Abstract: Leave-on oral care compositions comprising a hyaluronic acid, and a gum-strengthening polyol are provided for promoting Gum Health of a user.

Abstract: Leave-on oral care compositions having good spreadability and improved retention property are provided for promoting Gum Health of a user. Said leave-on oral care compositions comprise a hyaluronic acid or a salt thereof, a polyacrylic acid as a mucoadhesive polymer and an additional polymer.

Abstract: A fuel system, comprising at least one fuel component formed of a steel alloy comprising 0.01-0.31 wt. % carbon, 0.0-0.20 wt. % silicon, 0.15-0.50 wt. % manganese, 0.0-0.015 wt. % phosphorous, 0.0-0.001 wt. % sulfur, 4.80-5.20 wt. % chromium, 4.80-6.20 wt. % nickel, 0.60-0.80 wt. % molybdenum, 0.0-0.550 wt. % vanadium, and 2.000-2.400 wt. % aluminum, wherein the at least one fuel component is configured to come in contact with fuel when fuel is ran through the fuel system.

Abstract: Disclosed herein are system, method, and computer program product embodiments for providing offline capabilities to customizable live applications in a cloud collaboration platform. The cloud collaboration platform may provide offline functions and a data application programming interface to devices connecting to the cloud collaboration platform. The offline capabilities allow devices to store data related to documents and customizable live applications in a local cache. The offline capabilities retrieve data from and store modifications to data within the local cache. The cloud collaboration platform may subsequently process the changes and determine if conflicts arise, resolving conflicts where appropriate and possible. The cloud collaboration platform may then determine a final state for a record, return the final state to the devices, and update the local caches.

Abstract: Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.

Abstract: Disclosed herein are methods of treating a subject having a cancer characterized by a modification at biomarker 1q21, which comprises administering to the subject a therapeutically effective amount of an anti-CD46 antibody.

Abstract: A computing device receives a first user input that includes user selection of a first data field of a data source from a schema information region of a user interface and placement of the first data field into a data visualization region of the user interface. When the first data field corresponds to a geographic data field, the computing device determines longitude and latitude information for data values of the first data field. The computing device generates a map data visualization corresponding to the first data field according to the determined longitude and latitude information. The map data visualization includes a first layer having a first set of data marks corresponding to the first data field. The computing device displays, in the data visualization region, the map data visualization including the first set of data marks.

Abstract: A light-emitting device includes a light-emitting element having a first-type semiconductor layer, a second-type semiconductor layer, an active stack between the first-type semiconductor layer and the second-type semiconductor layer, a bottom surface, and a top surface. A first electrode is disposed on the bottom surface and electrically connected to the first-type semiconductor layer. A second electrode is disposed on the bottom surface and electrically connected to the second-type semiconductor layer. A supporting structure is disposed on the top surface. The supporting structure has a thickness and a maximum width. A ratio of the maximum width to the thickness is of 2-150.

Abstract: A fan-out wafer level package includes a semiconductor die with a redistribution layer on a sidewall of the semiconductor die. A redistribution layer positioned over the die includes an extended portion that extends along the sidewall. The semiconductor die is encapsulated in a molding compound layer. The molding compound layer is positioned between the extended portion of the redistribution layer and the sidewall of the semiconductor die. Solder contacts, for electrically connecting the semiconductor device to an electronic circuit board, are positioned on the redistribution layer. The solder contacts and the sidewall of the redistribution layer can provide electrical contact on two different locations. Accordingly, the package can be used to improve interconnectivity by providing vertical and horizontal connections.

Abstract: Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.

Abstract: A fuel system, comprising at least one fuel component formed of a steel alloy comprising 0.01-0.31 wt.% carbon, 0.0-0.20 wt.% silicon, 0.15-0.50 wt.% manganese, 0.0 - 0.015 wt.% phosphorous, 0.0-0.001 wt.% sulfur, 4.80-5.20 wt.% chromium, 4.80-6.20 wt.% nickel, 0.60-0.80 wt.% molybdenum, 0.0 - 0.550 wt.% vanadium, and 2.000-2.400 wt.% aluminum, wherein the at least one fuel component is configured to come in contact with fuel when fuel is ran through the fuel system.

Abstract: A method generates map visualizations with multiple map layers. A user selects a data source with geographic data. A device displays a data visualization user interface, including a schema information region with data fields, and shelf regions that defining characteristics for a data visualization. The user selects a first geographic data, and the user interface generates a map data visualization using coordinates associated with the first geographic data field. The visualization includes a first plurality of data marks in a first layer. The user selects a second geographic data field. In response, the user interface displays a new layer icon. Upon activation of the new layer icon by the second geographic data field, the user interface superimposes a second layer over the existing map data visualization to form an updated map data visualization. The second layer includes a second plurality of data marks corresponding to the second geographic data field.

Abstract: A light-emitting device includes a light-emitting element having a first-type semiconductor layer, a second-type semiconductor layer, an active stack between the first-type semiconductor layer and the second-type semiconductor layer, a bottom surface, and a top surface. A first electrode is disposed on the bottom surface and electrically connected to the first-type semiconductor layer. A second electrode is disposed on the bottom surface and electrically connected to the second-type semiconductor layer. A supporting structure is disposed on the top surface. The supporting structure has a thickness and a maximum width. A ratio of the maximum width to the thickness is of 2˜150.

Abstract: A photosensitive composition and film prepared from the same are provided. The photosensitive composition includes 100 parts by weight of polyimide, 0.25-50 parts by weight of initiator and 0.25-100 parts by weight of crosslinking agent. The polyimide is a product of a reactant (a) and a reactant (b) via a reaction. The reactant (a) consists of a first dianhydride and a second dianhydride. The molar ratio of the first dianhydride to the second dianhydride is 3:7 to 8:2. The reactant (b) includes a first diamine. The first dianhydride, the second dianhydride and the first diamine are disclosed in the specification.

Abstract: The present disclosure relates to an engineered antibody that co-engages a cell type-selective (or specific) antigen (guide) and a signaling receptor (effector) on a target cell. In some instances, the engineered antibody is capable of modulating a signaling pathway on a target cell. In other embodiments, an engineered antibody of the present disclosure is administered to a subject for the treatment of a disease or condition.

Abstract: A modular multifunctional electronic smoking paraphernalia includes a main body module provided with a slide rod a and a slide rod b, a cigarette holder module provided with a slide groove a, and an atomization module provided with a slide groove b. The cigarette holder module is detachably and slidably connected to the main body module by the slide rod a and the slide groove a. The atomization module is detachably and slidably connected to the main body module by the slide rod b and the slide groove b. In the present invention, the smoking paraphernalia is designed as three detachable modules, namely, the main body module, the cigarette holder module and the atomization module, which is convenient for the smoker to operate.

Abstract: Disclosed herein are system, method, and computer program product embodiments for providing a data model application programming interface (“API”) to customizable live applications in a cloud collaboration platform. The cloud collaboration platform provides data storage, a data model, and an API to embedded third-party live applications to allow the live applications to securely create, store, and access data within the cloud collaboration platform. The data model allows records stored in the cloud collaboration platform to sync independently, merge intelligently, and function offline.

Abstract: The present disclosure provides a curing agent comprising a polyetheramine, a tertiary amine substantially free of an aromatic tertiary amine and glycerin. The curing agent may be combined with an epoxy resin to form a curable composition which is capable of being applied to a substrate and cured to form a cured article.

Abstract: A method for manufacturing a tableware article having a thermal-transfer printed pattern includes the following steps. Firstly, a PET resin composition including 3 to 15% by weight of an inorganic filler is provided. Next, the PET resin composition is granulated to obtain plastic granules. Then, the plastic granules are molded into the tableware article and the tableware article is post-crystallized. Finally, a thermal transfer printed pattern is printed on a surface of the post-crystallized tableware article.

Abstract: A semiconductor element arrangement structure is provided. The semiconductor element arrangement structure includes a carrier substrate, first and second adhesive layers respectively disposed on the carrier substrate and separated from each other, and first and second semiconductor elements disposed on the first and second adhesive layers, respectively. The first semiconductor element has first and second electrodes on the same side of the first semiconductor element, and the second semiconductor element has third and fourth electrodes on the same side of the second semiconductor element. The first adhesive layer is in direct contact with the first and second electrodes, and the second adhesive layer is in direct contact with the third and fourth electrodes. The first adhesive layer has a first width between the first and second electrodes and has a second width not between the first and second electrodes that is less than the first width.