Abstract: Disclosed is an ultra-high frequency AT-cut quartz blank and manufacturing method thereof. The ultra-high frequency AT-cut quartz blank comprises a vibrating blank, an electrode assembly and a connection assembly, one side of the vibrating blank is provided with a first groove; the electrode assembly comprises a first electrode, a connecting blank, and a second electrode; the connection assembly comprises a first connecting electrode and a second connecting electrode, the first connecting electrode is electrically connected to the first electrode, the second connecting electrode is electrically connected to the second electrode and extends to the outer wall of the connecting wafer, so that the first electrode and the second electrode form an inverse piezoelectric effect under the action of an alternating electric field. this disclosure can solve the problem of fragmentation or fragmentation of quartz blank.

Abstract: The present application provided a wafer-level packaged resonator and a preparation method therefor, as well as an electronic equipment, relating to the technical field of resonators. The electronic equipment includes a wafer-level packaged resonator. The wafer-level packaged resonator includes a quartz blank, both sides of which are provided with a first electrode and a second electrode respectively; a first packaging substrate, packaged on one side of the quartz blank provided with the first electrode, and a first solder pad and a second solder pad are provided with intervals on the side of the first packaging substrate away from the quartz blank; a second packaging substrate, packaged on the other side of the quartz blank, and a third solder pad and a fourth solder pad are provided on the side of the second packaging substrate away from the quartz blank.

Abstract: Provided are a wafer-level packaged resonator and a preparation method therefor, as well as an electronic device, relating to the technical field of resonators. The electronic device includes a wafer-level packaged resonator. The wafer-level packaged resonator includes a wafer top cover, a wafer base, and a blank. The blank includes: a resonant part; an assembling part sleeved on the periphery of the resonant part, where the blank is bonded and packaged between the wafer top cover and the wafer base through the assembling part; and at least two connecting parts, connected between the resonant part and the assembling part, respectively, where each connecting part includes at least one continuous bend.

Abstract: This application discloses an electrolysis device with a skid-mounted structure, comprising: at least one skid-mounted unit, a first type electrolytic treatment equipment, connecting pipelines, and connectors, the skid-mounted unit and the first type electrolytic treatment equipment are fixedly mounted on a designated site in sequence according to the flow direction of electrolytic fluid after electrolytic treatment, the distance between the skid-mounted units, and/or between the skid-mounted units and the first type electrolytic treatment equipment, and/or between the first type electrolytic treatment equipment to be connected through the connecting pipelines, are maintained within a set range, two or more said skid-mounted units associated with electrolytic treatment, and/or said skid-mounted units and said first type electrolytic treatment equipment associated with electrolytic treatment, and/or two or more said first type electrolytic treatment equipment associated with electrolytic treatment, are connect

Abstract: Disclosed is an ultra-high frequency AT-cut quartz blank and manufacturing method thereof. The ultra-high frequency AT-cut quartz blank comprises a vibrating blank, an electrode assembly and a connection assembly, one side of the vibrating blank is provided with a first groove; the electrode assembly comprises a first electrode, a connecting blank, and a second electrode; the connection assembly comprises a first connecting electrode and a second connecting electrode, the first connecting electrode is electrically connected to the first electrode, the second connecting electrode is electrically connected to the second electrode and extends to the outer wall of the connecting wafer, so that the first electrode and the second electrode form an inverse piezoelectric effect under the action of an alternating electric field. this disclosure can solve the problem of fragmentation or fragmentation of quartz blank.