Abstract: An elevator interactive terminal and an elevator interactive system. The elevator interactive system of the present invention comprises an elevator interactive terminal, configured with a social communication media module, wherein a user is registered as a first registered user in the social communication media module; and a server coupled to a communication bus of an elevator system, configured with the social communication media module and to register an elevator as the second registered user in the social communication media module, wherein, based on the social communication media module, interactive communication is performed between the first registered user on the elevator interactive terminal corresponding to the user and the second registered user on the server corresponding to the elevator.

Abstract: An optical construction (100) includes a lightguide (102), a transmissive reflector (112), and an optical sensor (114). The lightguide (102) includes a first major surface (104) and a second major surface (106) opposite to the first major surface (104). The first major surface (104) includes a first portion (108) and an adjoining second portion (110). The transmissive reflector (112) is disposed adjacent to the first major surface (104) of the lightguide (102). The optical sensor (114) is disposed adjacent to the transmissive reflector (112) opposite to the lightguide (102). The optical sensor (114) is aligned with the first portion (108) of the first major surface (104) of the lightguide (102), such that the optical sensor (114) receives at least a portion of light passing through the first portion (108) of the first major surface (104) and transmitted by the transmissive reflector (112).

Abstract: A semiconductor structure includes a semiconductor fin disposed over a substrate, a metal gate stack disposed over the semiconductor fin, an epitaxial source/drain (S/D) feature disposed over the semiconductor fin and adjacent to the metal gate stack, and a dielectric feature embedded in the semiconductor fin, where a bottom surface of the epitaxial S/D feature is disposed on a top surface of the dielectric feature, and where sidewalls of the epitaxial S/D feature extend to define sidewalls of the dielectric feature.

Abstract: Disclosed in the present application are a signal continuous coverage method, device and apparatus for a target area, and an antenna system.

Abstract: A method for separating and transporting a glass sheet from a glass ribbon includes drawing the glass ribbon along a draw path in a conveyance direction, scoring the glass ribbon with a scoring device, to produce a score line across at least a portion of a width of the glass ribbon, engaging a first edge of the glass ribbon at a first position downstream of the score line in the conveyance direction with a first robotic handling device, engaging a second edge of the glass ribbon at a second position downstream of the score line in the conveyance direction with a second robotic handling device, and synchronously moving the first robotic handling device and the second robotic handling device to bend the glass ribbon about the score line and separate the glass sheet from the glass ribbon.

Abstract: Systems and methods for implementing uplink (UL) gaps to facilitate user equipment (UE) calibration are disclosed herein. A UE determines one or more slot patterns of a slot configuration that is repeated during time division duplex (TDD) communication with a base station. The UE determines a UL gap periodicity (defining periods covering an integer number of repetitions of the slot configuration). The UE then performs UE calibration during one or more semi-persistently configured UL slots of a period of the UL gap periodicity that correspond to UL indication(s) in one or more of a common configuration, a dedicated configuration, and/or a slot format indication (SFI) downlink control information (DCI) for the slot pattern(s) of the slot configuration. Methods of identifying particular semi-persistently configured UL slots of a period to use for the UL gap are also discussed. UL slot indications from dynamic DCI are not used for UL gap purposes.

Abstract: Disclosed is a PD-L1 inhibitor, and specifically disclosed is a compound of formula (I) as a PD-L1 immunomodulator, a pharmaceutically acceptable salt or an isomer thereof.

Abstract: The present disclosure relates to methods for inserting a fastener into a wafer-carrying pod. The system includes a robotic arm with a screw tool assembly disposed at the far end of the robotic arm. The screw tool assembly includes a lower sleeve configured to receive a fastener. A screwdriver is disposed within an upper sleeve of the screw tool assembly, and a motor is provided to rotate the screwdriver. In use, the screw tool assembly is positioned over the fastener so the lower sleeve surrounds the fastener and the screwdriver engages the fastener. The fastener head is received within the lower sleeve, and the screwdriver screws the fastener into the pod.

Abstract: Provided are a resource configuration method, a random access method, a network side device and a terminal. The method comprises: sending first configuration information to a terminal, wherein the first configuration information is first configuration information of a first message that is randomly accessed, and the first message comprises: a preamble and a load; and the first configuration information is used for configuring at least one first resource for sending the preamble and at least one second resource that corresponds to each first resource respectively and is used for sending the load.

Abstract: The present disclosure relates to systems and methods for affixing and/or removing a fastener from a wafer-carrying pod. The system includes a robotic arm with a screw tool assembly disposed at the far end of the robotic arm. The screw tool assembly includes a lower sleeve configured to receive a fastener. A screwdriver is disposed within an upper sleeve of the screw tool assembly, and a motor is provided to rotate the screwdriver. In use, the screw tool assembly is positioned over the fastener so the lower sleeve surrounds the fastener and the screwdriver engages the fastener. The screwdriver unscrews the fastener from the pod, and the fastener head is received within the lower sleeve.

Abstract: A package structure and a method of forming the same are provided. The package structure includes a first die, a second die, a first encapsulant, a second encapsulant, and a conductive terminal. The first die includes a first connector, and the second die includes a second connector. The first encapsulant includes: a first portion, on the second die; a second portion, sandwiched between a first sidewall of the first die and a first sidewall of the second die; and a third portion, covering a second sidewall of the second die. The second encapsulant, laterally encapsulating the first die, the second die and the first encapsulant. The conductive terminal, electrically connected to the first die and the second die through a redistribution layer (RDL) structure. The third portion of first encapsulant is sandwiched between the second sidewall of the second die and the second encapsulant.

Abstract: A method includes: determining whether a first pellicle is to be inspected for inner particles; and in response to the first pellicle being to be inspected: forming a mask layer on a substrate; forming a defocused light path by shifting a mask assembly; exposing the mask layer by defocused light having a focal plane separated from the first pellicle by a distance; taking an image of the substrate; determining whether a threshold value is exceeded by analyzing the image; in response to the threshold value being exceeded, replacing the first pellicle with a second pellicle; and in response to the threshold value not being exceeded, processing production wafers using the first pellicle.

Abstract: A semiconductor device includes a substrate, a first active structure, a first metal gate, a trench, an epitaxy and a back-side conductive via. The first active structure and a second active structure are formed on the substrate and arranged in a first direction. The first metal gate is formed on the first active structures. The trench passes through adjacent two of the first active structure and the second active structure in a second direction. The epitaxy formed on within the trench. The back-side conductive via is formed within the substrate and connecting the epitaxy. The first insulation layer is formed under the first metal gate and extending to a first lateral surface of the back-side conductive via.

Abstract: Semiconductor devices and methods of manufacturing the semiconductor devices are described herein. A method includes forming a gate electrode, a gate electrode contact layer over the gate electrode, forming a dielectric layer over the gate electrode contact layer, and performing an etch through the dielectric layer, the etch forming an opening that exposes the gate electrode contact layer. The method further includes performing a post-etch treatment on the opening formed by the etch process by exposing the opening to a plasma. The method further includes forming gate electrode contacts in the openings after the post-etch treatment by a bottom-up deposition process.

Abstract: A semiconductor package and a manufacturing method for the semiconductor package are provided. The semiconductor package includes a redistribution layer, a semiconductor die, conducting connectors, dummy bumps and an underfill. The semiconductor die is disposed on a top surface of the redistribution layer and electrically connected with the redistribution layer. The conducting connectors are disposed between the semiconductor die and the redistribution layer, and are physically and electrically connected with the semiconductor die and the redistribution layer. The dummy bumps are disposed on the top surface of the redistribution layer, beside the conducting connectors and under the semiconductor die. The underfill is disposed between the semiconductor die and the redistribution layer and sandwiched between the dummy bumps and the semiconductor die. The dummy bumps are electrically floating. The dummy bumps are in contact with the underfill without contacting the semiconductor die.

Abstract: Techniques discussed herein may better ensure efficient fine time tracking during a second cell (SCell) activation procedure by using a tracking reference signal (TRS) that is User Equipment (UE) specific. A primary cell (PCell) may provide a UE with a TRS configuration that includes a UE-specific reference signal (RS) with aperiodicity. In response to receiving a SCell activation command from the PCell, the UE may perform cell activation in accordance with the UE-specific RS. As the delay time for the UE-specific RS may be less than the delay time for a system synchronization block (SSB) from the SCell, use of the UE-specific RS may expedite the cell activation procedure.

Abstract: This application provides a data processing method, a computer device, and a medium. The method is applied to a terminal device including a first client. The first client has a public client key and a private client key. The first client stores encrypted data that is obtained by encrypting the private client key according to an object password. The method includes receiving the object password; decrypting the encrypted data by using the received object password to obtain the private client key; signing the encrypted data based on the private client key to obtain a signature of the encrypted data; and transmitting the public client key, the encrypted data, and the signature of the encrypted data to a cloud device of the first client, the cloud device storing the encrypted data after verifying the encrypted data based on the public client key and the signature of the encrypted data.

Abstract: The invention provides a roadside computing system (RCS), or an edge computing system, for an autonomous vehicle. The RCS comprises a hierarchy of roadside unit (RSU) and an onboard unit (OBU) in an individual vehicle. The RSU comprises a data processing module and a communication module, and is capable of generating guidance information and targeted instructions for individual vehicle. The data processing module of the RSU comprises two processors: an External Object Calculating Module (EOCM) and an AI processing unit. Thus, the RCS utilizes roadside edge computing power and AI models to support autonomous driving for the vehicle. The OBU comprises a data processing module, a communication module, and a vehicle control module, and is capable of generating vehicle-specific targeted instruction for the vehicle based on guidance information and targeted instructions received from RSUs, and controlling the vehicle based on vehicle-specific targeted instruction.

Abstract: Disclosed are a series of benzopyrimidine compounds and a use thereof, and specifically disclosed are compounds represented by formula (II) and pharmaceutically acceptable salts thereof.

Abstract: The present invention provides a process for producing hydrogen iodide. The process includes providing a vapor-phase reactant stream comprising hydrogen and iodine and reacting the reactant stream in the presence of a catalyst to produce a product stream comprising hydrogen iodide. The catalyst includes at least one selected from the group of nickel, cobalt, cobalt halides, iron, nickel oxide, nickel halides, copper, copper oxide, copper halides, cobalt oxide, ferrous chloride, ferric chloride, iron oxide, zinc, zinc oxide, zinc halides, molybdenum, tungsten, magnesium, magnesium oxide, and magnesium halides. The catalyst is supported on a support.