Abstract: A composition for removing a photoresist includes about 5 to about 20 percent by weight of an alcoholamide compound, about 15 to about 60 percent by weight of a polar aprotic solvent, about 0.1 to about 6 percent by weight of an additive, and pure water. The alcoholamide compound is chemically structured as follows: where R1 is a hydroxyl group or a hydroxyalkyl group, and R2 is a hydrogen atom or a hydroxyalkyl group.

Abstract: Disclosed are a composition for removing photoresist, a method of removing photoresist and a method of manufacturing a semiconductor device using a composition. The composition may include a ketone compound and a first polar aprotic solvent. The composition may also include the ketone compound and a second polar aprotic solvent. Moreover, the composition may include the first polar aprotic solvent and a second polar aprotic solvent with or without the ketone compound. The first polar aprotic solvent has at least one of an ether compound and an ester compound, and the second polar aprotic solvent has at least one of a sulfur-containing compound and a nitrogen-containing compound.

Abstract: A hydraulic system for construction equipment is provided, which can increase the driving speed of a corresponding working device by making hydraulic fluid of a hydraulic pump, which is added to the hydraulic system having two hydraulic pumps in the construction equipment, join hydraulic fluid on the working device side, and can intercept the supply of hydraulic fluid from the working device side to a traveling apparatus side when the working device and the traveling apparatus are simultaneously manipulated.

Abstract: A composition for removing a photoresist includes about 5 to about 20 percent by weight of an alcoholamide compound, about 15 to about 60 percent by weight of a polar aprotic solvent, about 0.1 to about 6 percent by weight of an additive, and pure water. The alcoholamide compound is chemically structured as follows: where R1 is a hydroxyl group or a hydroxyalkyl group, and R2 is a hydrogen atom or a hydroxyalkyl group.

Abstract: A hydraulic circuit for an excavator is provided, which includes first to third hydraulic pumps, a first traveling control valve and a first boom control valve successively installed along a first center bypass line from a downstream side of the first hydraulic pump, a second traveling control valve and a second boom control valve successively installed along a second center bypass line from a downstream side of the second hydraulic pump, a swing control valve connected between the third hydraulic pump and a swing motor to control the operation of the swing motor in accordance with an external valve switching signal, and a confluence line connected between a third center bypass line and a flow path of the second boom control valve to make hydraulic fluid from the third hydraulic pump join hydraulic fluid in a neutral position of the swing control valve.

Abstract: A composition for removing a photoresist includes about 5 to about 20 percent by weight of an alcoholamide compound, about 15 to about 60 percent by weight of a polar aprotic solvent, about 0.1 to about 6 percent by weight of an additive, and pure water. The alcoholamide compound is chemically structured as follows: where R1 is a hydroxyl group or a hydroxyalkyl group, and R2 is a hydrogen atom or a hydroxyalkyl group.

Abstract: The present inventive concept provides a substrate treating apparatus and an exposing apparatus that a chuck member, a chuck cleaning member including a cleaning tool removing a foreign substance on a substrate loading surface of the chuck member and a tool cleaning member cleaning a cleaning tool are disposed to be adjacent to each other inside a treating room. The present inventive concept also provides a method of cleaning a cleaning tool using a tool cleaning member. According to the above the apparatuses and the method, contamination of a chuck member by a cleaning tool is prevented and a defocus phenomenon caused by a particle on a chuck member during an exposing process can be minimized.

Abstract: A contact hole forming method and a method of manufacturing semiconductor device using the same may include forming a layer on a substrate; anisotropically etching the layer to form a dummy contact hole exposing the substrate; isotropically etching a sidewall of the dummy contact hole to form a contact hole by alternatively and repeatedly supplying an etching solution including a fluoride salt in a low-polarity organic solvent and deionized water to the dummy contact hole. The methods increase reliability of semiconductor memory devices.

Abstract: A cleaning solution for an immersion photolithography system according to example embodiments may include an ether-based solvent, an alcohol-based solvent, and a semi-aqueous-based solvent. In the immersion photolithography system, a plurality of wafers coated with photoresist films may be exposed pursuant to an immersion photolithography process using an immersion fluid. The area contacted by the immersion fluid during the exposure process may accumulate contaminants. Accordingly, the area contacted by the immersion fluid during the exposure process may be washed with the cleaning solution according to example embodiments so as to reduce or prevent defects in the immersion photolithography system.

Abstract: A hydraulic circuit for heavy construction equipment to reduce a speed of a swing apparatus while a working apparatus such as a boom is concurrently operated has a work control valve which controls a working apparatus cylinder; a confluence valve which combines a hydraulic fluid of the second hydraulic pump with the work unit flow path based on a positions switch; a swing control valve which controls the hydraulic swing motor; and a disconnection valve which disconnects the hydraulic fluid supplied to at least one of the swing motors.

Abstract: The present invention provides methods for detecting metal concentration from an area including compounding a solution that includes a metal dissolved by a solvent, and a reagent combined with metal ions dissolved in the solution and referring a difference of absorption rates between a compound of the solvent and reagent and a compound of the solution and reagent. An apparatus for carrying out the processes described herein are also provided.

Abstract: Provided is an apparatus and method for analyzing contaminants on a wafer. The apparatus includes: a wafer holder for supporting a wafer on which contaminants to be analyzed are located, a laser ablation device for irradiating a laser to the wafer to extract a discrete specimen from the wafer, an analysis cell for collecting a discrete specimen from the surface of the wafer by irradiating the laser, and an analysis device connected to the analysis cell for analyzing contaminants from the collected discrete specimen.

Abstract: Provided herein are metal detection reagents including at least one ammonium salt of Formula 1: wherein R1, R2, R3 and R4 are independently selected from the group consisting of hydrogen, C1-30 alkyl and C3-14 aryl, and X? is independently selected from the group consisting of bromide, chloride, iodide, fluoride, nitrate, phosphate and sulfate and methods of using the metal detection reagents to monitor one or more metal ion levels in a solution.

Abstract: In a composition for etching silicon oxide, and a method of forming a contact hole using the composition, the composition which includes from about 0.01 to about 2 percent by weight of ammonium bifluoride, from about 2 to about 35 percent by weight of an organic acid, from about 0.05 to about 1 percent by weight of an inorganic acid, and a remainder of a low polar organic solvent. The composition may reduce damages to a metal silicide pattern that may be exposed in an etching process performed for forming the contact hole.

Abstract: An apparatus and method for removing silicate from a phosphoric acid solution, including a treating unit, a regeneration line coupled to the treating unit, an additive solution supply member in communication with the regeneration line to decrease the temperature of the phosphoric acid solution and the concentration of the phosphoric acid therein, a filter in communication with the regeneration line to remove precipitated silicate particles, and a heating member having a heater and a vaporizing chamber to remove the additive.

Abstract: A cleaning composition is disclosed. The cleaning composition comprises about 80 to 99.8999 percent by weight of an ammonium fluoride aqueous solution, about 0.1 to 5 percent by weight of a buffering agent, and about 0.0001 to 15 percent by weight of a corrosion-inhibiting agent. A method of preparing the cleaning composition, a method of cleaning a substrate using the cleaning composition, and a method of manufacturing a semiconductor device using the cleaning composition are also disclosed.

Abstract: A composition for removing a photoresist includes about 5 to about 20 percent by weight of an alcoholamide compound, about 15 to about 60 percent by weight of a polar aprotic solvent, about 0.1 to about 6 percent by weight of an additive, and pure water. The alcoholamide compound is chemically structured as follows: where R1 is a hydroxyl group or a hydroxyalkyl group, and R2 is a hydrogen atom or a hydroxyalkyl group.

Abstract: In an embodiment, a cleaning apparatus and method can prevent adsorption of nano-size particles by wafers. The apparatus includes a cleaning chamber for filling with a cleaning solution for cleaning an object and a drying chamber disposed over the cleaning chamber for drying the object by supplying drying fluid from an upper part. It also includes a transferring unit for transferring the object by moving it between the cleaning and drying chambers. Further, it includes a moveable exhaust plate disposed between the drying chamber and the cleaning chamber for dividing the two chambers and for exhausting the drying fluid supplied to the drying chamber. The drying fluid flows in a uniform laminar flow in the drying chamber.

Abstract: In one embodiment, a sample of chemical solution is provided. A first optical property of the sample is detected at a first wavelength and an expected optical property is predicted at a second wavelength, using the first optical property. A second optical property of the sample is detected at the second wavelength. The second optical property is compared with the expected optical property to measure a contamination level of a particular contaminant in the sample.

Abstract: A cylinder cushion device is provided for a hydraulic cylinder of an excavator, to prevent a piston from colliding with an end boss and absorb shock due to collision. Pressure higher than design strength of the hydraulic cylinder does not occur even if external force is given to the hydraulic cylinder. The cylinder cushion device includes a tube constituting a receiving chamber of hydraulic oil, a rod performing straight line motion, a piston fixed onto the rod and dividing the receiving chamber of the tube, an end boss, a cushion sleeve provided on the rod to be adjacent to the piston, for generating a predetermined cushion pressure inside the rod-side chamber if the piston is adjacent to the end boss during straight line motion of the rod, and an elastic body provided on the cushion sleeve for preventing the piston from colliding with the end boss and absorbing shock by means of its elasticity.