Abstract: A wiring structure includes an insulating layer and a conductive structure. The insulating layer has an upper surface and a lower surface opposite to the upper surface, and defines an opening extending through the insulating layer. The conductive structure is disposed in the opening of the insulating layer, and includes a first barrier layer and a wetting layer. The first barrier layer is disposed on a sidewall of the opening of the insulating layer, and defines a through hole extending through the first barrier layer. The wetting layer is disposed on the first barrier layer. A portion of the wetting layer is exposed from the through hole of the first barrier layer and the lower surface of the insulating layer to form a ball pad.

Abstract: A semiconductor package structure includes a first insulating layer, a first conductive layer, a multi-layered circuit structure, a protection layer, and a semiconductor chip electrically connected to the multi-layered circuit structure. The first insulating layer defines a first through hole extending through the first insulating layer. The first conductive layer includes a conductive pad disposed in the first through hole and a trace disposed on an upper surface of the first insulating layer. The multi-layered circuit structure is disposed on an upper surface of the first conductive layer. The multi-layered circuit structure includes a bonding region disposed on the conductive pad of the first conductive layer and an extending region disposed on the trace of the first conductive layer. The protection layer covers the upper surface of the first insulating layer and the extending region of the multi-layered circuit structure, and exposes the bonding region of the multi-layered circuit structure.

Abstract: A wiring structure includes an insulating layer and a conductive structure. The insulating layer has an upper surface and a lower surface opposite to the upper surface, and defines an opening extending through the insulating layer. The conductive structure is disposed in the opening of the insulating layer, and includes a first barrier layer and a wetting layer. The first barrier layer is disposed on a sidewall of the opening of the insulating layer, and defines a through hole extending through the first barrier layer. The wetting layer is disposed on the first barrier layer. A portion of the wetting layer is exposed from the through hole of the first barrier layer and the lower surface of the insulating layer to form a ball pad.

Abstract: A method and an apparatus for thermal processing of nucleic acid in a thermal profile. The method employs at least a first bath and a second bath, the method further employing a reactor holder for holding reactor(s) accommodating reaction material containing the nucleic acid. The method includes maintaining bath mediums in the baths at two different temperatures; and alternately allowing the reactor(s) to be in the two baths in a plurality of thermal cycles to alternately attain a predetermined high target temperature THT, and a predetermined low target temperature TLT, wherein the bath medium in at least one of the baths is a high thermal conductivity powder.

Abstract: A wiring structure includes a dielectric layer and a first patterned conductive layer on the dielectric layer. The dielectric layer has a first region and a second region. The first patterned conductive layer includes a number of fine conductive lines and a number of dummy conductive structures. The number of conductive lines include a first number of conductive lines on the first region and a second number of conductive lines on the second region, and the number of dummy conductive structures include a first number of dummy conductive structures on the second region. The first number of conductive lines occupy a first area on the first region, and the second number of conductive lines and the first number of dummy conductive structures occupy a second area on the second region. A ratio of the second area to the first area is greater than or equal to about 80%.

Abstract: The present invention discloses an IC test method including the following steps: generating N test patterns; testing each of M chip(s) according to the N test patterns so as to generate N×M records of quiescent DC current (IDDQ) data; generating N reference values according to the N×M records, in which each of the N reference values is generated according to M record(s) of the N×M records, and the M record(s) and the reference value generated thereupon are related to the same one of the N test patterns; obtaining a reference order of the N test patterns according to the N reference values and a sorting rule; reordering the N×M records by the reference order so as to obtain reordered N×M records; generating an IDDQ range according to the reordered N×M records; and determining whether any of the M chip(s) is defective based on the IDDQ range.

Abstract: A wiring structure includes an insulating layer and a conductive structure. The insulating layer has an upper surface and a lower surface opposite to the upper surface, and defines an opening extending through the insulating layer. The conductive structure is disposed in the opening of the insulating layer, and includes a first barrier layer and a wetting layer. The first barrier layer is disposed on a sidewall of the opening of the insulating layer, and defines a through hole extending through the first barrier layer. The wetting layer is disposed on the first barrier layer. A portion of the wetting layer is exposed from the through hole of the first barrier layer and the lower surface of the insulating layer to form a ball pad.

Abstract: The present disclosure relates to a wiring structure and a semiconductor package. The wiring structure comprises a first wiring pattern, a dielectric layer and a dummy structure. The first wiring pattern includes a conductive land having a width W1 and a surface area A, and a conductive trace having a width W2 and electrically connected to the conductive land, wherein ((W1*W2)/A)*100%? about 25%. The dielectric layer covers the first wiring pattern, and the dummy structure is adjacent to the conductive trace.

Abstract: The described invention relates to small molecule therapeutic compounds capable of reducing the incidence of intracerebral hemorrhage and brain microhemorrhages identified using zebrafish and mouse models of intracerebral hemorrhage and brain microhemorrhages.

Abstract: A semiconductor package structure includes a first insulating layer, a first conductive layer, a multi-layered circuit structure, a protection layer, and a semiconductor chip electrically connected to the multi-layered circuit structure. The first insulating layer defines a first through hole extending through the first insulating layer. The first conductive layer includes a conductive pad disposed in the first through hole and a trace disposed on an upper surface of the first insulating layer. The multi-layered circuit structure is disposed on an upper surface of the first conductive layer. The multi-layered circuit structure includes a bonding region disposed on the conductive pad of the first conductive layer and an extending region disposed on the trace of the first conductive layer. The protection layer covers the upper surface of the first insulating layer and the extending region of the multi-layered circuit structure, and exposes the bonding region of the multi-layered circuit structure.

Abstract: The described invention relates to small molecule therapeutic compounds capable of reducing the incidence of intracerebral hemorrhage and brain microhemorrhages identified using zebrafish and mouse models of intracerebral hemorrhage and brain microhemorrhages.

Abstract: The present disclosure describes methods of differentiating cardiomyocyte progenitor cells and mature cardiomyocyte cells from pluripotent stem cells. The methods may include differentiating pluripotent stems cells on a substrate including (i) laminin-511 or 521 and (ii) laminin-221. The cardiomyocyte progenitor cells and mature cardiomyocyte cells produced by the methods may form a human heart muscle cell line for use in regenerative cardiology. Also described are methods of identifying functional cardiomyocyte progenitor cells and their use in therapeutic applications.

Abstract: An apparatus for thermal processing of nucleic acid in a thermal profile. The apparatus employs a reactor holder for holding reactors to accommodate reaction material containing nucleic acid. The apparatus includes at least two baths separated by thermally insulating partition plate(s) where bath mediums are each maintainable at a predetermined temperature; and a transfer means for allowing the reactors to change position once or plurality of times between any two adjacent baths by selectively opening the partition plate(s) and without lifting the reactors out of the baths.

Abstract: Apparatus and method for thermal processing of nucleic acid in a thermal profile is provided. The apparatus employs a reactor holder for holding reactor(s) each accommodating reaction material containing the nucleic acid. The apparatus comprises a first bath; and a second bath, bath mediums in the baths being respectively maintainable at two different temperatures THIGH and TLOW; and a transfer means for allowing the reactor(s) to be in the two baths in a plurality of thermal cycles to alternately attain: a predetermined high target temperature THT, and a predetermined low target temperature TLT, while the apparatus adapts to a temperature-offset feature defined by at least one condition from the group consisting: a) the THT is lower than the THIGH, b) the TLT is higher than the TLOW, and c) the conditions at a) and b).

Abstract: An apparatus for thermally processing reaction material containing nucleic acid is provided. A reaction material is contained in reactors. The apparatus includes a reactor holder for statically holding the reactors; at least two heating means each being maintainable at a user specifiable temperature; and a transport means for positioning the heating means to make a contact with the reactors one at a time for specified duration. The positioning is conductable once or over a plurality of times for thermally processing the reactors between a plurality of temperatures.

Abstract: An apparatus for thermal processing nucleic acid in a thermal profile. The apparatus employs a reactor holder for holding reactor(s) each accommodating reaction material containing the nucleic acid. The apparatus includes a first bath; and a second bath, bath mediums in the baths being respectively maintainable at two different temperatures; and a transfer means for allowing the reactor(s) to be in the two baths in a plurality of thermal cycles to alternately attain: a predetermined high target temperature THT, and a predetermined low target temperature TLT; and reciprocating means to enable relative reciprocating motion between the holder and at least one bath while the reactor(s) is/are placed in the at least one bath, the relative reciprocating motion being executable by shaking the bath or the holder or both.

Abstract: A method and an apparatus for thermal processing of nucleic acid in a thermal profile. The method employs at least a first bath and a second bath, the method further employing a reactor holder for holding reactor(s) accommodating reaction material containing the nucleic acid. The method includes maintaining bath mediums in the baths at two different temperatures; and alternately allowing the reactor(s) to be in the two baths in a plurality of thermal cycles to alternately attain a predetermined high target temperature THT, and a predetermined low target temperature TLT, wherein the bath medium in at least one of the baths is a high thermal conductivity powder.

Abstract: The present disclosure describes methods of differentiating cardiomyocyte progenitor cells and mature cardiomyocyte cells from pluripotent stem cells. The methods may include differentiating pluripotent stems cells on a substrate including (i) laminin-511 or 521 and (ii) laminin-221. The cardiomyocyte progenitor cells and mature cardiomyocyte cells produced by the methods may form a human heart muscle cell line for use in regenerative cardiology. Also described are methods of identifying functional cardiomyocyte progenitor cells and their use in therapeutic applications.

Abstract: The present disclosure relates to a wiring structure and a semiconductor package. The wiring structure comprises a first wiring pattern, a dielectric layer and a dummy structure. The first wiring pattern includes a conductive land having a width W1 and a surface area A, and a conductive trace having a width W2 and electrically connected to the conductive land, wherein ((W1*W2)/A)*100% about 25%. The dielectric layer covers the first wiring pattern, and the dummy structure is adjacent to the conductive trace.

Abstract: A wiring structure includes a dielectric layer and a first patterned conductive layer on the dielectric layer. The dielectric layer has a first region and a second region. The first patterned conductive layer includes a number of fine conductive lines and a number of dummy conductive structures. The number of conductive lines include a first number of conductive lines on the first region and a second number of conductive lines on the second region, and the number of dummy conductive structures include a first number of dummy conductive structures on the second region. The first number of conductive lines occupy a first area on the first region, and the second number of conductive lines and the first number of dummy conductive structures occupy a second area on the second region. A ratio of the second area to the first area is greater than or equal to about 80%.