Abstract: The present application is directed to methods for preparation of carbon materials. The carbon materials comprise enhanced electrochemical properties and find utility in any number of electrical devices, for example, as electrode material in ultracapacitors or batteries.

Abstract: An optical network device includes a substrate, a photonic integrated circuit, a fiber, and a packaging cap. Photonic integrated circuit is disposed on substrate. Fiber is configured to receive a first optical signal and transmit a second optical signal. A first wavelength of first optical signal is different from a second wavelength of second optical signal. Packaging cap is configured to combine fiber with substrate, and is configured to cover photonic integrated circuit and fix fiber, so as to align fiber with photonic integrated circuit, so that an oblique angle is formed between a normal vector of a plane where photonic integrated circuit is located and a direction in which fiber extends. Photonic integrated circuit is configured to receive second optical signal according to oblique angle. Photonic integrated circuit is configured to couple first optical signal to fiber according to oblique angle.

Abstract: An electric knife includes a cutter blade, a handle, and a drive unit and a driven unit mounted inside the handle. The drive unit includes a first movable sleeve. The driven unit includes a second movable sleeve. The cutter blade is set on the second movable sleeve. The drive unit and the driven unit are connected through a link, so that the drive unit can drive the second movable sleeve of the driven unit and the cutter blade to reciprocate along an axis.

Abstract: In some embodiments, a semiconductor wafer testing system is provided. The semiconductor wafer testing system includes a semiconductor wafer prober having one or more conductive probes, where the semiconductor wafer prober is configured to position the one or more conductive probes on an integrated chip (IC) that is disposed on a semiconductor wafer. The semiconductor wafer testing system also includes a ferromagnetic wafer chuck, where the ferromagnetic wafer chuck is configured to hold the semiconductor wafer while the wafer prober positions the one or more conductive probes on the IC. An upper magnet is disposed over the ferromagnetic wafer chuck, where the upper magnet is configured to generate an external magnetic field between the upper magnet and the ferromagnetic wafer chuck, and where the ferromagnetic wafer chuck amplifies the external magnetic field such that the external magnetic field passes through the IC with an amplified magnetic field strength.

Abstract: The present application is generally directed to gas storage materials such as activated carbon comprising enhanced gas adsorption properties. The gas storage materials find utility in any number of gas storage applications. Methods for making the gas storage materials are also disclosed.

Abstract: The present invention provides a motion detecting system, which includes a light source module, a plurality of image sensors and a control unit. The light source module illuminates at least one object. The image sensors respectively detect the object under the light emitted by the light source module to generate a plurality of detection results. The control unit is coupled to the image sensors, and generates a control command according to the detection results.

Abstract: A robot cleaner comprises a first light source, an optical sensor, a processing circuit and a second light source. The first light source emits first light. The optical sensor senses first optical data generated according to the first light. The processing circuit computes a height or an overhang height of an obstacle based on the first optical data. The second light source emits second light. The optical sensor senses second optical data generated according to the second light. The processing circuit determines whether the obstacle exists in the predetermined region or not based on the second optical data.

Abstract: In some embodiments, a method includes receiving a first image and a second image from a stereo camera pair. The method includes selecting a first row of pixels from the rectified image and a set of rows of pixels from the second image and comparing the first row of pixels with each row of pixels from the set of rows of pixels to determine disparity values. The method includes determining a pair of rows of pixels having the first row of pixels and a second row of pixels from the set of rows of pixels. The pair of rows of pixels has an offset no greater than an offset between the first row of pixels and each row of pixels from remaining rows of pixels. The method includes adjusting, based on the offset, the relative rotational position between the first stereo camera and the second stereo camera.

Abstract: Various embodiments of the present application are directed towards a method for forming a flat via top surface for memory, as well as an integrated circuit (IC) resulting from the method. In some embodiments, an etch is performed into a dielectric layer to form an opening. A liner layer is formed covering the dielectric layer and lining the opening. A lower body layer is formed covering the dielectric layer and filling a remainder of the opening over the liner layer. A top surface of the lower body layer and a top surface of the liner layer are recessed to below a top surface of the dielectric layer to partially clear the opening. A homogeneous upper body layer is formed covering the dielectric layer and partially filling the opening. A planarization is performed into the homogeneous upper body layer until the dielectric layer is reached.

Abstract: A method for fabricating an integrated circuit is provided. The method includes depositing a dielectric layer over a conductive feature; etching an opening in the dielectric layer to expose the conductive feature, such that the dielectric layer has a tapered sidewall surrounding the opening; depositing a bottom electrode layer into the opening in the dielectric layer; depositing a resistance switch layer over the bottom electrode layer; patterning the resistance switch layer and the bottom electrode layer respectively into a resistance switch element and a bottom electrode, in which a sidewall of the bottom electrode is landing on the tapered sidewall of the dielectric layer.

Abstract: An apparatus for inserting a seal member into a seal groove includes a tray. The tray includes a holding groove formed in a front surface for containing the seal member. The holding groove is sized and shaped to correspond with the seal groove. A method of installing a seal member into a seal groove includes aligning the holding groove with the seal groove, and applying a pressure to a back surface of the tray, thereby deforming the tray and inserting the seal member into the seal groove.

Abstract: A rotary operator and a rotary switch are disclosed, relating to the technical field of switches. The rotary operator includes a handle, a fastening base, and a pressing component. The fastening base is provided with an accommodation cavity. A transmission end of the handle is inserted in the accommodation cavity and is capable of relatively rotating in the accommodation cavity. The pressing component is sleeved on the transmission end of the handle and is slidably connected to the fastening base. The handle is pushed to move along an axis of the accommodation cavity, so that the pressing component moves relative to the fastening base to be in contact with or be separated from a tripper of a circuit breaker. The rotary operator can reset the tripper of the circuit breaker easily after a switching operation is completed.

Abstract: The present teaching relates to different configurations for facilitating calibration of multiple sensors of different types. A plurality of fiducial markers are arranged in space for simultaneously calibrating multiple sensors of different types. Each of the plurality of fiducial markers has a feature point thereon and is provided to enable the multiple sensors to calibrate by detecting the features points and estimating their corresponding 3D coordinates with respect to respective coordinate systems of the multiple sensors.

Abstract: An operation apparatus for a rotary switch and a rotary switch relate to the field of switch technologies. The operation apparatus for a rotary switch includes a motion member and a fastener having an accommodating cavity. The motion member passes through the accommodating cavity, and the motion member is driven to move in the accommodating cavity and can be switched between a lock position and a working position. The lock position restricts rotation of the motion member. When the motion member is in the working position, a release can be reset under action of the motion member. The operation apparatus for the rotary switch provides for reliable reset of the release.

Abstract: The present application is directed to methods for preparation of carbon materials. The carbon materials comprise enhanced electrochemical properties and find utility in any number of electrical devices, for example, as electrode material in ultracapacitors or batteries.

Abstract: The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip includes a first resistive random access memory (RRAM) element over a substrate. The first RRAM element has a first terminal and a second terminal. A second RRAM element is arranged over the substrate and has a third terminal and a fourth terminal. The third terminal is electrically coupled to the first terminal of the first RRAM element. A reading circuit is coupled to the second terminal and the fourth terminal. The reading circuit is configured to read a single data state from both a first non-zero read current received from the first RRAM element and a second non-zero read current received from the second RRAM element.

Abstract: A bus system is provided. The bus system includes a master device, an enhanced serial peripheral interface (eSPI) bus, an SPI bus, a memory device electrically connected to the master device via the SPI bus, and a plurality of slave devices electrically connected to the master device via the eSPI bus. Each of the slave devices has a pin, and the pins of the slave devices are electrically connected together via a control line. After obtaining program code from the memory device via the master device, a first slave device is configured to decrypt the program code according to a first security code, and transmit the program code decrypted by the first security code to the slave devices via the control line, so that the program code decrypted by the first security code is decrypted in the slave devices according to a decryption sequence.

Abstract: The present application is directed to methods for preparation of carbon materials. The carbon materials comprise enhanced electrochemical properties and find utility in any number of electrical devices, for example, as electrode material in ultracapacitors or batteries.