Abstract: A method of manufacturing a semiconductor package structure is provided. The method includes providing a first carrier, forming a patterned buffer layer over the first carrier, forming a first redistribution structure that includes forming a first dielectric layer on the patterned buffer layer, after an electrical testing by applying an electric signal towards the first redistribution structure, removing the first carrier, removing portions of the first dielectric layer, resulting in a patterned first dielectric layer, the patterned first dielectric layer exposing portions of the first circuit layer, removing the exposed portions of the first circuit layer, using the patterned first dielectric layer as a mask, resulting in a patterned first circuit layer, and forming an electric conductor in a recess defined by the patterned first dielectric layer and the patterned first circuit layer.

Abstract: A semiconductor device and a method of forming the same are provided. The semiconductor device includes a substrate, a gate structure, a dielectric structure and a contact structure. The substrate has source/drain (S/D) regions. The gate structure is on the substrate and between the S/D regions. The dielectric structure covers the gate structure. The contact structure penetrates through the dielectric structure to connect to the S/D region. A lower portion of a sidewall of the contact structure is spaced apart from the dielectric structure by an air gap therebetween, while an upper portion of the sidewall of the contact structure is in contact with the dielectric structure.

Abstract: The present application provides constructs comprising a single-domain antibody (sdAb) moiety that specifically recognizes TIGIT. Also provided are methods of making and using these constructs.

Abstract: The present application provides anti-LAG-3 constructs comprising a single-domain antibody (sdAb) that specifically recognizes LAG-3. Also provided are methods of making and using these constructs.

Abstract: Disclosed herein are novel designs of a medical tube for delivering a respiratory gas to a subject in respiratory therapy, wherein the medical tube is in fluid connection with a user interface and a respiratory device. The medical tube has a tubular body, a first rib helically extending along the outer surface of the tubular body, and optionally, a second rib disposed next to the first rib, and optionally, a membrane encapsulating the first and/or second ribs thereby creating a helical space along the outer surface of the tubular body. In some embodiments, the first rib has a lumen and at least one wire disposed outside the lumen. In other embodiments, the first rib is free of any lumen and includes one or more wires extended therethrough. The lumen of the first rib or the helical space created by membrane encapsulation is configured to monitor the temperature, humidity, flow rate or pressure of the respiratory gas or an exhaled/inhaled gas of a subject.

Abstract: A memory structure including a substrate, a first doped region, a second doped region, a first gate, a second gate, a first charge storage structure, and a second charge storage structure is provided. The first gate is located on the first doped region. The second gate is located on the second doped region. The first charge storage structure is located between the first gate and the first doped region. The first charge storage structure includes a first tunneling dielectric layer, a first dielectric layer, and a first charge storage layer. The second charge storage structure is located between the second gate and the second doped region. The second charge storage structure includes a second tunneling dielectric layer, a second dielectric layer, and a second charge storage layer. The thickness of the second tunneling dielectric layer is greater than the thickness of the first tunneling dielectric layer.

Abstract: A mouse pad device is provided. The mouse pad device includes a mouse pad body, a first mouse pad secondary resonant circuit, and a second mouse pad secondary resonant circuit. The first mouse pad secondary resonant circuit receives an external wireless power from a wireless power supply. The second mouse pad secondary resonant circuit receives a relay wireless power from the first mouse pad secondary resonant circuit. The first mouse pad secondary resonant circuit and the second mouse pad secondary resonant circuit are arranged in the mouse pad body. The first mouse pad secondary resonant circuit provides a first wireless power to the mouse device. The second mouse pad secondary resonant circuit provides a second wireless power to the keyboard device according to the relay wireless power.

Abstract: A micro light emitting diode structure including an epitaxial structure, a first insulating layer and a second insulating layer is provided. The epitaxial structure includes a first type semiconductor layer, a light emitting layer and a second type semiconductor layer. The first type semiconductor layer, the light emitting layer and a first portion of the second type semiconductor layer form a mesa. A second portion of the second type semiconductor layer is recessed relative the mesa to form a mesa surface. The first insulating layer covers from a top surface of the mesa to the mesa surface along a first side surface of the mesa, and exposes the second side surface. The second insulating layer directly covers a second side surface of the second portion, wherein a thickness ratio of the first insulating layer to the second insulating layer is between 10 and 50.

Abstract: Provided is a display apparatus including a display panel, multiple antenna electrodes, a dummy electrode, and multiple feed lines. The display panel has a display area. The antenna electrodes are disposed on the display panel and overlap the display area. The dummy electrode is disposed around the antenna electrodes and overlaps the display area. The dummy electrode is electrically separated from the antenna electrodes, and has multiple dummy wire segments whose extension directions intersect each other. The dummy wire segments have multiple breaks. The feed lines are respectively electrically connected to the antenna electrodes. An antenna module is also provided.

Abstract: An electronic package is provided, and the manufacturing method of which is to form a plurality of conductive pillars and dispose an electronic element on a first circuit structure, then cover the plurality of conductive pillars and the electronic element with a cladding layer, and then form a second circuit structure on the cladding layer, so that the plurality of conductive pillars are electrically connected to the first circuit structure and the second circuit structure, and the electronic element is electrically connected to the first circuit structure, where a fan-out redistribution layer is configured in the first circuit structure and the second circuit structure, and at least one ground layer is configured in the second circuit structure. Further, the ground layer includes a plurality of sheet bodies arranged in an array, so that at least one slot is disposed between every two adjacent sheet bodies.

Abstract: A mouse pad suitable for operating with a wireless mouse is provided. The mouse pad includes a first charging circuit, a second charging circuit, a control circuit, a power supply module, a conversion circuit and a main body. The first charging circuit, the second charging circuit and the conversion circuit are each electrically connected to the control circuit, and the power supply module is electrically connected to the conversion circuit. The first charging circuit and the second charging circuit each outputs an electromagnetic energy to the wireless mouse. When the control circuit receives a load current flowing through the first charging circuit and the load current flowing through the second charging circuit, through the control circuit, a power supply current of the power supply module to the first charging circuit and to the second charging circuit are dynamically adjusted.

Abstract: Provided is a display apparatus including a display panel, multiple antenna electrodes, a dummy electrode, and multiple feed lines. The display panel has a display area. The antenna electrodes are disposed on the display panel and overlap the display area. The dummy electrode is disposed around the antenna electrodes and overlaps the display area. The dummy electrode is electrically separated from the antenna electrodes, and has multiple dummy wire segments whose extension directions intersect each other. The dummy wire segments have multiple breaks. The feed lines are respectively electrically connected to the antenna electrodes. An antenna module is also provided.

Abstract: Various examples with respect to synchronization signal block (SSB) raster shift in mobile communications are described. A processor of a user equipment (UE) performs an initial cell search to identify a cell among one or more cells of a wireless communication system. The processor then camps on the identified cell. In performing the initial cell search, the processor scans through a plurality of SSB entries for frequency bands below 3 GHz with a SSB raster spacing and a SSB raster offset frequency that support sub-carrier spacing (SCS) spaced channel raster and 100 kHz channel raster for both 15 kHz SCS and 30 kHz SCS. A minimum channel bandwidth at 5 MHz or higher for 15 kHz SCS or at 10 MHz or higher for 30 kHz SCS is supported. The SSB raster spacing is a common multiple of 15 kHz and 100 kHz. The SSB raster offset frequency for 100 kHz channel raster is a multiple of 30 kHz plus/minus 10 kHz.

Abstract: A metal interconnect structure includes a first metal interconnection in an inter-metal dielectric (IMD) layer on a substrate, a second metal interconnection on the first metal interconnection, and a cap layer between the first metal interconnection and the second metal interconnection. Preferably, a top surface of the first metal interconnection is even with a top surface of the IMD layer and the cap layer is made of conductive material.

Abstract: A method for fabricating metal interconnect structure includes the steps of: forming a first metal interconnection in a first inter-metal dielectric (IMD) layer on a substrate; forming a cap layer on the first metal interconnection; forming a second IMD layer on the cap layer; performing a first etching process to remove part of the second IMD layer for forming an opening; performing a plasma treatment process; and performing a second etching process to remove polymers from bottom of the opening.

Abstract: A mouse pad device is provided. The mouse pad device includes a mouse pad main body, a control module, a first electrical connection circuit and a second electrical connection circuit. The control module is disposed on a first area of a first side of the mouse pad main body. The first electrical connection circuit is electrically connected to the second electrical connection circuit on a second side of the mouse pad main body. The first side of the mouse pad main body and the second side of the mouse pad main body are opposite sides. The first electrical connection circuit and the second electrical connection circuit are each laid along a periphery of a third area of the second side of the mouse pad main body.

Abstract: A mouse pad that is adapted to a wireless charging transmitter and operates in cooperation with a wireless mouse is provided. The mouse pad includes a main body and a secondary resonant coil circuit disposed inside the main body. The secondary resonant coil circuit wirelessly receives a first electromagnetic energy provided by the wireless charging transmitter arranged outside the main body, and then converts the first electromagnetic energy into a working power for the secondary resonant coil circuit. The secondary resonant coil circuit relays the working power, converts the working power into the second electromagnetic energy, and then wirelessly outputs a second electromagnetic energy to the wireless mouse.

Abstract: A mouse pad device is provided. The mouse pad device includes a mouse pad body, a first mouse pad secondary resonant circuit, and a second mouse pad secondary resonant circuit. The first mouse pad secondary resonant circuit receives an external wireless power from a wireless power supply. The second mouse pad secondary resonant circuit receives a relay wireless power from the first mouse pad secondary resonant circuit. The first mouse pad secondary resonant circuit and the second mouse pad secondary resonant circuit are arranged in the mouse pad body. The first mouse pad secondary resonant circuit provides a first wireless power to the mouse device. The second mouse pad secondary resonant circuit provides a second wireless power to the keyboard device according to the relay wireless power.

Abstract: A mouse pad device is provided. The mouse pad device includes a mouse pad main body, a control module, a first electrical connection circuit and a second electrical connection circuit. The control module is disposed on a first area of a first side of the mouse pad main body. The first electrical connection circuit is electrically connected to the second electrical connection circuit on a second side of the mouse pad main body. The first side of the mouse pad main body and the second side of the mouse pad main body are opposite sides. The first electrical connection circuit and the second electrical connection circuit are each laid along a periphery of a third area of the second side of the mouse pad main body.

Abstract: A keyboard device having a wireless charging function and a peripheral device are provided. The keyboard includes a casing module, a processing module, a key module, a first secondary resonant circuit and a second secondary resonant circuit. The processing module is electrically connected to the key module. The first secondary resonant circuit is disposed on a first side of the casing module. The second secondary resonant circuit is disposed on a second side of the casing module.