Abstract: Provided is a display apparatus including a display panel, multiple antenna electrodes, a dummy electrode, and multiple feed lines. The display panel has a display area. The antenna electrodes are disposed on the display panel and overlap the display area. The dummy electrode is disposed around the antenna electrodes and overlaps the display area. The dummy electrode is electrically separated from the antenna electrodes, and has multiple dummy wire segments whose extension directions intersect each other. The dummy wire segments have multiple breaks. The feed lines are respectively electrically connected to the antenna electrodes. An antenna module is also provided.

Abstract: Various examples with respect to synchronization signal block (SSB) raster shift in mobile communications are described. A processor of a user equipment (UE) performs an initial cell search to identify a cell among one or more cells of a wireless communication system. The processor then camps on the identified cell. In performing the initial cell search, the processor scans through a plurality of SSB entries for frequency bands below 3 GHz with a SSB raster spacing and a SSB raster offset frequency that support sub-carrier spacing (SCS) spaced channel raster and 100 kHz channel raster for both 15 kHz SCS and 30 kHz SCS. A minimum channel bandwidth at 5 MHz or higher for 15 kHz SCS or at 10 MHz or higher for 30 kHz SCS is supported. The SSB raster spacing is a common multiple of 15 kHz and 100 kHz. The SSB raster offset frequency for 100 kHz channel raster is a multiple of 30 kHz plus/minus 10 kHz.

Abstract: A metal interconnect structure includes a first metal interconnection in an inter-metal dielectric (IMD) layer on a substrate, a second metal interconnection on the first metal interconnection, and a cap layer between the first metal interconnection and the second metal interconnection. Preferably, a top surface of the first metal interconnection is even with a top surface of the IMD layer and the cap layer is made of conductive material.

Abstract: A method for fabricating metal interconnect structure includes the steps of: forming a first metal interconnection in a first inter-metal dielectric (IMD) layer on a substrate; forming a cap layer on the first metal interconnection; forming a second IMD layer on the cap layer; performing a first etching process to remove part of the second IMD layer for forming an opening; performing a plasma treatment process; and performing a second etching process to remove polymers from bottom of the opening.

Abstract: A mouse pad device is provided. The mouse pad device includes a mouse pad main body, a control module, a first electrical connection circuit and a second electrical connection circuit. The control module is disposed on a first area of a first side of the mouse pad main body. The first electrical connection circuit is electrically connected to the second electrical connection circuit on a second side of the mouse pad main body. The first side of the mouse pad main body and the second side of the mouse pad main body are opposite sides. The first electrical connection circuit and the second electrical connection circuit are each laid along a periphery of a third area of the second side of the mouse pad main body.

Abstract: A mouse pad that is adapted to a wireless charging transmitter and operates in cooperation with a wireless mouse is provided. The mouse pad includes a main body and a secondary resonant coil circuit disposed inside the main body. The secondary resonant coil circuit wirelessly receives a first electromagnetic energy provided by the wireless charging transmitter arranged outside the main body, and then converts the first electromagnetic energy into a working power for the secondary resonant coil circuit. The secondary resonant coil circuit relays the working power, converts the working power into the second electromagnetic energy, and then wirelessly outputs a second electromagnetic energy to the wireless mouse.

Abstract: A mouse pad device is provided. The mouse pad device includes a mouse pad body, a first mouse pad secondary resonant circuit, and a second mouse pad secondary resonant circuit. The first mouse pad secondary resonant circuit receives an external wireless power from a wireless power supply. The second mouse pad secondary resonant circuit receives a relay wireless power from the first mouse pad secondary resonant circuit. The first mouse pad secondary resonant circuit and the second mouse pad secondary resonant circuit are arranged in the mouse pad body. The first mouse pad secondary resonant circuit provides a first wireless power to the mouse device. The second mouse pad secondary resonant circuit provides a second wireless power to the keyboard device according to the relay wireless power.

Abstract: A mouse pad device is provided. The mouse pad device includes a mouse pad main body, a control module, a first electrical connection circuit and a second electrical connection circuit. The control module is disposed on a first area of a first side of the mouse pad main body. The first electrical connection circuit is electrically connected to the second electrical connection circuit on a second side of the mouse pad main body. The first side of the mouse pad main body and the second side of the mouse pad main body are opposite sides. The first electrical connection circuit and the second electrical connection circuit are each laid along a periphery of a third area of the second side of the mouse pad main body.

Abstract: A keyboard device having a wireless charging function and a peripheral device are provided. The keyboard includes a casing module, a processing module, a key module, a first secondary resonant circuit and a second secondary resonant circuit. The processing module is electrically connected to the key module. The first secondary resonant circuit is disposed on a first side of the casing module. The second secondary resonant circuit is disposed on a second side of the casing module.

Abstract: A mouse pad suitable for operating with a wireless mouse is provided. The mouse pad includes a first charging circuit, a second charging circuit, a control circuit, a power supply module, a conversion circuit and a main body. The first charging circuit, the second charging circuit and the conversion circuit are each electrically connected to the control circuit, and the power supply module is electrically connected to the conversion circuit. The first charging circuit and the second charging circuit each outputs an electromagnetic energy to the wireless mouse. When the control circuit receives a load current flowing through the first charging circuit and the load current flowing through the second charging circuit, through the control circuit, a power supply current of the power supply module to the first charging circuit and to the second charging circuit are dynamically adjusted.

Abstract: A keyboard device having a wireless charging function and a peripheral device are provided. The keyboard includes a casing module, a processing module, a key module, a first secondary resonant circuit and a second secondary resonant circuit. The processing module is electrically connected to the key module. The first secondary resonant circuit is disposed on a first side of the casing module. The second secondary resonant circuit is disposed on a second side of the casing module.

Abstract: A method of manufacturing a semiconductor package structure is provided. The method includes providing a first carrier, forming a patterned buffer layer over the first carrier, forming a first redistribution structure that includes forming a first dielectric layer on the patterned buffer layer, after an electrical testing by applying an electric signal towards the first redistribution structure, removing the first carrier, removing portions of the first dielectric layer, resulting in a patterned first dielectric layer, the patterned first dielectric layer exposing portions of the first circuit layer, removing the exposed portions of the first circuit layer, using the patterned first dielectric layer as a mask, resulting in a patterned first circuit layer, and forming an electric conductor in a recess defined by the patterned first dielectric layer and the patterned first circuit layer.

Abstract: A method of manufacturing a semiconductor package structure is provided. The method includes providing a first carrier, forming a patterned buffer layer over the first carrier, forming a first redistribution structure that includes forming a first dielectric layer on the patterned buffer layer, after an electrical testing by applying an electric signal towards the first redistribution structure, removing the first carrier, removing portions of the first dielectric layer, resulting in a patterned first dielectric layer, the patterned first dielectric layer exposing portions of the first circuit layer, removing the exposed portions of the first circuit layer, using the patterned first dielectric layer as a mask, resulting in a patterned first circuit layer, and forming an electric conductor in a recess defined by the patterned first dielectric layer and the patterned first circuit layer.

Abstract: A method of manufacturing a semiconductor package structure is provided. The method includes providing a first carrier, forming a patterned buffer layer over the first carrier, forming a first redistribution structure that includes forming a first dielectric layer on the patterned buffer layer, after an electrical testing by applying an electric signal towards the first redistribution structure, removing the first carrier, removing portions of the first dielectric layer, resulting in a patterned first dielectric layer, the patterned first dielectric layer exposing portions of the first circuit layer, removing the exposed portions of the first circuit layer, using the patterned first dielectric layer as a mask, resulting in a patterned first circuit layer, and forming an electric conductor in a recess defined by the patterned first dielectric layer and the patterned first circuit layer.

Abstract: A semiconductor device package includes a semiconductor device in an encapsulating layer, an electrical conductor for electrical connection of the semiconductor device to an external device, and a redistribution structure for electrical connection between the semiconductor device and the electrical conductor. The redistribution structure includes dielectric layers stacked on each other in a direction extending between the encapsulating layer and the electrical conductor, wherein the dielectric layer most adjacent to the electrical conductor includes a first pattern under the electrical conductor, and circuit layers each corresponding to a respective one of the dielectric layers.

Abstract: Various examples with respect to synchronization signal block (SSB) raster shift in mobile communications are described. A processor of a user equipment (UE) performs an initial cell search to identify a cell among one or more cells of a wireless communication system. The processor then camps on the identified cell. In performing the initial cell search, the processor scans through a plurality of SSB entries for frequency bands below 3 GHz with a SSB raster spacing and a SSB raster offset frequency that support sub-carrier spacing (SCS) spaced channel raster and 100 kHz channel raster for both 15 kHz SCS and 30 kHz SCS. A minimum channel bandwidth at 5 MHz or higher for 15 kHz SCS or at 10 MHz or higher for 30 kHz SCS is supported. The SSB raster spacing is a common multiple of 15 kHz and 100 kHz. The SSB raster offset frequency for 100 kHz channel raster is a multiple of 30 kHz plus/minus 10 kHz.

Abstract: A radiofrequency ablation electrode needle includes at least one first segment and at least two second segments. The at least one first segment and the at least two second segments are exposed on a surface of the needle body. An impedance of the at least one first segment is smaller than an impedance of the at least two second segments and at least one of the at least one first segment is disposed between two immediately adjacent ones of the at least two second segments. Besides, the radiofrequency ablation electrode needle is a monopolar electrode needle.

Abstract: Various examples with respect to synchronization signal block (SSB) raster shift in mobile communications are described. A processor of a user equipment (UE) performs an initial cell search to identify a cell among one or more cells of a wireless communication system. The processor then camps on the identified cell. In performing the initial cell search, the processor scans through a plurality of SSB entries for frequency bands below 3 GHz with a SSB raster spacing and a SSB raster offset frequency that support sub-carrier spacing (SCS) spaced channel raster and 100 kHz channel raster for both 15 kHz SCS and 30 kHz SCS. A minimum channel bandwidth at 5 MHz or higher for 15 kHz SCS or at 10 MHz or higher for 30 kHz SCS is supported. The SSB raster spacing is a common multiple of 15 kHz and 100 kHz. The SSB raster offset frequency for 100 kHz channel raster is a multiple of 30 kHz plus/minus 10 kHz.

Abstract: A method for fabricating metal interconnect structure includes the steps of: forming a first metal interconnection in a first inter-metal dielectric (IMD) layer on a substrate; forming a cap layer on the first metal interconnection; forming a second IMD layer on the cap layer; performing a first etching process to remove part of the second IMD layer for forming an opening; performing a plasma treatment process; and performing a second etching process to remove polymers from bottom of the opening.

Abstract: A method for fabricating metal interconnect structure includes the steps of: forming a first metal interconnection in a first inter-metal dielectric (IMD) layer on a substrate; forming a cap layer on the first metal interconnection; forming a second IMD layer on the cap layer; performing a first etching process to remove part of the second IMD layer for forming an opening; performing a plasma treatment process; and performing a second etching process to remove polymers from bottom of the opening.