lower surface of the insulating layer to form a ball pad.
    Type: Grant
    Filed: February 26, 2020
    Date of Patent: June 8, 2021
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Wen Hung Huang, Chien-Mei Huang, Yan Wen Chung
  • Publication number: 20210159168
    Abstract: A semiconductor package may include a first substrate and a second substrate, a redistribution layer (RDL), a first conductive via and a second conductive via. The first substrate has a first surface and a second surface opposite to the first surface. The second substrate has a first surface and a second surface opposite to the first surface. The RDL is disposed on the first surface of the first substrate and the first surface of the second substrate. The first conductive via passes through the RDL and is electrically connected to the first substrate. The second conductive via passes through the RDL and is electrically connected to the second substrate.
    Type: Application
    Filed: November 26, 2019
    Publication date: May 27, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Wen Hung HUANG, Yan Wen CHUNG, Min Lung HUANG
  • Publication number: 20210151751
    Abstract: The present application provide a secondary battery and related battery module, battery pack and apparatus. The secondary battery includes a positive electrode plate, a negative electrode plate, a separator and an electrolyte, wherein the secondary battery includes a positive active material selected from one or more of layered lithium nickel cobalt manganese oxide and layered lithium nickel cobalt aluminum oxide, and a negative active material including graphite and silicon-oxygen compound; the delithiation capacity A of the negative electrode film in the voltage range of 0.005V to the delithiation platform voltage and the delithiation capacity B of the negative electrode film in the voltage range of the delithiation platform voltage to 1.2V satisfy: 1A/B2; and when the secondary battery is discharged to a voltage of 2.5V, the voltage U of the negative electrode plate relative to a lithium metal reference electrode satisfies: 0.5VU0.7V.
    Type: Application
    Filed: January 26, 2021
    Publication date: May 20, 2021
    Applicant: Contemporary Amperex Technology Co., Limited
    Inventors: Yingjie GUAN, Yuzhen Zhao, Yan Wen, Qisen Huang, Xin Liu
  • Patent number: 11001807
    Abstract: The present disclosure describes methods of differentiating cardiomyocyte progenitor cells and mature cardiomyocyte cells from pluripotent stem cells. The methods may include differentiating pluripotent stems cells on a substrate including (i) laminin-511 or 521 and (ii) laminin 221. The mature cardiomyocyte cells produced by the method may form a human heart muscle cell line for use in regenerative cardiology.
    Type: Grant
    Filed: July 2, 2014
    Date of Patent: May 11, 2021
    Assignees: NATIONAL UNIVERSITY OF SINGAPORE, BIOLAMINA AB
    Inventors: Karl Tryggvason, Yan Wen Yap, Sun Yi, Kristian Tryggvason
  • Publication number: 20210132170
    Abstract: Exemplary quantitative susceptibility mapping methods, systems and computer-accessible medium can be provided to generate images of tissue magnetism property from complex magnetic resonance imaging data using the Bayesian inference approach, which minimizes a cost function consisting of a data fidelity term and two regularization terms. The data fidelity term is constructed directly from the complex magnetic resonance imaging data. The first prior is constructed from matching structures or information content in known morphology. The second prior is constructed from a region having an approximately homogenous and known susceptibility value and a characteristic feature on anatomic images. The quantitative susceptibility map can be determined by minimizing the cost function. Thus, according to the exemplary embodiment, system, method and computer-accessible medium can be provided for determining magnetic susceptibility information associated with at least one structure.
    Type: Application
    Filed: January 6, 2021
    Publication date: May 6, 2021
    Applicant: CORNELL UNIVERSITY
    Inventors: Yi Wang, Zhe Liu, Youngwook Kee, Alexey Dimov, Yan Wen, Jingwei Zhang, Pascal Spincemaille
  • Publication number: 20210013163
    Abstract: A semiconductor device and a method of manufacturing the same are provided. The semiconductor device includes an antenna zone and a routing zone. The routing zone is disposed on the antenna zone, where the antenna zone includes a first insulation layer and two or more second insulation layer and a thickness of the first insulation layer is different from that of the second insulation layer.
    Type: Application
    Filed: July 10, 2019
    Publication date: January 14, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Wen Hung HUANG, Yan Wen CHUNG, Wei Chu SUN
  • Patent number: 10892213
    Abstract: A wiring structure includes an upper conductive structure, a lower conductive structure, an adhesion layer and at least one outer via. The upper conductive structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The lower conductive structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The adhesion layer is interposed between the upper conductive structure and the lower conductive structure to bond the upper conductive structure and the lower conductive structure together. The outer via extends through at least a portion of the upper conductive structure and the adhesion layer, and electrically connected to the circuit layer of the lower conductive structure.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: January 12, 2021
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Wen Hung Huang, Li-Yu Hsieh, Yan Wen Chung
  • Patent number: 10890641
    Abstract: Exemplary quantitative susceptibility mapping methods, systems and computer-accessible medium can be provided to generate images of tissue magnetism property from complex magnetic resonance imaging data using the Bayesian inference approach, which minimizes a cost function consisting of a data fidelity term and two regularization terms. The data fidelity term is constructed directly from the complex magnetic resonance imaging data. The first prior is constructed from matching structures or information content in known morphology. The second prior is constructed from a region having an approximately homogenous and known susceptibility value and a characteristic feature on anatomic images. The quantitative susceptibility map can be determined by minimizing the cost function. Thus, according to the exemplary embodiment, system, method and computer-accessible medium can be provided for determining magnetic susceptibility information associated with at least one structure.
    Type: Grant
    Filed: April 3, 2018
    Date of Patent: January 12, 2021
    Assignee: Cornell University
    Inventors: Yi Wang, Zhe Liu, Youngwook Kee, Alexey Dimov, Yan Wen, Jingwei Zhang, Pascal Spincemaille
  • Publication number: 20200381369
    Abstract: A wiring structure includes a conductive structure, a surface structure and at least one through via. The conductive structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The surface structure is disposed adjacent to a top surface of the conductive structure. The through via extends through the surface structure and extending into at least a portion of the conductive structure.
    Type: Application
    Filed: August 18, 2020
    Publication date: December 3, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Wen Hung HUANG, Yan Wen CHUNG, Huei-Shyong CHO
  • Patent number: 10790241
    Abstract: A wiring structure includes a conductive structure, a surface structure and at least one through via. The conductive structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The surface structure is disposed adjacent to a top surface of the conductive structure. The through via extends through the surface structure and extending into at least a portion of the conductive structure.
    Type: Grant
    Filed: February 28, 2019
    Date of Patent: September 29, 2020
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Wen Hung Huang, Yan Wen Chung, Huei-Shyong Cho
  • Publication number: 20200279815
    Abstract: A wiring structure includes a conductive structure, a surface structure and at least one through via. The conductive structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The surface structure is disposed adjacent to a top surface of the conductive structure. The through via extends through the surface structure and extending into at least a portion of the conductive structure.
    Type: Application
    Filed: February 28, 2019
    Publication date: September 3, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Wen Hung HUANG, Yan Wen CHUNG, Huei-Shyong CHO