Abstract: A semiconductor device includes a device; a bonding oxide; and a carrier wafer bonded to the device through the bonding oxide. The carrier wafer includes a device area overlapped by the device in a plan view. The carrier wafer further includes an edge area adjacent to an outermost periphery of the carrier wafer, wherein the edge area has a first thickness. The carrier wafer further includes a non-bonding area between the device area and the edge area, wherein the non-bonding area has a second thickness greater than the first thickness, a first width of the non-bonding area is greater than a second width of the edge area, and the non-bonding area is free of an overhang structure.

Abstract: A pipeline guiding module includes a base, a floating member and a first elastic member. The base has an accommodating hole and a first restraining structure. The floating member is floatingly disposed in the accommodating hole. The first elastic member is disposed along an axial direction of the accommodating hole and sandwiched between the first restraining structure and the floating member. The pipeline guiding module may be applied to a liquid cooling device and a data processing system to offset a bending stress of a pipeline and avoid leakage at a connection between the pipeline and a connector.

Abstract: A data processing device includes a chassis and at least one electronic component. The chassis includes a casing and a tray disposed in the casing. The tray includes a tray body and an operating member pivotally connected to the tray body. The tray body has an accommodating space. When the operating member is located at a closed position, the operating member and the casing are locked, and the at least one electronic component is able to be accommodated in the accommodating space. When the at least one electronic component is removed from the accommodating space, the operating member is able to rotate from the closed position to an opened position located in the accommodating space to be unlocked from the casing, so as to allow the tray to be removed from the casing.

Abstract: A method of manufacturing a semiconductor device includes reducing a thickness of a device wafer bonded to a carrier wafer, wherein the device wafer includes a device, a portion of the carrier wafer beyond the device, in a plan view, is called a non-bonding area, and a portion of the carrier wafer overlapping the device, in the plan view, is called a device area. The method further includes performing an etching process on the non-bonding area of the carrier wafer, wherein the etching process is performed completely outside the device area of the carrier wafer.

Abstract: A bandgap voltage reference circuit comprises a current mirror circuit, a first sub-circuit and an output circuit. The current mirror circuit is coupled between an input source and a ground, is configured to generate a first current, and comprises first and second bipolar junction transistors (BJTs) and a first resistor. The two BJTs' bases are coupled together. The first resistor is coupled between the first BJT's emitter and the ground. The first sub-circuit comprises a transistor coupled to the first BJT's base and collector, comprises a second resistor coupled between the transistor and the ground, and is configured to generate a second current based on the second resistor and a base-emitter potential difference of the second BJT. The output circuit is coupled between the input source and the ground, and is configured to generate an output reference voltage based on the first, second currents and a third resistor.

Abstract: A data processing device includes a chassis and at least one electronic component. The chassis includes a casing and a tray disposed in the casing. The tray includes a tray body and an operating member pivotally connected to the tray body. The tray body has an accommodating space. When the operating member is located at a closed position, the operating member and the casing are locked, and the at least one electronic component is able to be accommodated in the accommodating space. When the at least one electronic component is removed from the accommodating space, the operating member is able to rotate from the closed position to an opened position located in the accommodating space to be unlocked from the casing, so as to allow the tray to be removed from the casing.

Abstract: An engaging mechanism includes a casing, a first engaging member and a second engaging member. The casing has a first engaging recess and a second engaging recess. The first engaging member is slidably disposed in the casing and has a first engaging portion. The second engaging member is rotatably disposed in the casing and has a second engaging portion. When the first engaging member is located at a first lock position, the second engaging member is able to rotate between a second lock position and a second unlock position. When the second engaging member is located at the second unlock position and the first engaging member slides from the first lock position to a first unlock position, the first engaging member pushes the second engaging member to rotate toward the second lock position, such that the second engaging portion blocks the second engaging recess.

Abstract: A method of manufacturing a semiconductor device includes reducing a thickness of a device wafer bonded to a carrier wafer, wherein the device wafer includes a device, a portion of the carrier wafer beyond the device, in a plan view, is called a non-bonding area, and a portion of the carrier wafer overlapping the device, in the plan view, is called a device area. The method further includes performing an etching process on the non-bonding area of the carrier wafer, wherein the etching process is performed completely outside the device area of the carrier wafer.

Abstract: A flexible display, including a stand, a supporting mechanism, a flexible screen, a driving component, a driven component, and a link, is provided. The supporting mechanism is connected to the stand. The flexible screen is attached to the supporting mechanism. The driving component is disposed on the stand. The driven component is disposed on a side of the supporting mechanism distant from the stand. The link has a first end and a second end opposite to the first end. The first end is connected to the driving component, and the second end is connected to the driven component. The driving component drives the driven component through the link to move on a first horizontal plane to drive the supporting mechanism and the flexible screen to transform when the driving component moves between the first horizontal plane and a second horizontal plane that is parallel to the first horizontal plane.

Abstract: An engaging mechanism includes a casing, a first engaging member and a second engaging member. The casing has a first engaging recess and a second engaging recess. The first engaging member is slidably disposed in the casing and has a first engaging portion. The second engaging member is rotatably disposed in the casing and has a second engaging portion. When the first engaging member is located at a first lock position, the second engaging member is able to rotate between a second lock position and a second unlock position. When the second engaging member is located at the second unlock position and the first engaging member slides from the first lock position to a first unlock position, the first engaging member pushes the second engaging member to rotate toward the second lock position, such that the second engaging portion blocks the second engaging recess.

Abstract: A method for detecting positions of wafers includes: rotating a rotation table with a wafer thereon in a first direction at a first speed; detecting a contour of the wafer rotating in the first direction at the first speed to provide contour data; rotating the rotation table in a second direction at a second speed when an aiming feature of the wafer passes the detector in the first direction at the first speed; detecting the contour of the wafer rotating in the second direction at the second speed to provide new contour data; and stopping the rotation of the rotation table and the detection of the wafer according to an accumulation of contour data and corresponding rotation angles, to estimate an eccentric position of the wafer and a position of the aiming feature when the aiming feature passes the detector in the second direction at the second speed.

Abstract: An electronic device including a first body, a supporting member, a second body, and an input assembly is provided. The first body is provided with a front end and a rear end opposite to each other. One terminal end of the supporting member is pivotally connected to the rear end of the first body. The second body is pivotally connected to the other terminal end of the supporting member. The input assembly is rotatably connected to the second body and is suitable for being carried by the first body. When a lower edge of the second body is located at the front end of the first body, the input assembly protrudes out from the front end of the first body.

Abstract: A flexible display, including a stand, a supporting mechanism, a flexible screen, a driving component, a driven component, and a link, is provided. The supporting mechanism is connected to the stand. The flexible screen is attached to the supporting mechanism. The driving component is disposed on the stand. The driven component is disposed on a side of the supporting mechanism distant from the stand. The link has a first end and a second end opposite to the first end. The first end is connected to the driving component, and the second end is connected to the driven component. The driving component drives the driven component through the link to move on a first horizontal plane to drive the supporting mechanism and the flexible screen to transform when the driving component moves between the first horizontal plane and a second horizontal plane that is parallel to the first horizontal plane.

Abstract: A method and an apparatus for detecting positions of wafers. A rotation table, on which the wafer with an aiming feature is disposed, rotates in a direction at a faster speed while a detector detects a periphery of the wafer and provides a controller with a detection result. The rotation table rotates in an opposite direction at a slower speed after the aiming feature passes the detector, while the detector detects the periphery of the wafer and provides the controller with a new detection result. A respective detection result corresponds to a rotation angle. When the aiming feature passes the detector again, the rotation table stops rotating, and the controller computes the eccentric position of the wafer and the position of the aiming feature according to the detection results and their rotation angles. Therefore, the time for detection may decrease.

Abstract: A portable electronic device includes a host, a sliding base, a base plate, a display and a sliding rotating element. The sliding base is disposed on the host and has at least one guiding portion and at least one sliding slot connected to the guiding portion. The base plate is disposed on the sliding base. The display is pivoted on the base plate. The sliding rotating element is fixed to the base plate and is rotatably and slidably connected to the sliding base, and the display and the base plate are configured to rotate or slide on the sliding base along with the sliding rotating element.

Abstract: A portable electronic device includes a host, a sliding base, a base plate, a display and a sliding rotating element. The sliding base is disposed on the host and has at least one guiding portion and at least one sliding slot connected to the guiding portion. The base plate is disposed on the sliding base. The display is pivoted on the base plate. The sliding rotating element is fixed to the base plate and is rotatably and slidably connected to the sliding base, and the display and the base plate are configured to rotate or slide on the sliding base along with the sliding rotating element.

Abstract: An electronic device including a first body, a supporting member, a second body, and an input assembly is provided. The first body is provided with a front end and a rear end opposite to each other. One terminal end of the supporting member is pivotally connected to the rear end of the first body. The second body is pivotally connected to the other terminal end of the supporting member. The input assembly is rotatably connected to the second body and is suitable for being carried by the first body. When a lower edge of the second body is located at the front end of the first body, the input assembly protrudes out from the front end of the first body.

Abstract: A chassis includes a housing, a partition, a movable member and a tray. The housing includes a top plate and a bottom plate, and the top plate is opposite to the bottom plate. An accommodating space is located between the top plate and the bottom plate. The bottom plate has a through hole. The partition is disposed in the accommodating space. The movable member is connected to the partition. The movable member is configured to move between a first position and a second position. The tray includes a latch member. When the movable member is located at the first position and the tray is placed into the accommodating space, the movable member is embedded into the through hole and the latch member engages with the movable member. When the movable member is located at the second position, the movable member disengages from the through hole.

Abstract: A motion guide device includes a ball nut attached onto a shaft and having helical grooves for receiving ball bearing elements, a ball circulating member is engaged with the ball nut and includes a ball circulating channel communicative with the helical groove of the ball nut, and includes an intermediate segment and two end segments, a ball coupler includes two flexible coupling members for engaging with the ball bearing elements, and the ball circulating member includes two opposite helical guide pathways for receiving the flexible coupling members of the ball coupler, and curved relative to the ball circulating member for smoothly guiding the flexible coupling members to move through the ball circulating member.

Abstract: A robot teaching device is suitable for being signal connected to a controller used to control a robot, and includes: a connecting base which includes an enable switch and a first connector, and is connected to the controller by a transmission wire; a motion device which is removably disposed in the connecting base, and includes a second connector connected to the first connector, and a touch screen for displaying plural virtual keys. The motion device will be wirelessly signal connected to the controller, when it is removed from the connecting base, and the touch screen will display the virtual keys. When the motion device is inserted in the connecting base, and the enable switch is not pressed, the first and second connectors will be connected, and the virtual keys will be switched off. The virtual keys will be switched on after the enable switch is kept being pressed.