Abstract: A hydrogen sensor and preparation method therefor, and a method for implementing hydrogen detection using the hydrogen sensor. The hydrogen sensor comprises an elastic substrate and a hydrogen sensitive material-based nanofilm positioned on the elastomeric substrate. The preparation method for the hydrogen sensor comprises the following steps: mixing a liquid elastomeric material and a curing agent, and uniformly stirring the mixture to obtain a mixed liquid, wherein the mass ratio of the liquid elastomeric material to the curing agent is 5:1-20:1; removing bubbles in the mixed liquid; drying and curing the mixed liquid in which bubbles are removed to obtain an elastomeric substrate; and depositing a hydrogen sensitive nanomaterial on the elastomeric substrate to form a hydrogen sensitive material-based nanofilm. The hydrogen sensor and the method for implementing hydrogen detection using the hydrogen sensor feature high sensitivity and simple production.

Abstract: Various embodiments of the present disclosure are directed towards a semiconductor structure including a first through substrate via (TSV) within a substrate. The first TSV comprises a first doped region extending from a top surface of the substrate to a bottom surface of the substrate. A conductive via overlies the top surface of the substrate and is electrically coupled to the first TSV.

Abstract: A system and methods are disclosed for producing compression-molded components having one or more desired characteristics with respect to one or more objectives. In accordance with one embodiment, a parameter space comprising a set of values of a parameter is defined, where the parameter corresponds to a property of fiber bundles, and where the set of values represents all possible values of the parameter in the parameter space. The parameter space is narrowed, and a statistical model is generated based on a sampling of the narrowed parameter space. A value of the parameter is selected based on the statistical model, and a bundle of fibers conforming to the selected value is produced. A component comprising the bundle of fibers is then manufactured using a compression-molding process.

Abstract: Various embodiments of the present application are directed towards a semiconductor packaging device including a shield structure configured to block magnetic and/or electric fields from a first electronic component and a second electronic component. The first and second electronic components may, for example, be inductors or some other suitable electronic components. In some embodiments, a first IC chip overlies a second IC chip. The first IC chip includes a first substrate and a first interconnect structure overlying the first substrate. The second IC chip includes a second substrate and a second interconnect structure overlying the second substrate. The first and second electronic components are respectively in the first and second interconnect structures. The shield structure is directly between the first and second electronic components.

Abstract: There is provided a method including determining, at a functional entity of a core network, whether policy requests associated with at least one address used within a session are allowed for the session and, if so, configuring a first associated functional entity of the core network to provide at least one address used within the session for a user equipment associated with the session, receiving the at least one address from the first associated functional entity and providing the at least one address to a second associated functional entity of the core network for storage.

Abstract: Various embodiments of the present disclosure are directed towards an integrated circuit (IC) including a first through substrate via (TSV) within a first semiconductor substrate. The first semiconductor substrate has a front-side surface and a back-side surface respectively on opposite sides of the first semiconductor substrate. The first semiconductor substrate includes a first doped channel region extending from the front-side surface to the back-side surface. The first through substrate via (TSV) is defined at least by the first doped channel region. A first interconnect structure on the front-side surface of the first semiconductor substrate. The first interconnect structure includes a plurality of first conductive wires and a plurality of first conductive vias, and the first conductive wires and the first conductive vias define a conductive path to the first TSV.

Abstract: A method, apparatus and system provides the ability to edit a raster sketch. An edit gesture is received and a binary image of the raster sketch is calculated by thresholding. A stroke width transform (SWT) map is calculated and stores a stroke width value for each pixel. An original outside contour of the binary image is calculated and simplified. A propagation cut is determined as a line segment that connects two different points on the simplified contour that separates the simplified outside contour into two parts. The propagation cut is applied to the original outside contour and displayed.

Abstract: A software upgrade method and system which relate to the field of communications technologies. The method is applied to an evolved core packet (EPC) system. The EPC system includes a system manager, a traffic decider, a first service server, and a second service server, and the first service server and the second service server are installed with service software of a first version. As a result, service continuity and stability of the EPC system are ensured.

Abstract: A display device and a flexible OLED panel. The flexible OLED panel includes: a flexible substrate, and OLED light emitting elements on the substrate. The OLED light emitting elements include pixel circuits and functional layers including anodes disposed above the pixel circuits. The flexible OLED panel further includes pixel unit regions and non-pixel unit regions. The pixel unit regions are arranged in an array, the non-pixel unit regions are disposed between adjacent pixel unit regions. At least one of the anodes, and corresponding transistors in the pixel circuits are located in one pixel unit region, respective transistors in the adjacent pixel unit regions are connected via electrical connection lines, so that the electrical connection lines pass through at least one non-pixel unit region, and a portion of the electrical connection lines in the at least one non-pixel unit region is coated by an organic film layer.

Abstract: A method, apparatus, and machine readable non-transitory storage medium for a SDCI pull and push mode optimization are provided, which comprise synchronizing a caching timer and an allowed delay between a Policy and Charging Enforcement Function (PCEF) and a Packet Flow Description Function (PFDF); comparing the caching timer and the allowed delay; and pushing an updated Packet Flow Description (PFD) from the PFDF to the PCEF based on a result of the comparing.

Abstract: The disclosure discloses a display panel and a display device, and there is at least one abnormally shaped region in a display region of the display panel, and sub-pixels located in the abnormally shaped region are arranged in a step-like distribution, where at least opening regions of sub-pixels at the edges of the steps have a deflection angle of more than 0 degree and less than 180 degrees relative to opening regions of sub-pixels which are not located at the steps.

Abstract: In a method of manufacturing a semiconductor device, a first fin structure for an n-channel fin field effect transistor (FinFET) is formed over a substrate. An isolation insulating layer is formed over the substrate such that an upper portion of the first fin structure protrudes from the isolation insulating layer. A gate structure is formed over a part of the upper portion of the first fin structure. A first source/drain (S/D) epitaxial layer is formed over the first fin structure not covered by the gate structure. A cap epitaxial layer is formed over the first S/D epitaxial layer. The first S/D epitaxial layer includes SiP, and the cap epitaxial layer includes SiC with a carbon concentration is in a range from 0.5 atomic % to 5 atomic %.

Abstract: This invention relates to a method for Core Network (CN) controlled traffic transmission in a dual/multiple-connectivity system. The method comprises the following steps: receiving a request containing information about a status of dual/multiple connectivity from the radio access network node; determining and providing a policy on a usage of dual/multiple connectivity to the radio access network node. This invention also relates to a system of Core Network (CN) controlled traffic transmission for a dual/multiple-connectivity, an apparatus for Core Network (CN) controlled traffic transmission in a dual/multiple-connectivity system and a non-transitory computer-readable medium with executable instructions for executing the method.

Abstract: The present invention provides compounds useful as modulators, agonists or antagonists of androgen receptor (AR), compositions thereof, and methods of making and using the same.

Abstract: Various embodiments of the present disclosure are directed towards an integrated circuit (IC) including a first through substrate via (TSV) within a first semiconductor substrate. The first semiconductor substrate has a front-side surface and a back-side surface respectively on opposite sides of the first semiconductor substrate. The first semiconductor substrate includes a first doped channel region extending from the front-side surface to the back-side surface. The first through substrate via (TSV) is defined at least by the first doped channel region. A first interconnect structure on the front-side surface of the first semiconductor substrate. The first interconnect structure includes a plurality of first conductive wires and a plurality of first conductive vias, and the first conductive wires and the first conductive vias define a conductive path to the first TSV.

Abstract: Embodiments of the present invention provide a communication data processing method, an apparatus, and a system. A communication data processing method includes: acquiring, by a processing apparatus, a data distribution policy, where the data distribution policy includes storage information of a storage apparatus, where the storage apparatus is configured to store context information of a user equipment UE; and saving, by the processing apparatus, context information of a UE into the storage apparatus according to the data distribution policy, or acquiring context information of a UE from the storage apparatus according to the data distribution policy. In this case, a service of the UE may be resumed according to the acquired context information, and uninterrupted service processing is achieved even if the processing network element is faulty or the processing node is faulty, thereby improving security and reliability of processing.

Abstract: The present invention provides compounds useful as modulators, agonists or antagonists of androgen receptor (AR), compositions thereof, and methods of making and using the same.

Abstract: There is provided a method including determining, at a functional entity of a core network, whether policy requests associated with at least one address used within a session are allowed for the session and, if so, configuring a first associated functional entity of the core network to provide at least one address used within the session for a user equipment associated with the session, receiving the at least one address from the first associated functional entity and providing the at least one address to a second associated functional entity of the core network for storage.

Abstract: The present invention relates to antibodies that are heterodimeric and bind human PD-L1 and human TIM-3, and may be useful for treating cancer alone and in combination with chemotherapy and other cancer therapeutics.